ANSYS 2020 R1 – Signal and Power Integrity Update

February 5, 2020

11:00 AM – 12:00 PM (EST)

Venue: Online

Join us to learn about the new capabilities available in ANSYS SIwave and ANSYS HFSS 3D Layout in 2020 R1. The latest release includes powerful new features for the design of high-speed electronics devices. New capabilities and enhancements focus on signal integrity, power integrity and electromagnetic interference analysis, including:

• EMI Xplorer – new technology to perform “what if” analyses to improve EMI characteristics in real time
• Chip Model Analyzer for system simulations containing cascaded models of ICs, packages and PCB
• Stackup Wizard enhancements
• SIwave simulation with parallel HFSS regions
• Via Backdrill UI
• Multizone PCB support within HFSS 3D Layout [beta]
• Native 3D component support in HFSS 3D Layout designs [beta]
• SIwave AC solver Advanced Coupling Detection
• SIwave/Icepak Package on PCB enhancements

Register now for this webinar detailing all the significant advancements in SIwave in ANSYS 2020 R1.