Europe’s leading technical autonomous vehicle L4+ development conference for the automotive industry Tech.AD is an award-winning international knowledge exchange platform bringing together all stakeholders leading the development and technical future of level 4 autonomous vehicles. Testing & Validation, Sensor Fusion, Deep Driving, Operational Safe Systems, Computer Vision, Software Architectures & much more. Over 2.5 days …
The Design and Verification Conference (DVCon) is the leading event covering the application of languages, tools and intellectual property for the design and verification of electronic systems and integrated circuits. Sponsored by Accellera Systems Initiative™, DVCon brings chip architects, design and verification engineers, and IP integrators the latest methodologies, techniques, applications and demonstrations for the practical …
Millions of dollars wasted. Lost competitive advantage. Idle manufacturing lines and customer frustrations. These are the all-too-common consequences of semiconductor failures. In today's economy, competent failure analysts are vital to solve these problems before their companies suffer the repercussions. However, as circuits grow more and more complicated, engineers can easily find themselves entangled in a semiconductor …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Introduction to Processing is …
03 Mar 2020 - 05 Mar 2020 Fountain Hills, AZ, USA Join Cadence in Booth 42 at the International Microelectronics Assembly and Packaging Society (IMAPS)’s 16th annual Device Packaging Conference. The show is a major forum for the exchange of knowledge and provides numerous technical, social, and networking opportunities for meeting leading experts in these …
Block Floating Point (BFP) is a hybrid of floating-point and fixed-point arithmetic where a block of data is assigned a common exponent. We describe a new arithmetic unit that natively performs Block Floating Point for common matrix arithmetic operations and creates floating-point results. The BFP arithmetic unit supports several data formats with varying precision and …
Continue reading "New Block Floating Point Arithmetic Unit for processing AI/ML Workloads in FPGA"
March 3, 2020 11:00 AM (EST) Venue: Online Engineers are constantly trying to increase the efficiency of valves to control fluid flow across a range of operating conditions and valve positions. In this webinar, we will demonstrate how ANSYS Discovery can help you to visualize the flow field and predict performance metrics like pressure drop/flow …
March 3, 2020 11:00 AM - 12:00 PM (EST) Venue: Online Join us to learn about the new capabilities available in ANSYS Maxwell in our latest release, ANSYS 2020 R1. It includes powerful new features for the design and analysis of electric motors, actuators, transformers and electromechanical devices: Advancements in harmonic force coupling Enhanced demagnetization …
March 3, 2020 11:00 AM (EST) Venue: Online Materials scientists and engineers focus on understanding, improving and developing materials to design new product applications. Additionally, these experts must manage logistics surrounding material price stability, supply chain security, complex restrictions and reporting requirements, stringent environmental concerns, materials circularity, social responsibility and material access restrictions. Materials scientists …
Continue reading "Educating Future Materials Scientists and Engineers: Challenges & Opportunities"
March 3, 2020 11:00 AM (EST) Venue: Online While paradigm-changing innovations such as advanced driver assistance systems, electric vehicles and autonomous vehicles are just a few years from production, vehicle makers are struggling to manage the resulting safety and reliability issues. In order to reduce complexity and enhance safety, manufacturers and suppliers must adopt standards …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry’s ability to track something known as Moore’s Law. Moore’s Law states that an integrated circuit’s …
March 4, 2020 11:00 AM (EST) Venue: Online ANSYS 2020 R1 introduces exciting new updates for ANSYS Discovery SpaceClaim. This will empower users to perform autoskin operations on open faceted bodies, simplifying the combination of analytic geometry with autoskinned patches during the reverse engineering process. Additionally, Discovery SpaceClaim integrates two new minimal surface lattices to …
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March 4, 2020 12:00PM - 13:00PM (EST) Venue: Online As the automotive industry undergoes radical transformation with electrification and autonomy, there is an increasing need for semiconductor devices that last longer and can operate at higher temperatures. In response, the Automotive Electronics Council (AEC) released a new grade of electronic parts rated to 150 C. …
Continue reading "How to Design and Validate with AEC Grade 0"
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: (1) pitch conversion between the fine features of the IC die and the system level interconnection, (2) chemical, environmental and mechanical protection, (3) heat transfer, (4) power, ground and signal distribution between the die and system, (5) …
Thu, Mar 5, 2020 10:00 AM - 10:45 AM MST In this webinar we will discuss best practice for traditional CFD meshing using Workbench mesher. Recommendations will be made regarding meshing pitfalls, things to avoid, how to verify your mesh is acceptable, etc.
