2020 CASPA Summer Symposium Automation, Artificial Intelligence, Cloud Computing under Pandemic
CASPA Summer Symposium. Founded in 1991, CASPA has developed into the largest Chinese American semiconductor professional organization worldwide.
CASPA Summer Symposium. Founded in 1991, CASPA has developed into the largest Chinese American semiconductor professional organization worldwide.
If you are designing high-performance computing and networking SoCs for hyperscale data centers, then you require IP that enables large amounts of data to travel at very fast rates. Whether the IP is for true long reach or very short-reach die-to-die connectivity in multi-chip modules (MCMs), you must consider several essential features such as throughput, …
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Explosive data growth has led to significant power bottlenecks from the data center to the edge. Enter the Renaissance of Computing, featuring purpose-built accelerators that solve these problems, significantly speeding up AI applications such as training and model inferencing in the cloud and at the edge. Utilizing these and re-imagining architectures solves power issues that …
Continue reading "Designing AI Accelerators with Innovative FinFET and FD-SOI Solutions"
Startup Investing Climate and Lessons for Investors, Directors and CEOs with Dr. Ronald Weissman, Chairman, Band of Angels Software Group About this Event Startup Investing Climate and Lessons for Investors, Directors and CEOs Dr. Ronald Weissman, Chairman of the Band of Angels Software Group and member of the Board of Directors of the Angel Capital …
Welcome to the two (2) day, 13th Annual Hybrid Riscure workshop on September 3 & 4th 2020. The event is will focus on topics relevant to embedded security. The delivery of the event will be webcast live to the public via registered attendees only and will have a private by invite only offline workshop (max …
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Promoting EUV Lithography via Workshops, Consulting & Education Introducing the EUVL Supplier Showcase: an Amazing Way to Learn Directly from Suppliers about the Newest and Best Products and Services for the EUVL Infrastructure (Blog Post) EUV Litho, Inc., together with EUV-IUCC, is excited to announce EUVL Supplier Showcase, a new workshop offered to serve the EUVL …
To achieve maximal QoR, Broadcom wanted to take advantage of all the advanced optimizations that Design Compiler offers. These optimizations, however, are of little value if they cannot be verified through Formal Equivalence Checking. This presentation details how Formality Equivalence Checking gave Broadcom the confidence to verify and signoff designs without scaling back or switching …
Continue reading "Best Verifiable QoR – A Formal Equivalence Checking Yardstick"
Join us for the ARC® Processor Virtual Summit to hear our experts, users and ecosystem partners discuss the most recent trends and product developments in ARC-based processor solutions. This multi-day event will provide you with in-depth information from industry leaders on the latest processor IP solutions. Whether you are a developer of chips, systems or …
Synopsys Is About to Unveil a New Era of Photonic Chip Design On September 9, Synopsys will introduce its industry-first unified software platform for photonic IC design. Register to attend our virtual event and discover why photonic innovations are about to take a leap forward. The event will feature a special message from Aart de …
Why IP SoC China 20? China is the largest and fastest growing semiconductor market in the world and at the same time, the semiconductor world has to face a worldwide fast evolution, never seen before, in terms of new applications (IoT, Artificial Intelligence, Automotive etc.) The SoC (System on Chip), Asic (Application specific Circuit) and …
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Pioneer of Online conference in Semiconductor Industry VSDOpen 2020 is the only online conference to showcase Semiconductor IP’s designed by University Students using Open source resources VSDOpen offers education, research demonstration and superb networking opportunities for designer, researchers, tool developers and students across the globe
Webinar Overview With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die to another. In this webinar we will review trade-offs between various connectivity options. We will also review the application of D2D in Chiplets and HPC …
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This period of pandemic and confinement has fostered telework and remote relationships. As a result, data transfers around the world have increased dramatically. During its annual Devices Workshop, CEA-Leti will share its vision on the management of data in all its forms, from capture to safe restitution. PROGRAM Efficient and frugal solutions for date-deluge management …