CadenceTECHTALK: Static and Dynamic IR Drop Analysis for Thermal Integrity of High-Performance PCB Designs

Online

  As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also temperature-dependent, making dynamic and static IR drop analysis crucial in addressing the performance and capacity challenges of such designs. …

Constraints-Driven CDC and RDC Verification Including UPF Aware Analysis

Online

Synopsys Webinar | Thursday, June 23, 2022 | 10:00 - 11:00 a.m. Pacific Today’s million gates integrated circuits (ICs) involve various intellectual properties (IPs) interfacing with each other through multiple asynchronous clock and reset domains. Ensuring all clocks propagate concurrently across each clock tree components used as clock switching elements or each sequential or combinatorial …

Foundations of Semiconductor Power Integrity Analysis and Simulation

Online

The SEVENTH installment of the Ansys HFSS Foundation webinar series is here! In this webinar, you will gain a deeper understanding of the mathematical underpinnings of Redhawk-SC and its application in Power analysis and Power integrity. July 7, 2022 11 AM EDT / 4 PM BST / 8:30 PM IST Venue: Online About this Webinar …

Webinar: Integrated Thermal Analysis for RF MMIC and PCB Power Applications

Online

Time: 9:00am - 10:00am (PT) Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide designers with thermal heat map visualization and operating temperature information. Thermal analysis provides RF circuit designers …

Ansys 2022 R2: What’s New in Safety and Cybersecurity Analysis

Online

This webinar showcases Ansys medini's many enhancements delivered in Ansys 2022 R2 and shows how you can integrate these features to advance your safety-related activities substantially. TIME: SEPTEMBER 7, 2022 11 AM EDT / 4 PM BST / 8:30 PM IST REGISTER HERE About This Webinar Our A&D customers benefit from improved quantitative fault tree …

CadenceTECHTALK: Preventing EM Failures in IC Designs with Signoff Analysis

Online

Date: Tuesday, September 20, 2022 Time: 10:00 - 11:00 (CEST) Electromigration (EM) impacts design reliability, causing failures over time. That is why it’s important to analyze both the power mesh and signal wires to check that the average, rms, or peak currents will not lead to a permanent failure. Learn how the Cadence Voltus IC Power …

CadenceTECHTALK: In-Design EM Analysis Addresses RF System Integration Challenges

Online

Date: Tuesday, September 20, 2022 Time: 10:00am PDT / 1:00pm EDT The RF PA MMIC worked as designed until it was integrated into the module housing, and then the overall performance shifted out of spec. Design failure at the point of system integration is a common cause of delayed product deliveries and engineering cost overruns. …

Webinar: Cutting-edge Analysis of EDGE Compute Nodes & 5G

Online

This webinar will benefit engineers, designers, operators, and analysts working in technologies such as 5G/6G, autonomous vehicle control, AR/VR applications, eVTOL, emergency communications, smart factory operation, smart cities, and large IoT systems. Time: 22 September, 2022 14:00 CEST / 8 AM EDT / 1 PM BST / 5:30 PM IST About this Webinar NEDGE systems enable …

Webinar: Exploring Space: Thermal-Structural Analysis of a Lunar Rover Using Simcenter 3D

Online

The next scientific hub for space exploration might just be located on the Moon. As NASA partners around the world set their sights on sending humans to the lunar surface, the digital twin has a major role to play. Simulation is used for thermal and structural analysis of lunar space systems to ensure reliability at …

ISTFA 2022

Pasadena, CA Pasadena, CA, United States

48th International Symposium for Testing and Failure Analysis The demand for higher performance and lower power-consumption microelectronic devices has driven semiconductor technology to shrink continuously according to Moore’s Law. Furthermore, for latest technologies in nano realm, a new set of disruptive development in new structures and novel materials was introduced. Thus, defects causing semiconductor device …