I’ve been working with AMIQ EDA for almost nine years now, writing about their cool technologies and interviewing users about their experiences. I’ve read through more user guides and release notes than I can count. I’ve watched many dozens of video clips showing how to use their products. I’ve even visited their headquarters … Read More
ML-Based Power Models for CPUs. Innovation in VerificationAn effective learned power model for a CPU…Read More
From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap MattersSemiconductor manufacturing has always depended on precise measurement.…Read More
The Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate UpMost of the AI conversation stops at the…Read More
When Nanomagnets Do the Math: France’s New Machine for Impossible ChoicesFrench researchers have demonstrated a hybrid nanoelectronic “Ising…Read More
Ceva’s Next-Generation NeuPro Brings a Unified AI Platform from Sensors to InfrastructureCeva is expanding the reach of its neural…Read MoreAgentic AI accelerates 3D IC engineering for the AI factory era
By Sudarshan Deo, software R&D Manager for 3D IC, Siemens
What if you could completely rethink what an EDA workflow looks like for the increasingly complex 3D ICs powering the next generation of AI factories? Siemens’ expanded agentic AI portfolio is automating the hardest parts of 3D IC engineering.
At NVIDIA GTC Berlin 2026,… Read More
Intel’s Tiny Bridges Could Lead to Very Big Paychecks
Intel’s next big opportunity could come from something that sounds spectacularly unglamorous: connecting tiny pieces of silicon. Advanced packaging rarely attracts the attention lavished on powerful processors or artificial intelligence models. Yet it increasingly determines how effectively those technologies perform.… Read More
CEO Interview with Vera Yang of Flexcompute
Vera Yang is President and Co-Founder of Flexcompute, a frontier AI lab building a Physics World Model that bridges data-driven AI and the laws of physics. She focuses on the problems where the stakes are highest and the physics hardest, including photonic chips for AI data centers, advanced semiconductor packaging and spacecraft… Read More
High-NA’s Obituary Was Premature
High numerical aperture EUV lithography was supposed to be the next step in semiconductor manufacturing. Then came the doubts: expensive scanners, smaller exposure fields, difficult economics and big customers finding ways to stretch existing equipment. It became tempting to confuse a delayed adoption curve with a technology… Read More
CEO Interview with Andrew Seddon of CircuitHub
Andrew Seddon is a British engineer and the co-founder and CEO of CircuitHub. His product design background spans industrial equipment, medical devices and special effects equipment, including work on a motion-capture headset for A Christmas Carol. His experience of working with electronics manufacturers led him to establish… Read More
The Compass: Finding Tomorrow in the Minds of Yesterday
What makes a breakthrough possible? Intelligence, certainly, but also curiosity, persistence and the courage to follow an idea before anyone can see where it leads. Sunil Mehta’s novel The Compass builds its premise around this question. Four students discover a mysterious compass that allows them to travel through time by … Read More
CEO Interview with Peter Jenkins of Infinitesima
As CEO, Peter Jenkins, leads the development and commercialisation of angstrom-scale process control technology, helping semiconductor manufacturers gain deeper process insights, improve yields and enable the next generation of advanced devices.
His international career has also included roles in the Netherlands, South… Read More
CEO Interview with Ram Machness of Arbe
Ram Machness is the Chief Executive Officer at Arbe, a global leader in high-definition radar solutions for autonomous vehicles. He has three decades of experience in the semiconductor and automotive industries. In his previous role at Arbe as Chief Business Officer, he led product strategy and management, forged partnerships
Podcast EP376: Samtec’s Recent Pariticpaion in High-Profile Shows with Matt Burns
Daniel is joined by Matthew Burns. Matt develops go-to-market strategies for Samtec’s Silicon-to-Silicon solutions. Over the course of 25 years, he has been a leader in design, applications engineering, industry standards, technical sales and marketing in the telecommunications, medical and electronic components industries.… Read More


High-NA’s Obituary Was Premature