March 5, 2020 11:00 AM (EST) Venue: Online In this webinar, you’ll see how the Materials Data for Simulation dataset supports multiple simulation tools, including ANSYS Mechanical and ANSYS Maxwell. This dataset provides broad coverage of engineering materials in one place, with property data for structural analysis, low frequency electromagnetic analysis and much more. Learn …
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CONFERENCE ARCHIVES 2019 – San Diego, California, USA Program PDF Conference Papers Technical Sessions Authors and Presiders View Presentations Previous Years The Premier Event in Telecom and Data Center Optics OFC is the largest global conference and exhibition for optical communications and networking professionals. The program is comprehensive -- from research to marketplace, from components to …
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Double data rate (DDR) synchronous dynamic random-access memory (SDRAM) is the common type of memory used as RAM for almost every modern processor. With DDR memory interface voltages decreasing, speeds increasing, and timing/power budgets being squeezed, design qualification using the latest memory interfaces is no small challenge. Join Cadence Training and Srdjan Djordjevic, Sigrity Expert …
Continue reading "Webinar: Improving SI/PI Simulation of DDR Interfaces at the PCB/IC Package Level"
The DATE exhibition will run for three days (Tuesday-Thursday). The spacious exhibition area will be located close to the conference rooms in the heart of the Congress Center. As the area is positioned centrally and will host the coffee and lunch break area as well, a constant frequentation will be guaranteed. DATE also arranges a …
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Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability, assessing the impact of …
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March 9, 2020 - March 10, 2020 9:00 AM - 5:00 PM (EST) Venue: ANSYS, Inc. 900 Victors Way Atrium One, Suite 350 Ann Arbor, MI 48108 USA Contact: Danielle Frederick danielle.frederick@ansys.com 248-251-0128 Join ANSYS for a free two-day hands-on workshop training session as we discuss the power of ANSYS medini analyze for automotive …
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10 Mar 2020 - 12 Mar 2020 San Diego, CA, USA Join Cadence in Booth 5327 at the Optical Fiber Communication (OFC) Conference to explore how our photonics, RF, IP, and simulation solutions can help you meet your complex design requirements. The show is the largest global conference and exhibition for optical communications and networking …
March 10-11 AI Hardware Summit Europe Munich, Germany Get the latest updates and technical specifications on InferX X1 Edge Inference Co-Processor
The DATE exhibition will run for three days (Tuesday-Thursday). The spacious exhibition area will be located close to the conference rooms in the heart of the Congress Center. As the area is positioned centrally and will host the coffee and lunch break area as well, a constant frequentation will be guaranteed. DATE also arranges a …
FREE IIoT Seminar hosted by Arm and Hitex Discover the key considerations when connecting your factory Munich, 10 March, 2020 Register Seamless enablement and secure management of industrial IIoT devices at scale Join us for a full day of engaging presentations where we will discuss the challenges and solutions required to deliver a large scale, …
March 10, 2020 4 AM EDT / 8 AM GMT / 9 AM CET Venue: Online Automotive head-up displays (HUDs) present data within the driver’s field of view. The best HUDs and HMIs are ergonomically designed so drivers can keep their eyes on the road at all times. As the advanced driver assistance systems (ADAS) …
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March 10, 2020 11:00 AM - 12:00 PM (EST) Venue: Online Anyone can get great CFD simulation results with ANSYS solutions. The latest innovations and updates simplify and speed setup and meshing while adding even more accurate physical models. The outcome: great results, without compromise. ANSYS Fluent is easier to use A streamlined workflow enables …
