Webinar Overview With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die …
Continue reading "WEBINAR: Protocol Agnostic Die-to-Die Connectivity for Chiplets and HPC"
This period of pandemic and confinement has fostered telework and remote relationships. As a result, data transfers around the world have increased dramatically. During its annual Devices Workshop, CEA-Leti will …
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be …
Continue reading "Electrothermal Signoff for 2.5D and 3D-IC Systems"
Overview: Join this webinar to learn how Visual Design Diff helps analog/mixed-signal designers using the Cadence Virtuoso platform to manage ECO’s & conduct design reviews more efficiently. VDD gives design …
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Semiconductor Women's Forum Description The event will be the inaugural Semiconductor Women’s Forum in Singapore. With the theme Beyond Recovery: Leadership For A More Inclusive And Resilient World, it aims …
semiconductor360 LIVE 2021 is the first international virtual event by SemIsrael & semiconductor360.com, for the international semiconductor community, As a flexible, quick, and quality answer for these challenging times. When …
Live Webinar, March 25 Successful software development teams need to move fast while maintaining high-quality code. A key part of achieving this is by optimizing your Continuous Integration (CI) pipeline. …
Continue reading "Break Through Bottlenecks in Your CI Pipeline"
About this Event Prof. Zhenan Bao, Professor, Stanford University Title: Skin-Inspired Organic Electronics Abstract: Skin is the body’s largest organ, and is responsible for the transduction of a vast amount …
Continue reading "CASPA 2021 Spring Symposium: Semiconductor in Digital Transformation"
EVENT DESCRIPTION Solid-State Circuits Directions (SSCD) is a new technical committee within the IEEE Solid-State Circuits Society (related article). Its charter is to promote forward-looking topics, build new communities and stimulate …
Continue reading "Solid-State Circuits Directions Workshop: Democratizing IC Design"
About this Webinar The recently enhanced Ansys Cloud submission tool within Ansys Electronics Desktop (AEDT) provides designers the ability to tailor resource configurations for each step in the electromagnetic simulation …
Continue reading "Webinar Boosting AEDT simulation with Ansys Cloud"
LIVE VIRTUAL EVENT DATES AMER/EMEA // APRIL 20-21 APAC // APRIL 21-22 ABOUT THE CONFERENCE Following a record setting inaugural event in 2020, Simulation World 2021 is designed to inspire and educate executives, …
The Silicon Catalyst Angels group is pleased to announce the next Guest Speaker Series event, open to both members and non-members. The zoom webinar is scheduled to take place on …
