All-Embracing Multiphysics Analysis for Chiplet-Based SystemsWhat systems can accomplish by combining semiconductors, AI,…Read More
How Samtec Blazes a Trail to 224/448 Gbps at DesignCon 26I recently covered what Samtec was doing at…Read More
Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume FabsA deposition chamber drops out of production at…Read More
AION Silicon: Architecting Smarter SoCs with RISC-V: Balancing Performance, Flexibility, and Risk Architecting Smarter SoCs with…Read More
AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoptionSystems-in-package (SIPs) with 2.5D and 3D heterogenous integration,…Read More
It has recently been revealed that the N5 node from TSMC has a minimum gate pitch of 51 nm [1,2] with a channel length as small as 6 nm [2]. Such a tight channel length entails tight CD control in the patterning process, well under 0.5 nm. What are the possible lithography scenarios?
A state-of-the-art
Recently TechInsights analyzed a Bitcoin Miner chip fabbed at SMIC and declared SMIC has a 7nm process. There has been some debate as to whether the SMIC process is really 7nm and what it means if it is 7nm. I wanted to discuss the case for and against the process being 7nm, and what I think it means.
First off, I want to say I am not going … Read More
It’s all around us. The pervasive use of AI is changing our world. From planetary analysis of weather patterns to monitoring your vital statistics to assess health, it seems as though smart everything is everywhere. Much has been written about the profound impact AI is having on our lives and society. Everyone seems to agree that… Read More
The exponential increase in design complexity is a popular topic these days. In fact, it’s been a topic of discussion for a very long time. The explosion of chip and system design complexity over the past ten years has become legendary and haunts many of us daily. A lot of the complexity we face has to do with coordinating across an ever-increasing… Read More
Lauro Rizzatti offers Semiwiki readers a two-part series on why three kinds of hardware-assisted verification engines are now a must have for semiconductor designs continues today. His interview below with Juergen Jaeger, Prototyping Product Strategy Director in the Scalable Verification Solution division at Siemens EDA,… Read More
The CHIPS and Science Act has its fair share of critics, with detractors calling it corporate welfare for “losers” like Intel, or lacking guardrails to prevent companies making legacy chips in China.
One of the most vocal opponents of the act has been China’s communist-ruled government.
Good story telling is what helps drive change, engage consumers, and define progress. Steve Newberry, CEO of Quu, is a master of the craft.
He told two stories, in particular, at the Michigan Association of Broadcasters event last week in Traverse City, Mich. The first story was to simply note for the broadcasters in attendance
Dan is joined by Brandon Bautz, senior group director of product management responsible for silicon signoff and verification product lines in the Cadence Digital & Signoff Group. Brandon has more than 20 years of experience in chip design and the EDA industry and has been at Cadence for over 10 years.
Dan explores the current… Read More
-Where are we in the chip cycle? Why is it different this time?
-No one rings a bell to indicate the top or bottom of a cycle
-Could the lack of self-awareness lead to a worse downturn?
-Who will weather the cycle better & come out on top
The last few years have seen multiple disruptions in the supply chain in many industries. One of the key technologies that many fingers have pointed to is the semiconductor technology. As products in all industries become more electronics based, semiconductors play a key role since no end system could function today without … Read More
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Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?