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Developing optical payloads for aerospace applications requires multi-physics collaboration. This type of workflow involves designing an optical system and generating opto-mechanical behavior by realistically modelling the structural and thermal impacts experienced by a payload in-orbit. The Ansys software suite offers a streamlined optical simulation workflow that enables Structural-Thermal-Optical-Performance (STOP) analysis for aerospace applications. Interoperability between …
July 27, 2023, 2:00pm - 2:30pm EDT Anticipating and Simulating Unpredictable Loads Understanding Dynamic Structural Analysis with Altair® S-FRAME® AEC Coffee-Break Series Dynamic behavior is an essential structural characteristic that structural engineers should consider. The effects of dynamic loads (earthquakes, blasts, vibrations, or any time-varying loading) are often greater than static loads and can vary …
Anticipating and Simulating Unpredictable Loads Understanding Dynamic Structural Analysis with Altair® S-FRAME® AEC Coffee-Break Series Dynamic behavior is an essential structural characteristic that structural engineers should consider. The effects of dynamic loads (earthquakes, blasts, vibrations, or any time-varying loading) are often greater than static loads and can vary in magnitude at non-periodical time intervals, increasing …
Join us in this webinar to learn how your student team can benefit using Ansys in your FSAE chassis system design. TIME: NOVEMBER 1, 2023 10 AM EDT Venue: Virtual About this Webinar The webinar includes a brief description of the methodology and the approaches used to design a rule-compliant, safe, and ergonomic chassis structure …
Cadence Headquarters, San Jose, CA
2655 Seely Ave, San Jose, CA, United States
Date: November 2, 2023 Time: 10:00am – 5:00pm Location: Cadence Headquarters, San Jose, CA | Building 10 - Auditorium Power integrity (PI) is a major challenge for chip designers in the era of ubiquitous data, hyperconnectivity, and AI. Design size is exploding, and innovations in heterogenous integration are adding to PI complexity. These changes and challenges are ushering …
Cadence Headquarters, San Jose, CA
2655 Seely Ave, San Jose, CA, United States
Date: November 2, 2023 Time: 10:00am – 5:00pm Location: Cadence Headquarters, San Jose, CA | Building 5 - Big Sur Power integrity (PI) is a major challenge for chip designers in the era of ubiquitous data, hyperconnectivity, and AI. Design size is exploding, and innovations in heterogenous integration are adding to PI complexity. These changes and challenges are …
Date and time: Tuesday, November 7, 2023 13:00-14:20 Sponsor: Japan Cadence Design Systems, Innotek Co., Ltd. IC Solution Headquarters Cost: Free Venue: Online (Zoom webinar) *You can also participate from a web browser. We recommend using Google Chrome, Firefox, or Chromium Edge. Registration deadline: November 6th (Monday) 16:00 This webinar will provide the latest information …
Colorado Convention Center
700 14th St, Denver, CO, United States
The International Conference for High Performance Computing, Networking, Storage, and Analysis Program Each year, SC provides the leading technical program for professionals and students in the HPC community, as measured by impact, at the highest academic and professional standards. BY OUR COMMUNITY, FOR OUR COMMUNITY Full Program Schedule Sunday–Friday, November 12–17, 2023 Technical Program Co-Chair …
* Company Email Required for Registration! Advanced semiconductor nanometer technology nodes, together with smart IC design applications enable today very complex and powerful systems for communication, automotive, data transmission, AI, IoT, medical, industry, energy harvesting, and many more. Random variation in the manufacturing process is a challenge for all full custom circuit designers, because their …
Wednesday, November 15, 2023 | 2:00 pm ET (New York) | 1:00 pm CT (Chicago) | 11:00 am PT (San Francisco) Simulation-driven design is the key to understanding the constantly evolving medical technology and to explore material decisions and optimize structures for performance. Computational simulation has been used for several decades to reduce product development …
Today's electronic products increasingly use Rigid-Flex PCBs to compress form factors, reduce weight, and increase cost-effectiveness. For many commercially available 3D numerical solver technologies (FEM and FDTD), the electromagnetic (EM) analysis of rigid-flex PCBs has always been challenging due to the complexity of the 3D designs. Much of this complexity comes from bending the board into …
Wednesday, January 24, 2023 | 1pm ET (New York) | 12pm CT (Chicago) | 10am PT (San Francisco) Discover unparalleled efficiency with Altair's concrete design solutions. S-CONCRETE and S-FOUNDATION accelerate workflows by seamlessly importing third-party analysis results rapidly. A detailed concrete section design and a substructure foundation analysis and design that are combined in an end-to-end workflow …
Crown Piast Hotel & Park Kraków
Walerego Eljasza-Radzikowskiego 109, Kraków, Poland
The 2024 NAFEMS Eastern Europe Conference will be held on the 24th and 25th of April, 2024 in Kraków, Poland. This event is where the regional simulation engineering community comes together to discuss all aspects associated with engineering analysis. We will be looking at the trends, challenges, best practices, and cutting-edge technological advances that will shape the near, …
