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Webinar: Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform

March 21 @ 10:00 AM - 11:00 AM

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With the growing complexities of 3D-ICs, chiplets, advanced packaging, and high-performance boards, engineers need a unified solution that provides early insight and analysis to detect and correct design problems before it is too late. This solution must also offer the ability to simulate the entire design efficiently, providing confidence in system signoff.

Join our webinar as we present the new Cadence Celsius Studio the industry’s first complete thermal platform for electronic systems developed specifically to address thermal analysis, thermal stress, and electronics cooling design issues. This solution provides accurate system-level thermal analysis by combining finite element method (FEM) with computational fluid dynamics (CFD) technologies for full-system thermal analysis from chip to packaging to board through to the end-system product.

Attendees will learn:

  • How Celsius Studio provides AI-enabled thermal analysis for electro-mechanical systems design
  • How the convergence of FEM and CFD engines addresses thermal challenges spanning from the chip to the packaging and out to the board and end system


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