March 10, 2020 2:00 PM (CET) Venue: Online Contact: Kara Gremillion kara.gremillion@ansys.com IEC 61508 is an international standard for the functional safety of electrical/electronic/programmable electronic safety-related systems — especially for industrial systems and applications. This webinar demonstrates how ANSYS medini analyze can be applied to perform the required activities of that standard in an efficient …
GSA Women's Leadership Initiative (WLI) Austin Forum The WLI Austin Forum is an inaugural event focusing on women in the semiconductor industry, promoting camaraderie and education with a goal of strengthening women leadership and influencing females to join the semiconductor market. This is the GSA’s first Women’s Leadership Initiative conference bringing together semiconductor-focused women from …
Image Sensors will take place in London, UK, 11-12 March 2020 and offers end-users in all the main applications, camera system suppliers, sensor design houses and technology developers, optics suppliers the chance to: Network with over 240 attendees from across the image sensing value chain Hear from companies who are leaders in the sensors market, includingSony, Basler, …
Overview: In the automotive and aerospace industry, creating accurate service documentation can be a real challenge for regulatory compliance, end-of-line testing, in-service repair, maintenance and upgrades. In this webinar, learn how to reduce errors and costs with a faster, easier way to automatically produce service documentation for systems of increasing complexity, configuration variability and design changes. Automation of …
March 11, 2020 11:00 AM (EST) Venue: Online ANSYS 2020 R1 delivers cutting-edge enhancements for ANSYS Discovery Live. This features major changes to the structural solver which helps designers solve a greater number of use cases with improved accuracy, especially for thinner geometries. Discovery Live also introduces a steady-state fluids solver for quickly solving thermal …
Continue reading "ANSYS Discovery Live & ANSYS Discovery AIM: New Upgrades in ANSYS 2020 R1"
This ANSYS 2020 R1 Conference will be going over the latest enhancements to the most recent updates. Updates will cover new features, enhanced features, and more. Todd Nichols, Chief Engineer at SimuTech Group, is the main speaker and Bob Hill, Business Development Manager, is the main point of contact and organizer. This event is free …
March 12, 2020 09:00 - 17:00 (CET) Venue: Philip Morris Manufacturing & Technology Via Giacomo Venturi, 2, 40056 Crespellano, Valsamoggia BO Italy Contact: Marketing Italia info.italia@ansys.com Product evolution challenges and leading-edge technology in simulation Manufacturing is undergoing the most fundamental transformation since the introduction of the assembly line. To better meet customer-specific and market-specific demands, …
March 12, 2020 11 AM EDT / 3 PM GMT Venue: Online This powerful industrial case study examines potential materials for lightweighting railway transportation. Ansys GRANTA EduPack is used to investigate different train components in order to reduce the weight and environmental impact. For example, when considering the unsprung mass, lightweighting has the potential to …
March 12, 2020 11 AM EDT / 3 PM GMT Venue: Online To comply with software safety certification and/or quality requirements while keeping up with emerging technology and initiatives for cockpit displays, software designers and developers will need to leverage model-based development tools for high-reliability embedded control, cockpit displays and human-machine interface applications. Join us …
March 13, 2020 10:00 - 17:00 (IST) Venue: The Park Hotel 22, Raj Bhavan Road Somajiguda, Hyderabad 500082 India Please join us at the Academic Innovation Conference to be held at The Park, Hyderabad on March 13, 2020. ANSYS Academic engineering simulation software is used by thousands of universities globally for undergraduate students to learn physics …
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Monthly networking about EDA, IP and Semiconductor industry. Order lunch, self introductions, lively discussion. Organized by Daniel Payne.
