Ensuring Accurate Material Properties for Simulation with Digital Image Correlation (DIC)

Thu, Jan 30, 2020 9:00 AM – 10:00 AM MST

Coefficient of Thermal Expansion (CTE) is one the most important factors affecting solder fatigue. Thus knowing the accurate CTE for your materials is essential when designing electronics and selecting initial parts. With increasingly complex materials and architectures being inserted into complicated simulations, Digital Image Correlation (DIC) can help you to ensure the accuracy of those simulations. DIC is especially critical for capturing the behavior of electronic components and circuit boards when simulating their response to thermal, thermo-mechanical, and mechanical loads. In this webinar you’ll learn how DIC material testing can be used to accurately measure CTE of components and boards (the key parameter in solder fatigue simulations) as well as how the technique can be used to identify the glass transition temperatures of polymeric materials like pottings, underfills, and coatings, which are often within the operating temperature range of electronics.