Panel Discission: Beyond Moore's Law and the Future of Semiconductor ManufacturingThe semiconductor industry is entering a post-Moore’s Law…Read More
CEO Interview with Dave Kelf, CEO of Breker Verification SystemsIn the functional verification space, Breker Verification Systems stands…Read More
RISC-V: From Niche Architecture to Strategic FoundationAt the recent RISC-V Now by Andes conference,…Read More
Bringing mathematical rigour in the world of hardware - a journey into Formal VerificationThis interview presents the first steps of Robert…Read More
The Great Divide: A Tale of Three Hardware Emulation ArchitecturesHardware emulation arose as a necessity out of…Read More
Pat Brockett is a veteran of the global semiconductor industry. He began his career in sales and marketing at Texas Instruments. After that, he was senior vice president of worldwide sales and marketing at National Semiconductor. Subsequently, he headed the analog division and is credited with turning it around.
Later, he was… Read More
If you have anything to do with the semiconductor industry, you already know that one of the hottest areas for both manufacturing and EDA are systems designed with advanced packaging, basically putting more than one die (aka chiplets) in the same package.
When 3D packaging was first introduced, there were not really any effective… Read More
Anyone who has read my previous IEDM articles will know I view it as one of the best conferences on semiconductor process technology. From the tutorials, short courses and the conference papers there are so many great opportunities to keep up to date on the latest developments. The following are the conference organizers’ announcements… Read More
Semiconductor IP design re-use has enabled the relentless growth in complexity of SoC and chiplet-based systems over the years, and with IP reuse comes many unique challenges. Fabless design companies use IP provided by a vibrant ecosystem of IP suppliers and foundries, plus internal re-use in the quest to get to market more … Read More
The 15th TSMC Open Innovation Platform® (OIP) event was held recently. This event is a focal point across the industry for cutting-edge development and industry-level collaboration. Appropriately, advanced packaging, paving the way for multi-die design was a focal point for the event. You can get a good overview of what was … Read More
This past week we … Read More
Unreachability (UNR) analysis, finding and definitively proving that certain states in a design cannot possibly be covered in testing, should be a wildly popular component in all verification plans. When the coverage needle stubbornly refuses to move, where should you focus testing creativity while avoiding provably untestable… Read More
Regardless of where you grew up you probably know the story of Alice in Wonderland. The story is over 100 years old, but holds up to the present day, thanks in part to some magic from Disney. It evokes visions of a place that elicits admiration and wonder, to create a place of magical charm. In the context of AI, it takes on a more relevant… Read More
In the ever-evolving world of Conversational AI and Automatic Speech Recognition (ASR), an upcoming LinkedIn Live webinar is set to redefine the speech-to-text industry. Achronix Semiconductor Corporation is teaming up with Myrtle.ai to bring you a webinar on October 24, 2023, at 8:30am PST.
Moderated by EE Times’ Sr. Reporter,… Read More
By Philippe Flatresse, Bich-Yen Nguyen, Rainer Lutz of SOITEC
Automotive radar is a key enabler for the development of advanced driver assistance systems (ADAS) and autonomous vehicles. The use of radar allows vehicles to sense their environment and make decisions based on that information, enhancing… Read More
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