The Premier Global Event in Applied Power Electronics March 15 - 19, 2020 New Orleans Ernest N. Morial Convention Center What is APEC? Celebrating 35 years, the Applied Power Electronics Conference (APEC) brings together nearly 6,000 professionals, from around the world, for five days of powerful networking, hands-on learning, and strategic business development, including a …
Dear Colleagues, On behalf of the Conference Organizing Committee, it is a pleasure to invite you to attend the 14th European Conference on Antennas and Propagation, EuCAP 2020, in Copenhagen, Denmark, March 15-20, 2020. EuCAP is Europe’s largest and most significant antennas and propagation conference attracting academic and industrial participants at all career stages from all …
About The Arm Tech Symposia is a global annual event designed to share with customers our first-hand market observations, the latest Arm technology and roadmaps, the diverse up-to-date Arm-based devices, architectures and applications. This is also an opportunity for partners from the Arm Community and ecosystem to get together to demonstrate their Arm-based products & …
Microelectronics for a New Decade: Global Competition and Near-Peer Challenges GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives …
What is the Game Developers Conference? GDC is the game industry's premier professional event, championing game developers and the advancement of their craft. The Game Developers Conference (GDC) brings the game development community together to exchange ideas, solve problems, and shape the future of the industry across five days of education, inspiration, and networking. Attendees …
Presentations 6 x four hour short courses from thermal thought leaders Thermal conference with 50+ technical papers & how-to’s from leading companies and universities Numerous FREE tear down sessions and product workshops for all attendees Exhibits 40+ companies set up to show off their capabilities Technical sales engineers who are ready to introduce and demonstrate …
The European Processor Initiative is organizing its first EPI Forum on March 16 and 17, 2020, in Paris, France. EPI Forum will gather experts from the HPC ecosystem, stakeholders in the field and EPI researchers and engineers to discuss and present EPI’s achievement so far and future developments in the Initiative. In order to register …
March 17, 2020 11:00 AM (EDT) Venue: Online In the automotive market revolution, new car assessment programs (NCAP) rate vehicle safety from one to five stars. The safety of ADAS equipment is now considered in the rating. To achieve the highest safety level (5 Stars), OEMS need to save time and cost by reducing the …
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March 17, 2020 11:00 AM (EDT) Venue: Online Several commercial space launch systems have been developed recently that use powerful and reusable liquid-fueled rockets, requiring engineers to understand how to extend the lifespan of reusable rocket stages. Structural fatigue and failure of these reusable stages is caused by sloshing of the liquid fuel and oxidizer …
Continue reading "Improving Spacecraft Fuel Tank Design: Reducing Sloshing in Rockets"
March 17, 2020 11:00 AM - 12:00 PM (EST) Venue: Online ANSYS Fluent provides the widest range of multiphase models to accurately simulate your toughest challenges. Learn about recent innovations, including: A streamlined workflow that makes it simple to set up complex multiphase simulations faster, with confidence An innovative AIAD model to accurately simulate complex …
Tue, Mar 17, 2020 11:00 AM - 12:00 PM MDT ** Work email address required** ABSTRACT Presently, emulation and FPGA-based prototyping are essential verification and validation techniques for a SoC, ASIC designs and become irreplaceable in pre-silicon verification of Deep Learning Accelerator designs. Challenges of the multi-FPGA design setup like partitioning, multiplexing limited I/O interconnections …
Continue reading "Six Automated Steps to Design Partitioning for Multi-FPGA Prototyping Boards"
