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Threads

CTO Interview with Ed Plowman of Imagination TechnologiesEd Plowman is Chief Technology Officer at Imagination…Read More

Golden Testcases You Can Check With a CalculatorTwo timing tools that agree can still both…Read More

Curvilinear OPC and next-gen photomask optimizationA vector-based approach for semiconductor manufacturing By Sagar…Read More

Who Owns the Voice in Your Head?On May 13, 2024, OpenAI demonstrated GPT-4o, a…Read More

ChipNexus Brings Agentic AI into Established Analog Design FlowsChipNexus has introduced its NEX Analog Agent, bringing…Read More

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ChipAgents AI Verification Webinar Banner

Podcast EP378: An Overview of the 2026 Wilson Research Group Functional Verification Study with Harry Foster

Podcast EP378: An Overview of the 2026 Wilson Research Group Functional Verification Study with Harry Foster
by Daniel Nenni on 11-13-2026 at 12:00 pm
Categories: EDA, Siemens EDA

Daniel is joined by Harry Foster, Chief Scientist of Veriﬁcation for Siemens Digital Industries Software. Harry is also the Co-Founder and Executive Editor for the Veriﬁcation Academy. Harry served as the 2021 Design Automation Conference General Chair and is currently serving as a Past Chair. He holds multiple patents and … Read More

November 13, 2026November 13, 2026

CEO Interview with Sergiy Nesterenko of Quilter on AI PCB Layout

CEO Interview with Sergiy Nesterenko of Quilter on AI PCB Layout
by Daniel Nenni on 11-13-2026 at 9:00 am
Categories: CEO Interviews, EDA, Quilter

Sergiy Nesterenko is founder and CEO of Quilter, which builds physics-driven AI for printed circuit board (PCB) layout. He triple majored in mathematics, physics, and chemistry at UC Berkeley and worked in the electromagnetic interference and compatibility (EMI/EMC) group at SpaceX during the early Falcon 9 era before founding… Read More

November 13, 2026November 13, 2026

Jensen Huang and the Cost of Unchecked Influence

Jensen Huang and the Cost of Unchecked Influence
by Daniel Nenni on 11-13-2026 at 5:00 am
Categories: Semiconductor

As a semiconductor professional with 45 years in the industry, born and raised in Silicon Valley, I’ve followed Nvidia and Jensen Huang from the beginning. Jensen has been my No. 1 semiconductor CEO for many years, and he still is today. My wife and I have met Jensen and his wife, Lori, on several social occasions, and we’ve always … Read More

November 12, 2026November 12, 2026

CTO Interview With Juan Rey, senior VP and general manager of Calibre and CTO of Siemens EDA

CTO Interview With Juan Rey, senior VP and general manager of Calibre and CTO of Siemens EDA
by Daniel Nenni on 11-12-2026 at 12:00 pm
Categories: 3D IC, EDA, Siemens EDA

By Juan Rey, Chief Technology Officer, Siemens

Juan Rey is Head of Technology and Innovation for Electronic Design Automation (EDA) at Siemens and Vice President and General Manager for Calibre. He joined Mentor Graphics, now Siemens EDA, in 2001 and led engineering, research, development, and quality for Calibre before retiring… Read More

November 12, 2026November 13, 2026

What 1,000 Arteris Design Starts Reveal About Semiconductor Innovation

What 1,000 Arteris Design Starts Reveal About Semiconductor Innovation
by Daniel Nenni on 11-12-2026 at 9:00 am
Categories: Arteris, IP

Arteris has surpassed 1,000 customer silicon design starts using its interconnect intellectual property, a milestone that highlights an increasingly consequential shift in chip design: moving data efficiently is becoming as important as processing it.

The company’s November 5 announcement accompanies a report, The State… Read More

November 12, 2026November 11, 2026

Bring Your Innovation to Silicon Valley at DAC 2027

Bring Your Innovation to Silicon Valley at DAC 2027
by Admin on 11-12-2026 at 6:00 am
Categories: Events

DAC 2027 chip showcase in Silicon Valley

The next generation of electronic systems starts with conversations between people solving difficult design challenges. For companies developing EDA tools, semiconductor IP, design services, and supporting technologies, DAC 2027 offers an opportunity to turn those conversations into customer relationships, partnerships,… Read More

November 11, 2026November 11, 2026

CTO Interview Kevin Robinson, VP of Operations, yieldHUB

CTO Interview Kevin Robinson, VP of Operations, yieldHUB
by Daniel Nenni on 11-11-2026 at 12:00 pm
Categories: EDA, yieldHUB

Kevin Robinson is VP of Operations at yieldHUB, where he leads global operations, program delivery, and customer execution. He oversees structured onboarding, customer delivery, and the scalability of yieldHUB’s operations worldwide.

