The rapid evolution of automotive technology has intensified the demand for highly reliable, high-performance semiconductor memory solutions. Modern vehicles increasingly rely ADAS driving features, and complex infotainment platforms, all of which require memory that can operate flawlessly under extreme environmental… Read More
Agentic EDA Panel Review Suggests Promise and Near-Term GuidanceNetApp recently hosted a webinar on Agentic AI…Read More
Hardware is the Center of the Universe (Again)The 40-Year Evolution of Hardware-Assisted Verification — From…Read More
Smarter ECOs: Inside Easy-Logic’s ASIC Optimization EngineEasy-Logic Technology Ltd. is a specialized Electronic Design…Read More
The Name Changes but the Vision Remains the Same – ESD Alliance Through the YearsThe Electronic System Design Alliance (ESDA) has been…Read More
TSMC Process Simplification for Advanced NodesIn the modern world, the semiconductor industry stands…Read MoreCEO Interview with Echo Yang of CSCERAMIC
Echo Yang is the CEO of CSCERAMIC, a China-based manufacturer specializing in advanced ceramic materials and precision ceramic components for industrial and laboratory applications. With a background spanning international trade, manufacturing coordination, and engineering-driven supply chain development, Echo leads… Read More
Podcast EP333: A Look at the Broad, Worldwide Impact SEMI Has on the Semiconductor Industry with Ajit Manocha
Daniel is joined by Ajit Manocha, president and CEO of SEMI, the global industry association serving the semiconductor and electronics manufacturing and design supply chain. Throughout his career, Manocha has been a champion of industry collaboration as a critical means of advancing technology for societal and economic prosperity.… Read More
Memory Matters: Signals from the 2025 NVM Survey
Non-volatile memory choices are becoming more complex as SoC designs push into advanced nodes, and new requirements driven by AI, new sensor technologies and stringent quality standards.
The second annual 2025 NVM Survey, completed in December, captures a market that still hangs on established technologies but is increasingly… Read More
AI Drives Strong Semiconductor Market in 2025-2026
The global semiconductor market in 2025 was $792 billion, according to WSTS. 2025 was up 25.6% from 2024, the strongest growth since 26.2% in the COVID recovery year 2021. The increase was driven by AI, with Nvidia revenues up 65%. The major memory companies (Samsung, SK Hynix, Micron Technology, Kioxia and Sandisk) all cited AI… Read More
How Customized Foundation IP Is Redefining Power Efficiency and Semiconductor ROI
As computing expands from data centers to edge devices, semiconductor designers face increasing pressure to optimize both performance and energy efficiency. Advanced process nodes continue to provide transistor-level improvements, but scaling alone cannot meet the demands of hyperscale AI infrastructure or ultra-low-power… Read More
Akeana Partners with Axiomise for Formal Verification of Its Super-Scalar RISC-V Cores
An AI-Native Architecture That Eliminates GPU Inefficiencies
A recent analysis highlighted by MIT Technology Review puts the energy cost of generative AI into stark perspective. Generating a simple text response from Llama 3.1-405B—a model with 405 billion parameters, the adjustable “knobs” that enable prediction—requires on average 3,353 joules, nearly 1 watt-hour (Wh). Once cooling… Read More
Caspia Technologies Unveils A Breakthrough in RTL Security Verification Paving the Way for Agentic Silicon Security
In a significant advancement for the semiconductor industry, Caspia Technologies announced the broad availability of CODAx V2026.1, its flagship RTL security analyzer. The new release strengthens early-stage hardware security verification and positions the company to deliver fully agentic workflows that automate vulnerability… Read More
Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering
At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence. As the semiconductor industry shifts rapidly toward chiplet-based architectures and 3D stacking, the complexity of design, verification, and system integration… Read More


Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability