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TSMC is introducing an AI Design Kit, or ADK, to help artificial intelligence tools make better use of its semiconductor manufacturing knowledge. The idea is to give AI agents that run chip-design workflows a technology-specific foundation, so they can adjust designs toward performance, power and area targets with less manual… Read More
Wow, OpenAI and Synopsys just announced a multiyear partnership to develop GPT-Synopsys, a specialized artificial intelligence model for semiconductor design. The agreement combines OpenAI’s frontier models with Synopsys’ electronic design automation software and engineering expertise. Its ambition is to help engineers… Read More
In a September 2026 World Economic Forum article, Ali El Kaafarani argues that energy companies should begin preparing their systems for post-quantum cryptography now. The reason is practical: power infrastructure lasts for decades, while replacing its security can take years. Equipment purchased today may still be operating… Read More
I spent a significant part of my career in the ASIC business. This segment of semiconductors has always been challenging, difficult and invigorating. There is something special about delivering a working custom chip that enables your customer to bring a world-changing product to market. It has always been a highly competitive… Read More
The little-known decisions and breakthroughs—and the remarkable role of Robert Noyce—that helped shape the modern semiconductor industry
by Sunil Mehta
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The transistor was invented at Bell Labs. William Shockley… Read More
SiFive and AMD demonstrated an AI workload that brings together two open technologies: the RISC-V processor architecture and AMD’s ROCm GPU software platform. At the AI Infra Summit on September 15, 2026, the companies showed ROCm 10.0 running on SiFive’s BigSky datacenter development server. SiFive P870-D CPUs served as the… Read More
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Next-gen AI accelerators, high-performance processors, and complex computing architectures depend heavily on advanced packaging. Bringing multiple dies, chiplets, high-bandwidth memory, and advanced interconnects together into a single 2.5D or 3D package yields massive performance gains. However, this design evolution… Read More
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