Tuesday, March 17, 2020 12:00 PM 1:00 PM ANSYS AIM can do a little bit of everything. Structural Thermal CFD EM Polymer extrusion What it can do, it does very well. This webinar covers a wide range of simulations available in ANSYS AIM and discuss the benefit of a easy to use Swiss army knife of …
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March 18-19, 2020 Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA 95054 About SNUG Your Global Design Community Focused on Innovation The Synopsys Users Group (SNUG) was established in 1991 to provide users of Synopsys design tools and technology with an open forum in which they could exchange ideas, discuss problems and …
March 18, 2020 11:30 AM (IST) Venue: Online With near-instant simulation capabilities and an extremely easy-to-use multiphysics interface, Ansys Discovery speeds up product design and development while reducing the number of physical prototypes needed. Through interactive design explorations, designers can now avoid unnecessary prototyping, hence saving time and money. Join us for this Ansys Webinar …
ACM International Workshop on Timing Issues in the Specification and Synthesis of Digital Systems March 19 - 20, 2020 Monterey, California The ACM sponsored TAU series of workshops provide an informal forum for practitioners and researchers working on temporal aspects of digital systems to disseminate early work and engage in a free discussion of ideas. The twenty-seventh in …
Interlaken chip-to-chip connectivity IP has been used for many years in networking and switching fabrics to move high throughput data between large chips. With advanced technology nodes, increasing chip sizes and CPU cluster-based designs, Interlaken has found a unique spot as the protocol of choice for low latency, high throughput chip-to-chip connectivity. SiFive is extending …
Continue reading "WEBINAR: Chip-to-Chip Communication (Interlaken-LL) for Enterprise and Cloud"
March 19, 2020 11:00 AM (EDT) Venue: Online According to a recent survey, 40% of engineers limit the size or amount of detail for every simulation model due to compute capacity and turnaround time constraints. Recognizing this, smaller and mid-sized companies now seek more affordable, accessible and powerful hardware, making high-performance computing (HPC) a necessity. …
Continue reading "Debunking Myths of HPC, Cloud and Licensing"
March 19, 2020 11:00 AM (EDT) Venue: Online Whether you are designing critical software for rail interlocking systems and signaling, automatic train operation, computer-based train control, emergency braking systems, overspeed protection, train vacancy detection or other railway applications, you will need to leverage model-based development tools for high-reliability embedded on-board or wayside train control software, …
Continue reading "Critical Embedded Systems and Software Development Solutions for Railways"
Thu, Mar 19, 2020 11:00 AM - 12:00 PM MDT ** Work email address required** Interlaken chip-to-chip connectivity IP has been used for many years in networking and switching fabrics to move high throughput data between large chips. With advanced technology nodes, increasing chip sizes and CPU cluster-based designs, Interlaken has found a unique spot …
Continue reading "Chip-to-Chip Communication (Interlaken-LL) for Enterprise and Cloud"
About CICC The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to …
Participate in the conference designed for users, by users. Get ready for the biggest and best AMUG Conference ever. There will be more users at the event and more technologies represented. With AMUG’s expanded scope, expert, intermediate and novice users of all commercial additive manufacturing technologies are welcome. Join us from March 22-26, 2020, in Chicago, …
The EuroHPC Summit Week (EHPCSW) 2020 will gather the main European HPC stakeholders from technology suppliers and HPC infrastructures to scientific and industrial HPC users in Europe. As in previous years, PRACE, the Partnership for Advanced Computing in Europe, organises the seventh edition of its Scientific and Industrial Conference (PRACEdays20) within the EHPCSW 2020. PRACEdays20 will bring together experts from academia …
