Many complex PCB designs have high data-rate signals like USB, PCIe, DDR and HDMI which call for more thorough verification methods to ensure compliance plus mitigate any signal integrity, power integrity and EMI/EMC issues. Siemens has a methodology that uses automated rule-based electrical verification with an EDA tool,… Read More
Webinar: Faster Design Spec to Implementation using IP-XACTAs SoC design flows grow increasingly complex, IP-XACT…Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too LateI recently posted an overview of an upcoming…Read More
Feed Forward Intelligence: Enabling Testability in the Chiplets EraThe semiconductor industry is entering a new era…Read More
Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions Market Leaders Including Cisco,…Read More
RISC-V and AI: The Architecture Shift Is NowThe semiconductor industry has experienced several defining transitions…Read MoreDr. Cliff Hou and the TSMC N2 Process Technology
Before assuming his current position, Dr. Hou held several key leadership roles. He served as Vice President of Design and Technology Platform from 2011 to 2018, and later as Vice President of Technology Development starting in August 2018. Earlier in his career, from 1997 to 2007, he established TSMC’s technology design kit
UX in Agentic Systems. Innovation in Verification
A switch this month to principles behind building effective agentic systems, going beyond simply a new way to stitch together tools, agents and orchestration, to deeper consideration of user experience and how we most effectively blend agentic with human-in-the-loop. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano… Read More
Scalable Network-on-Chip Enables a Modular Chiplet Platform
The semiconductor industry is undergoing a profound transformation as system complexity, performance expectations, and time-to-market pressures continue to rise. Traditional monolithic system-on-chip (SoC) designs are increasingly giving way to modular, chiplet-based architectures that enable flexibility, scalability,… Read More
The Shift to System-Level AI Drives Next-Generation Silicon
At its 2026 Technology Symposium, TSMC delivered a clear message: the AI era has entered a new phase. The primary constraint is no longer model capability, but the systems required to run those models at scale. Addressing this shift will demand significant advances in semiconductor technology, spanning compute, memory, interconnects,… Read More
All in One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die
The rapid evolution of wireless audio has placed unprecedented demands on system integration, power efficiency, and performance. Against this backdrop, the webinar “All-in-One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die” offers a timely and technically rich exploration of how modern semiconductor design… Read More
Closing the Reality Gap: A New Architecture for 1.8-Tb/s Chiplet Governance
Dr. Moh Kolbehdari is a Senior Lead Architect at Socionext, where he specializes in the industrialization of high-performance AI chiplets and 1.8-Tb/s interconnects. With over two decades of experience in SI/PI, electromagnetic field theory, and system-level architecture, he has been a pivotal force in bridging the gap between… Read More
SemiWiki Q&A with Julie Rogers, Executive Director, ESD Alliance
The Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, an international association of companies providing goods and services throughout the semiconductor design ecosystem, is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. It acts … Read More
CEO Interview with Xianxin Guo of Lumai
Xianxin is the CEO and Co-Founder of Lumai, an Oxford University spin-out pioneering disruptive optical computing technologies for Al and data center acceleration. He brings over 15 years of experience in physics and engineering, and was previously an RCE 1851 Research Fellow, a prestigious fellowship whose past awardees … Read More
Podcast EP343: How Ethernet is Enabling Advances in AI with Dr. Mohan Kalkunte
Daniel is joined by Dr. Mohan Kalkunte, Vice President of Architecture & Technology in the Core Switch Products group at Broadcom, where he leads architecture for Ethernet switching and NIC products across data center, enterprise, and service provider markets. With over 35 years of industry experience his previous stints… Read More


Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume Fabs