SPIE Advanced Lithography
SPIE Advanced Lithography is a Digital Forum in 2021 We look forward to you joining us 22 - 26 February 2021 Attend the Advanced Lithography Digital Forum, the leading event for …
SPIE Advanced Lithography is a Digital Forum in 2021 We look forward to you joining us 22 - 26 February 2021 Attend the Advanced Lithography Digital Forum, the leading event for …
AI Business Week 2021 – Register Now! – On-Demand Thought Leadership with No Distractions AI Business week will take a unique look at the opportunities afforded by effective AI implementation …
February 23-February 25, 2021 Join the CEVA team to experience the smart sensing and wireless connectivity technologies that will shape our future. Visit us for a connected, interactive, and fully …
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be …
Continue reading "Electrothermal Signoff for 2.5D and 3D-IC Systems"
Produce Secure, High-quality Code Discover how you can easily produce secure, high-quality code with Klocwork. Klocwork is a static code analysis tool. It checks your code against coding rules. You …
Continue reading "Webinar: Klocwork Ensures the Security, Reliability, and Quality of Your Code"
There’s no doubt about it. Photonics is rapidly gaining importance thanks to its proven potential for many diverse application areas & industries. Imec Technology Forum Photonics is your No. 1 …
Learn from leaders in the IoT and cybersecurity ecosystem about how to protect your IoT devices, applications and data. With two days of live talks, the expert speakers will take …
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be …
Continue reading "Electrothermal Signoff for 2.5D and 3D-IC Systems"
Date: February 23, 2021 Time: 9:00 PM PST *This event will be broadcasted at 9:00 p.m. PT. To attend at 10:00 a.m. PT, please register here The next generation of processor …
February 24, 2021 9 AM EST / 2 PM GMT / 7:30 PM IST Venue: Online Ansys Minerva, powered by Aras, is the next generation simulation process and data management …
Continue reading "Boost Engineering Productivity with Ansys Minerva, Powered by Aras"
Traditional FPGA programming models and hardware description languages are not intuitive to many software developers. And even if they are, using them for iterative algorithm development is time consuming. This …
Digital event | February 24, 2021 | 10:00 AM PST Synopsys is the world's leading provider of solutions for designing and verifying advanced semiconductor products. Accelerating Semiconductor Design & Verification …