Millions of dollars wasted. Lost competitive advantage. Idle manufacturing lines and customer frustrations. These are the all-too-common consequences of semiconductor failures. In today's economy, competent failure analysts are vital to solve these problems before their companies suffer the repercussions. However, as circuits grow more and more complicated, engineers can easily find themselves entangled in a semiconductor …
03 Mar 2020 - 05 Mar 2020 Fountain Hills, AZ, USA Join Cadence in Booth 42 at the International Microelectronics Assembly and Packaging Society (IMAPS)’s 16th annual Device Packaging Conference. The show is a major forum for the exchange of knowledge and provides numerous technical, social, and networking opportunities for meeting leading experts in these …
Block Floating Point (BFP) is a hybrid of floating-point and fixed-point arithmetic where a block of data is assigned a common exponent. We describe a new arithmetic unit that natively performs Block Floating Point for common matrix arithmetic operations and creates floating-point results. The BFP arithmetic unit supports several data formats with varying precision and …
Continue reading "New Block Floating Point Arithmetic Unit for processing AI/ML Workloads in FPGA"
March 3, 2020 11:00 AM - 12:00 PM (EST) Venue: Online Join us to learn about the new capabilities available in ANSYS Maxwell in our latest release, ANSYS 2020 R1. It includes powerful new features for the design and analysis of electric motors, actuators, transformers and electromechanical devices: Advancements in harmonic force coupling Enhanced demagnetization …
March 3, 2020 11:00 AM (EST) Venue: Online Engineers are constantly trying to increase the efficiency of valves to control fluid flow across a range of operating conditions and valve positions. In this webinar, we will demonstrate how ANSYS Discovery can help you to visualize the flow field and predict performance metrics like pressure drop/flow …
March 3, 2020 11:00 AM (EST) Venue: Online While paradigm-changing innovations such as advanced driver assistance systems, electric vehicles and autonomous vehicles are just a few years from production, vehicle makers are struggling to manage the resulting safety and reliability issues. In order to reduce complexity and enhance safety, manufacturers and suppliers must adopt standards …
March 3, 2020 11:00 AM (EST) Venue: Online Materials scientists and engineers focus on understanding, improving and developing materials to design new product applications. Additionally, these experts must manage logistics surrounding material price stability, supply chain security, complex restrictions and reporting requirements, stringent environmental concerns, materials circularity, social responsibility and material access restrictions. Materials scientists …
Continue reading "Educating Future Materials Scientists and Engineers: Challenges & Opportunities"
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry’s ability to track something known as Moore’s Law. Moore’s Law states that an integrated circuit’s …
March 4, 2020 11:00 AM (EST) Venue: Online ANSYS 2020 R1 introduces exciting new updates for ANSYS Discovery SpaceClaim. This will empower users to perform autoskin operations on open faceted bodies, simplifying the combination of analytic geometry with autoskinned patches during the reverse engineering process. Additionally, Discovery SpaceClaim integrates two new minimal surface lattices to …
Continue reading "ANSYS Discovery SpaceClaim: Latest Updates in ANSYS 2020 R1"
March 4, 2020 12:00PM - 13:00PM (EST) Venue: Online As the automotive industry undergoes radical transformation with electrification and autonomy, there is an increasing need for semiconductor devices that last longer and can operate at higher temperatures. In response, the Automotive Electronics Council (AEC) released a new grade of electronic parts rated to 150 C. …
Continue reading "How to Design and Validate with AEC Grade 0"
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: (1) pitch conversion between the fine features of the IC die and the system level interconnection, (2) chemical, environmental and mechanical protection, (3) heat transfer, (4) power, ground and signal distribution between the die and system, (5) …
Thu, Mar 5, 2020 10:00 AM - 10:45 AM MST In this webinar we will discuss best practice for traditional CFD meshing using Workbench mesher. Recommendations will be made regarding meshing pitfalls, things to avoid, how to verify your mesh is acceptable, etc.
March 5, 2020 11:00 AM (EST) Venue: Online In this webinar, you’ll see how the Materials Data for Simulation dataset supports multiple simulation tools, including ANSYS Mechanical and ANSYS Maxwell. This dataset provides broad coverage of engineering materials in one place, with property data for structural analysis, low frequency electromagnetic analysis and much more. Learn …
Continue reading "Consistent Materials Data for Simulation Across ANSYS Solvers"
