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Connecting the Dots: Why RISC-V System Design Is Entering a New Era

Connecting the Dots: Why RISC-V System Design Is Entering a New Era
by Kalar Rajendiran on 05-04-2026 at 10:00 am

Andes x Arteris Pre Verified and Silicon Proven SoC Integration

At the recent RISC-V Now event hosted by Andes, the discussion underscored the fact that RISC-V is no longer just about instruction set architecture advantages or customizable cores. The real focus has moved up the stack to system-level design. This is where connectivity, integration, and security define whether an innovation… Read More


Rethinking ECAD IT Infrastructure: From Fragmentation to an Engineering Platform

Rethinking ECAD IT Infrastructure: From Fragmentation to an Engineering Platform
by Kalar Rajendiran on 05-04-2026 at 6:00 am

The semiconductor industry is entering a new phase of complexity. Advanced nodes, heterogeneous integration, and AI-driven design workflows are placing unprecedented demands on engineering teams. While much of the focus remains on tools and methodologies, an equally critical constraint is emerging beneath the surface:… Read More


CEO Interview with Geoffrey Rodgers of Chameleon Semiconductor

CEO Interview with Geoffrey Rodgers of Chameleon Semiconductor
by Daniel Nenni on 05-03-2026 at 2:00 pm

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Geoffrey Rodgers spent most of his career at the intersection of semiconductor technology and go-to-market execution, with a focus on scaling businesses and bringing complex solutions to market. He previously led the Analog Go-To-Market motion at Synopsys following the acquisition of Analog Design Automation and held leadership… Read More


Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes

Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes
by Daniel Nenni on 05-01-2026 at 10:00 am

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A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.

Bronco … Read More


IPLM: Future Forward Webinar May 19th

IPLM: Future Forward Webinar May 19th
by Daniel Nenni on 05-01-2026 at 8:00 am

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Step into the future of innovation with the IPLM: Future Forward Webinar—a dynamic, insight-packed event designed for professionals who are ready to rethink how ideas evolve into impact. In a rapidly shifting digital landscape, staying ahead means more than keeping up—it means anticipating change, embracing transformation,… Read More


Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions
by Daniel Nenni on 05-01-2026 at 6:00 am

L.C. Lu TSMC Senior Fellow and Vice President, Research and Development Design & Technology Platform (1)

L.C. leads efforts in design enablement, ensuring that the company can meet the diverse and evolving requirements of its global customer base. Prior to this, he headed the Design and Technology Platform organization starting in 2018.

Since joining TSMC in 2000, Dr. Lu has held multiple leadership positions in design services.… Read More


Solving the EDA tool fragmentation crisis

Solving the EDA tool fragmentation crisis
by Admin on 04-30-2026 at 10:00 am

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By Samar Abd El-Hady and Wael ElManhawy

Design teams today face an uncomfortable truth: the specialized tools they need to verify modern ICs can’t reliably share the same design data. As geometries shrink below five nanometers and designs incorporate billions of transistors across multiple dies, no single Electronic… Read More


Dr. Y.J. Mii on TSMC Technology Leadership in 2026

Dr. Y.J. Mii on TSMC Technology Leadership in 2026
by Daniel Nenni on 04-30-2026 at 8:00 am

Y.J. Mii Executive Vice President and Co Chief Operating Officer, TSMC (1)

Dr. Y.J. Mii joined TSMC in 1994 as a manager at Fab 3 before moving into the company’s research and development organization in 2001. He was appointed Vice President of R&D in 2011 and later advanced to Senior Vice President in November 2016.

Over more than 20 years at TSMC, Dr. Mii has played a central role in advancing and manufacturing… Read More


Advanced Microelectronics Paving the Way for 6G with Alphacore

Advanced Microelectronics Paving the Way for 6G with Alphacore
by Daniel Nenni on 04-30-2026 at 6:00 am

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The world stands at the threshold of a new era in wireless communication as research communities, standards bodies, and technology companies begin shaping what will become sixth generation mobile networks. While fifth generation systems are still expanding across global markets, attention has already shifted toward defining… Read More


Enabling Next-Generation AI Through Advanced Packaging and 3D Fabric Integration

Enabling Next-Generation AI Through Advanced Packaging and 3D Fabric Integration
by Kalar Rajendiran on 04-29-2026 at 10:00 am

CoWoS Enables AI Compute Scaling

The rapid rise of artificial intelligence is fundamentally reshaping computing architectures. As AI models scale toward trillions of parameters, traditional approaches to performance improvement are no longer sufficient. Instead, the industry is entering a new era where system-level innovation, advanced packaging, … Read More