GTC 2026: Agentic AI for Semiconductor Design and Manufacturing Janhavi Giri, PhD Principal…Read More
Scaling Multi-Die Connectivity: Automated Routing for High-Speed InterfacesThis article concludes the three-part series examining key…Read More
Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet SummitAt the recent Chiplet Summit, presentations, discussions and…Read More
Captain America: Can Elon Musk Save America's Chip Manufacturing Industry?Intel has posted three consecutive years of falling…Read More
More automotive content 😀
In modern cars, safety is governed as much by AI-based functions as by traditional logic and software. How can these functions be fault-graded for FMEDA analysis? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO)… Read More
During the GOMACTech conference held in South Carolina last week I had a Zoom call with Deepak Shankar, Founder and VP Technology at Mirabilis Design Inc. to ask questions and view a live demo of VisualSim – a modeling, simulation, exploration and collaborative platform to develop electronics and SoCs. What makes VisualSim so … Read More
Non-volatile memory (NVM) is a critical building block for most electronic systems. The most popular NVM technology has traditionally been flash. As a discrete part, the technology can be delivered in various form factors. For embedded applications flash presents scaling challenges, however. A new NVM technology developed… Read More
2024 DVCon was very busy this year. Bernard Murphy and I were in attendance for SemiWiki, he has already written about it. Multi die and chiplets was again a popular topic. Lauro Rizzatti, a consultant specializing in hardware-assisted verification, moderated an engaging panel, sponsored by Synopsys, focusing on the intricacies… Read More
On September 13, 2021, Andes Technology Corporation successfully issued its GDR (Global Depositary Receipt) public offering on the Luxembourg Stock Exchange. At the time it made Andes the only international public RISC-V Instruction set architecture (ISA) CPU IP supplier. This allowed investors around the world to participate… Read More
Dan is joined by Frank Schirrmeister, vice president of solutions and business development at Arteris. He leads activities in the industry verticals including automotive and technology horizontals like artificial intelligence, machine learning, and safety. Before Arteris, Frank held senior leadership positions at Cadence… Read More
A thought leader with demonstrated history in multiple roles- project life cycles, ideation, implementation, and closing projects delivering business value and delighting stakeholders, crafting technical aspects of the company’s strategy for aligning with the business goals perfectly, discovering and implementing … Read More
U.S. President Biden announced on Wednesday an agreement to provide Intel with $8.5 billion in direct funding and $11 billion in loans under the CHIPS and Science Act. Intel will use the funding for wafer fabs in Arizona, Ohio, New Mexico, and Oregon. As reported in our December 2023 newsletter, the CHIPS Act provides a total of $52.7… Read More
We have been working with Ansys since SemiWiki was founded in 2011. It has been a richly rewarding relationship in all regards. I always say the semiconductor industry is filled with the most intelligent people in the world and Ansys is an excellent proof point. I have known John Lee for 30+ years and he is one of my trusted few, absolutely.… Read More
Next significant automotive blog in a string I will be posting (see here for the previous blog).
In the semiconductor world, mixed simulation means mixing logic sim, circuit sim, virtual sim (for software running on the hardware we are designing) along with emulation and FPGA prototyping. While that span may seem all-encompassing,… Read More
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