ABOUT AICAS AICAS is an initiative of the IEEE Circuit and Systems Society (CASS) that brings the IEEE CASS together with the explosion of investment in artificial intelligence technology. AICAS aims to stand between ISSCC (solid state circuits) and machine learning conferences like NeurIPS, ICML, ICLR, as major reference conference spanning from theory to physical circuits and systems …
March 23, 2020 9:30 AM - 4:30 PM (PDT) Venue: ANSYS, Inc. 2645 Zanker Road San Jose, CA 95134 USA Contact: Phoebe Lee phoebe.lee@ansys.com Join us for a free hands-on workshop to learn how to perform on chip static and dynamic voltage drop analysis, electromigration, design weakness and hot spot analysis using ANSYS RedHawk. We …
March 23, 2020 11 AM EDT / 3 PM GMT Venue: Online ANSYS Motion is an advanced multibody dynamics solver which enables fast and accurate analysis of rigid and flexible bodies. It evaluates physical events accurately by analyzing the mechanical system as a whole. ANSYS Motion has four tightly integrated solving schemes: rigid body, flexible …
March 24, 2020 9:30 AM - 2:30 PM (PDT) Venue: ANSYS, Inc. 2645 Zanker Road San Jose, CA 95134 USA Contact: Phoebe Lee phoebe.lee@ansys.com Join us for a free hands-on workshop to learn how to perform on chip static and dynamic voltage drop analysis, electromigration, design weakness and hot spot analysis using ANSYS Totem. We will …
March 24, 2020 11 AM EDT / 3 PM GMT Venue: Online To develop an optimal product, you must optimize both the structure and the materials. Typically, a huge amount of time and effort is spent refining the structure using simulation, but little attention is paid to the choice of materials. Designers usually choose materials …
Continue reading "Start by Validating Your Choice of Materials"
Tue, Mar 24, 2020 11:00 AM - 12:00 PM MDT *** This vendor requires that you register with your work email address *** As designs migrate to cutting edge single digit nanometer technologies, designing high yielding products that quickly enter the market is key to remain competitive in the chip industry. Advanced node digital designers …
Continue reading "Achieving Design Robustness in Signoff for Advanced Node Digital Designs"
March 24, 2020 12:00 PM - 1:00 PM (EDT) Venue: Online Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical simulations …
Continue reading "ANSYS Icepak and Sherlock For Temperature Cycling"
AI/ML and Electronic Design, Quantum Computing, Hardware Security, IoT, 3D Integration
March 25, 2020 9:30 AM - 5:00 PM (CDT) Venue: Renaissance Austin Hotel 9721 Arboretum Blvd Austin, TX 78759 USA Contact: Phoebe Lee phoebe.lee@ansys.com In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Join us at …
March 25, 2020 9:30 AM - 4:30 PM (PDT) Venue: ANSYS, Inc. 2645 Zanker Road San Jose, CA 95134 USA Contact: Phoebe Lee phoebe.lee@ansys.com Join us for a free hands-on workshop to learn how to analyze, debug and reduce power early during RTL design phase using the industry-leading comprehensive RTL power solution, ANSYS PowerArtist. We will …
March 25, 2020 Start: 5:30 PM | End: 8:30 PM Regis College, Fine Arts Center (235 Wellesley St. Weston, MA 02493) This ANSYS Healthcare Conference will be going over the latest enhancements to the most recent ANSYS updates and what this means for the healthcare industry. Main conference topic: Identifying Unmet Needs: The Rise of …
Member Price: $55.00 Non-Member Price: $75.00 Students: $15.00 (Must have a valid Student ID). For student registration code, contact Margaret Kindling at mkindling@semi.org. Date: March 26, 2020 Location: Energetiq 205 Lowell Street Wilmington, MA 01887 United States Event Agenda Event Contact: Margaret Kindling Email: mkindling@semi.org Phone: 1.202.993.5552 CANCELLATION POLICY: Cancellations received on or before March 19, 2020 will be fully …
March 26, 2020 9:30 AM - 2:30 PM (PDT) Venue: ANSYS, Inc. 2645 Zanker Road San Jose, CA 95134 USA Contact: Phoebe Lee phoebe.lee@ansys.com Join us for a free hands-on workshop to learn how to detect and debug structural weaknesses in your design to prevent electrostatic discharge failures using ANSYS PathFinder. We will review: Introduction …
