03 Mar 2020 - 05 Mar 2020 Fountain Hills, AZ, USA Join Cadence in Booth 42 at the International Microelectronics Assembly and Packaging Society (IMAPS)’s 16th annual Device Packaging Conference. The show is a major forum for the exchange of knowledge and provides numerous technical, social, and networking opportunities for meeting leading experts in these …
June 2, 2020 8:30 PM (EDT) Venue: Online Ansys RaptorH adds to Ansys’ comprehensive set of electromagnetic (EM) field solver modeling capabilities, which extend from devices to chips to full electronics systems. The enhanced on-silicon EM simulation now includes the Ansys HFSS gold-standard engine integrated into an easy-to-use interface for chip designers, while maintaining the …
Continue reading "Introducing Ansys RaptorH: SoC, Mixed-Signal and RFIC Electromagnetic Modeling"
June 4, 2020 10:30 AM (EDT) Venue: Online Ansys RaptorH adds to Ansys’ comprehensive set of electromagnetic (EM) field solver modeling capabilities, which extend from devices to chips to full electronics systems. The enhanced on-silicon EM simulation now includes the Ansys HFSS gold-standard engine integrated into an easy-to-use interface for chip designers, while maintaining the …
Continue reading "Introducing Ansys RaptorH: SoC, Mixed-Signal and RFIC Electromagnetic Modeling"
Time: September 13, 2021 8 AM EDT / 1 PM BST / 5:30 PM IST Venue: Onlineo About this Webinar In today’s near threshold designs, trends like tighter integration and increasing layout density on advanced nodes, frequency escalation (5G) and complex packaging scenarios are making the need for accurate and efficient electromagnetic modeling critical. From …
Continue reading "De-risking RFICs and High Speed SoCs from Electromagnetic Crosstalk"
Synopsys Webinar | Wednesday, August 17, 2022 | 10:00 a.m. PT Wireless communication is at the heart of the technological revolution of the past few decades and RF circuits are what enable wireless systems to communicate with each other. The design and characterization of RF circuits is a complex process that requires the designer to …
Date: Tuesday, October 18, 2022 North America Session: 9:00am - 10:00am PT EMEAI Session: 11:00am - 12:00pm CET Demand for next-generation wireless communication, aerospace, and transportation systems is driving the need for high-performance, cost-sensitive silicon RFICs and III-V compound semiconductor monolithic microwave integrated circuits (MMICs), often integrated into advanced system-in-package (SiP) modules. The latest release of the Cadence® AWR …
Continue reading "Webinar: Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows"
