RVN! 26 Banner revised (800 x 100 px) (600 x 100 px)

NXP Expands Arteris NoC Deployment to Scale Edge AI Architectures

NXP Expands Arteris NoC Deployment to Scale Edge AI Architectures
by Daniel Nenni on 04-09-2026 at 8:00 am

NXP announcement v4b 021026 FINAL

As edge AI systems become more centralized and compute-dense, on-chip data movement is increasingly the architectural bottleneck. NXP’s expanded deployment of Arteris network-on-chip (NoC) and cache-coherent interconnect IP highlights a broader industry trend: interconnect architecture is now a first-order design … Read More


Architecting Intelligence: The Rise of RISC-V CPUs in Agentic AI Infrastructure

Architecting Intelligence: The Rise of RISC-V CPUs in Agentic AI Infrastructure
by Daniel Nenni on 04-09-2026 at 6:00 am

The rise of RISC V CPUs SiFive

SiFive’s newly announced $400 million Series G financing represents a significant technical inflection point for high-performance RISC-V CPU development targeted at agentic AI data center workloads. The funding, which values the company at $3.65 billion, is specifically intended to accelerate next-generation CPU IP, … Read More


Intel, Musk, and the Tweet That Launched a 1000 Ships on a Becalmed Sea

Intel, Musk, and the Tweet That Launched a 1000 Ships on a Becalmed Sea
by Jonah McLeod on 04-08-2026 at 12:00 pm

Intel Terafab SemiWiki

Intel, Musk, and the Tweet That Launched a 1000 Ships on a Becalmed Sea
Why do professional executives running major corporations frame a major moment in their company’s history with a tweet? Jerry Sanders, who passed away just last December, spent his career yelling “real men have fabs!” Now Intel has fabs–and… Read More


From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration

From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration
by Daniel Nenni on 04-08-2026 at 10:00 am

Types of Mutli Deisgn Packaging Synsopsys

Modern automotive electronics are undergoing a rapid transformation driven by increasing compute demands, functional safety requirements, and the shift toward scalable semiconductor architectures. One of the most significant technological developments enabling this transformation is the adoption of multi-die system… Read More


Agentic AI Demands More Than GPUs

Agentic AI Demands More Than GPUs
by Daniel Nenni on 04-08-2026 at 8:00 am

Agentic AI Requires More CPUs

Agentic AI workloads are reshaping the compute requirements of modern data center infrastructure by shifting performance bottlenecks from GPU-centric inference to CPU-heavy orchestration and workflow management. Traditional AI inference pipelines relied primarily on GPUs performing a single forward pass, where input… Read More


Accellera Updates at DVCon 2026

Accellera Updates at DVCon 2026
by Bernard Murphy on 04-08-2026 at 6:00 am

logo accellera

Lu Dai (chair of Accellera) and I had our regular chat at DVCon U.S. 2026. Accellera also hosted a reception in the exhibits hall, with free snacks and drinks, very well attended. We talked about what’s new in Accellera, with a particular emphasis on the recently released standard for CDC and RDC tool interoperability, also Lu’s … Read More


When a Platform Provider Becomes a Competitor: Why Arm’s Silicon Strategy Changes the Incentives

When a Platform Provider Becomes a Competitor: Why Arm’s Silicon Strategy Changes the Incentives
by Admin on 04-07-2026 at 10:00 am

SemiWiki

Marc Evans, Director of Business Development & Marketing, Andes Technology USA

I work at a RISC-V IP company, and I genuinely root for Arm — probably more than most people in my position would admit. Not because I’m confused about who competes with whom, but because Arm’s best move for their shareholders is also… Read More


An Upper Bound on Effective Quantum Computation?

An Upper Bound on Effective Quantum Computation?
by Bernard Murphy on 04-07-2026 at 6:00 am

QC with entanglement ceiling

You may think that quantum theory is fully understood but that view is not quite right. There remain open questions around the uncertainty principle, wave-particle duality, measurement collapse, and harmonizing quantum mechanics and gravitation. These concerns may seem very abstract and irrelevant to everyday applications… Read More


yieldWerx Delivers a Master Class in Co-Packaged Photonics Implementation

yieldWerx Delivers a Master Class in Co-Packaged Photonics Implementation
by Mike Gianfagna on 04-06-2026 at 10:00 am

yieldWerx Delivers a Master Class in Co Packaged Photonics Implementation

We all know the semiconductor industry is seeing a new era of data intensity. The industry’s response includes advanced semiconductor design strategies, the adoption of chiplets, and the integration of optical I/O and photonics to enable higher performance, faster AI computation, and increased modularity. Co-packaged photonics… Read More


RISC-V Has Momentum. The Real Question Is Who Can Deliver

RISC-V Has Momentum. The Real Question Is Who Can Deliver
by Kalar Rajendiran on 04-06-2026 at 6:00 am

RVA23 Momentum (from Andrea Gallo keynote at 2025 RISC V Summit)

RISC-V has momentum. The industry knows it. The harder question is: who can actually deliver when and where it matters?

A Shift That Changes the Stakes

On March 24, 2026, Arm made something explicit: it is now a silicon company. After decades as a neutral IP provider, Arm is moving up the stack. It’s building chips and complete solutions,… Read More