NVIDIA’s expansion of the NVIDIA Agent Toolkit with PhysicsNeMo and CUDA-X libraries marks a shift from general-purpose AI assistants toward autonomous engineering systems. Instead of limiting agents to document retrieval, code generation, or workflow automation, the expanded toolkit lets developers connect reasoning… Read More
The AI Genie Is Out of the Bottle and Won’t Go BackThis week, Meta became the fourth major AI…Read More
DAC 2026: Accellera Luncheon Panel on Embracing AI for Advanced Design and VerificationAI was a hot topic at DAC this…Read More
Shift Left with S2C Prodigy: From RTL Verification to Real-World Software ValidationFor modern SoC teams, “shift left” no longer…Read More
How SOCAMM2 Could Reshape Server Memory for AIAs artificial intelligence systems become larger and more…Read MoreSynopsys and Intel Foundry Enable System-Level Design on Intel 14A
Synopsys and Intel Foundry are expanding their collaboration to accelerate customer adoption of Intel 14A, connecting advanced process technology with production-ready electronic design automation, silicon intellectual property, multiphysics analysis, and multi-die integration. Announced at the 2026 DAC Chips to … Read More
DAC 2026: How Undo Makes AI for Chip Design Work Better
DAC was abuzz this year with new AI-fueled approaches to chip design and debug. New tools powered by deeply trained models opened substantial possibilities to deliver higher quality designs much faster, potentially with less resources. Every new technology has its risks. For AI-driven chip design some of those risks center … Read More
ChipAgent Raises $130 Million and Why it Matters
In my 45 years experience in the semiconductor industry, 43 of that in EDA and IP, I have never seen such a meteoric rise of an EDA company. I do remember money being raised for EDA in the early days but never have I seen such a customer success in such a short amount of time.
I first met ChipAgents at DVCon Silicon Valley in 2025. It was an … Read More
CEO Interview with Brendan Emery of iQ Sense
Brendan Emery is Co-Founder and Chief Executive Officer of iQ Sense Technology. He has more than 25 years of international experience in animal health, having held senior commercial leadership roles with organisations including Boehringer Ingelheim and Norbrook Laboratories.
Together with Co-Founder and CTO Madhu Jambunathan,… Read More
CEO Interview with David Reeder from Entegris
David Reeder became president and CEO of Entegris in 2025, with more than 20 years of semiconductor expertise across IDMs, fabless, foundry, systems, and component companies. Most recently, Dave served as Chief Financial Officer at Chewy where he successfully oversaw all financial functions. Prior to that, Dave was Chief Financial… Read More
Podcast EP359: The Benefits of the SiFive Smart Flow™ Technology with David Kravitz
Daniel is joined by David Kravitz, Senior Principal Engineer at SiFive, the pioneer of the RISC- V computing revolution. A veteran silicon architect with decades of experience designing high-performance processors ranging from VAX and Alpha to MIPS and ARM, David led the team behind some of the most critical breakthroughs in… Read More
Intel and TSMC Take Different Paths to High-NA EUV
Intel and TSMC are pursuing the same objective—manufacturing smaller, faster, and more energy-efficient semiconductors—but they have adopted different strategies for advanced lithography. Intel moved early to develop High-Numerical-Aperture Extreme Ultraviolet lithography, commonly called High-NA EUV, while TSMC… Read More
Intel Foundry and the DAC2026 Ecosystem
The Design Automation Conference in Long Beach was a pleasant surprise. It drew strong attendance from leading companies across the semiconductor ecosystem, along with an impressive number of newcomers. AI-focused EDA companies came out in force—and delivered.
Intel Foundry also made its presence felt, reminding everyone… Read More
New Audio SoCs Combine Bluetooth HDT with Dual-RF Technology
Ceva and Actions Technology have expanded their longstanding partnership with the introduction of the ATS296X series, a new family of Bluetooth audio chips designed to bring High Data Throughput technology into commercial wireless products. Powered by the Ceva-Waves Bluetooth HDT platform, the series is positioned as one… Read More


Intel and TSMC Take Different Paths to High-NA EUV