Kevin brings more than 25 years of semiconductor experience across product and test engineering.… Read More

November 11, 2026November 13, 2026

Semiconductors and SOI: From Bulk Wafers to Engineered Substrates

Semiconductors and SOI: From Bulk Wafers to Engineered Substrates
by Lauro Rizzatti on 11-11-2026 at 10:00 am
Categories: FD-SOI, FinFET, GAA, Semiconductor, Soitec

1. Why the substrate matters

Every transistor sits in, or on, a few hundred nanometres of crystal; the rest of the wafer is mechanical support and, often, a liability. Silicon won because it combines a moderate bandgap (1.12 eV), a native oxide (SiO2) of excellent quality, and the ability to be grown as near-perfect single crystals… Read More

November 11, 2026November 10, 2026

NVHBM: Can Custom HBM Change Who Builds the Memory Stack?

NVHBM: Can Custom HBM Change Who Builds the Memory Stack?
by Moh Kolb on 11-11-2026 at 8:00 am
Categories: Semiconductor

NVIDIA’s NVHBM could change more than how memory connects to an AI accelerator. It could also change how the semiconductor industry divides responsibility for designing, manufacturing, and qualifying high-bandwidth memory.

According to October 18 reporting from Seoul Economic Daily, NVIDIA has asked Samsung, SK … Read More

November 11, 2026November 10, 2026

Why Video Processing Matters for the Next Generation of Robots

Why Video Processing Matters for the Next Generation of Robots
by Daniel Nenni on 11-11-2026 at 6:00 am
Categories: AI, Chips&Media, IP

Mobilint has begun mass production of next-generation edge AI chips that incorporate video codec technology from Chips&Media, the companies announced on November 4. The South Korean partners are targeting robotics applications, including humanoids, where several cameras can generate more video than a system can easily… Read More

The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival
would you like to design a Soc Chip by AI?

— beck999 on November 9, 2026
The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival
Great article, and thanks for sharing. The point about seams hit home. Every vendor interface is a place where delays…

— Joel Jorgensen on November 5, 2026
Intel’s Tiny Bridges Could Lead to Very Big Paychecks
When will Intel start to have sales revenue on this?

— Mark Webb on November 2, 2026
High-NA’s Obituary Was Premature
Within each EUV user company, there must be dissent regarding High-NA use, especially within the lithography departments. The depth of…

— Fred Chen on November 1, 2026
TSMC’s Patent and the Harsh Realities of 3D DRAM Competition
If AI needs force memory to be made on the same chip as the AI logic processor, since HBM is…

— Fred Chen on October 30, 2026
Why America’s Semiconductor Manufacturing Capacity Matters
an IP without the ability to manfacture is meaningless. intels struggle are not IDM Struggle but self inflicting injuries aka…

— siliconbruh999 on October 28, 2026
ChipAgent Raises $134Million and Why it Matters
<> Now we can add Rambus to that list - both a customer and an equity investor: https://www.rambus.com/rambus-and-chipagents-collaborate-to-accelerate-chip-design-with-agentic-ai/

— DougDD on October 25, 2026
Why America’s Semiconductor Manufacturing Capacity Matters
The superpower that the US has as an innovator is the ability to bring capital and brilliant people together, and…

— Mark M Stark on October 25, 2026

electronica 2026

SEMICON Europa 2026

SC26

Hardwear.io Security Trainings and Conference NL 2026

China OIP Ecosystem Forum

Podcast EP378: An Overview of the 2026 Wilson Research Group Functional Verification Study with Harry Foster

CEO Interview with Sergiy Nesterenko of Quilter on AI PCB Layout

Jensen Huang and the Cost of Unchecked Influence

CTO Interview With Juan Rey, senior VP and general manager of Calibre and CTO of Siemens EDA

What 1,000 Arteris Design Starts Reveal About Semiconductor Innovation

Bring Your Innovation to Silicon Valley at DAC 2027

CTO Interview Kevin Robinson, VP of Operations, yieldHUB

Semiconductors and SOI: From Bulk Wafers to Engineered Substrates

NVHBM: Can Custom HBM Change Who Builds the Memory Stack?

Why Video Processing Matters for the Next Generation of Robots

Recent Forum Threads

Forensic analysis shows latest Chinese LLMs were trained on Nvidia Blackwell B200/B300

Jensen Huang’s Alleged Ties to a Suspected Chinese Spy: What Could Bring Him Down?

The best solution: NVIDIA merges with AMD, with Lisa Su serving as CEO.

Intel Nova Lake die shots show TSMC N2P being used for compute die, 18A-P for SoC Hub and Peripheral dies

Can Nvidia and Its Taiwanese Suppliers Keep Soaring Without Jensen Huang? CPO Holds the Key

Supermarket Fridge Hacks Signal a Wider Cyber Threat

Musk Says Hiring Jensen Huang Would Be an ‘Honor’

SEMI’s supply chain survey saw the memory shortage four months early. Now it’s quarterly.

TSMC October Revenue Jumps 59.7% as Growth Accelerates

Intel Factory Explosion Update

Recent Article Comments

The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival

The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival

Intel’s Tiny Bridges Could Lead to Very Big Paychecks

High-NA’s Obituary Was Premature

TSMC’s Patent and the Harsh Realities of 3D DRAM Competition

Why America’s Semiconductor Manufacturing Capacity Matters

ChipAgent Raises $134Million and Why it Matters

Why America’s Semiconductor Manufacturing Capacity Matters