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IMAPS Device Packaging 2020
Join Cadence in Booth 42 at the International Microelectronics Assembly and Packaging Society (IMAPS)’s 16th annual Device Packaging Conference. The show is a major forum for the exchange of knowledge and provides numerous technical, social, and networking opportunities for meeting leading experts in these fields.
In the booth, we will showcase:
- Cadence® advanced IC packaging and cross-domain co-design automation, supporting the next generation of heterogeneously integrated 2.5D/3D package designs
- Cross-platform, unified solution for RFIC and module design
- Foundry and OSAT reference flows supporting the latest advanced IC packaging technologies
- Accurately and seamlessly addressing electro-thermal, power delivery, and signal integrity challenges across chip, package, and board
This Is Not Your Father’s Semiconductor Packaging…An EDA Perspective (032)
Tuesday, 3 March 10:30am – 11:00am / 3D INTEGRATION Track, 032
Author: John Park, Cadence
Samsung Foundry’s 3D PKG Solution Based on Cadence Design Flow
Tuesday, 3 March 11:30am – 12:00pm / 3D INTEGRATION Track, 066
Author(s): Max Min, Samsung Foundry US (SungWook Moon)