Thu, Mar 26, 2020 11:00 AM - 12:00 PM MDT ** Work email address required** ABSTRACT: Semiconductor companies designing ICs for smart phones, automotive and industrial applications, CPUs, GPUs and memory components all employ teams of custom IC designers to create the highest performance chips that are as small as possible, and at the lowest …
Continue reading "Analog IP Migration, Optimization and Verification"
Automotive Cybersecurity A critical issue to be to addressed across the entire value chain and vehicle lifecycle The Automotive industry is facing massive technological disruptions; among others: autonomous driving, connected cars, electrification, and shared/diverse mobility. All these trends have a profound impact on the rise of software and of novel electronic architectures within vehicles and …
Member Price: $55.00 Regular price/Non-Member Price: $75.00 Students: $15.00 (Must have a valid Student ID. For student registration code, contact Lin Tso at ltso@semi.org) Date & Time: March 27, 2020 7:30 am - 11:30 am Event Agenda Location SEMI HQ 673 S. Milpitas Boulevard Milpitas, CA 95035 United States Event Contact: Lin Tso Email: ltso@semi.org Phone: +1.408.943.7920 Cancellations …
About IRPS For 58 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic …
International Conference on Display Technology 2020 will be held in Wuhan, China during Mar 29 - April 1, 2020. The Conference topics cover a wide range of new display technology as well as the latest development of manufacturing technologies throughout the world. ICDT will be good venue to exchange ideas between display professionals and to …
March 30, 2020 - March 31, 2020 9:30 AM - 4:30 PM (PDT) Venue: ANSYS, Inc. 2645 Zanker Road San Jose, CA 95134 USA Contact: Phoebe Lee phoebe.lee@ansys.com Join us for a free 2-day hands-on workshop where you will learn how to perform on chip static and dynamic voltage drop analysis, electromigration, design weakness and …
Tue, Mar 31, 2020 11:00 AM - 12:00 PM MDT *** This webinar requires that you register with your work email address *** As we move towards advanced nodes where supply voltage reduces and transistors shrink in size, reliability challenges increase significantly. Designers see more IR drop and power integrity issues, and we can no …
March 31, 2020 11:00 AM (EDT) Venue: Online Particleworks is a mesh-free, liquid-flow simulation software based on the moving particle simulation (MPS) method, which is capable of complicated fluid simulations such as liquid dropping, mixing, lubrication, spraying, sloshing and splashing. It complements Fluent's high-resolution, high-accuracy free surface results. Coupling such complicated liquid behaviors with other …
Member Price: $55.00 Non-Member Price: $75.00 Students: $15.00 (Must have a valid Student ID). For student registration code, contact Margaret Kindling at mkindling@semi.org. Date: April 1, 2020 Location: Applied Materials 9700 Hwy. 290 East Austin, TX 78724 United States Event Agenda Event Contact: Margaret Kindling Email: mkindling@semi.org Phone: 1.202.993.5552 CANCELLATION POLICY: Cancellations received on or before March 25, 2020 will …
The Surface Preparation and Cleaning Conference (SPCC) is the world’s largest annual conference dedicated to cleaning and preparation.
Complex SoC (system on chip) development requires you to bring 3rd party IP, RTL, SPICE netlist, and Post layout netlist files together. Join this webinar to learn how to efficiently and very quickly integrate digital and analog blocks to build a system without extra coding. What you will learn: Visualize: Render schematics on the fly …
Continue reading "Fast, Accurate Analog/Mixed-Signal Analysis and Debug Webinar"
Member Price: $55.00 Non-Member Price: $75.00 Students: $15.00 (Must have a valid Student ID. For student registration code, contact Lin Tso at ltso@semi.org). Date & Time: April 3, 2020 7:30 am - 11:30 am Event Agenda Location: Intel Corporation 5000 W Chandler Blvd Chandler, AZ 85226 United States Event Contact: Lin Tso Email: ltso@semi.org Cell: 510-921-1165 Cancellations received on or …
