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3D IC Foundry Frameworks

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3D-IC Foundry Frameworks

July 20, 2023 @ 8:00 AM - 9:00 AM

3D IC Foundry Frameworks

Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks.

TIME:
JULY 20, 2023
11 AM EST

3D-IC Foundry Frameworks3D-IC Foundry Frameworks

About this Webinar

Semiconductor applications such as Mobile (5G), Automotive, and Datacenter (HPC, AI) demand better scaling, performance, and lower power usage. Advanced packaging is moving towards 3DIC systems to address these needs, as evidenced by the technology directions from TSMC, Samsung, and Intel. We’ll present a comprehensive overview of these technologies, and the Ansys flows to address EMIR, Thermal integrity, and mechanical stress challenges posed by these 3DIC systems.

What You Will Learn

  • Advanced 3DIC packaging trends and challenges faced by engineers
  • 3DIC system data flows from P&R to analysis tools
  • EMIR and Thermal Integrity flows using RedHawk SCTM and RedHawk SC ElectroThermalTM

Speakers

3D-IC Foundry Frameworks

Mallik Vusirikala

Mallik Vusirikala is a Director Product Specialist at Ansys, responsible for strategic directions and deployment of the RedHawk product line for Power integrity and related solutions. He has been with Ansys for over 12 years. Prior to that he was with Texas instruments in the CAD flow/ methodology group developing multiple flows for standard cell library creation. He obtained his bachelor’s degree with Honors in Computer Science and Engineering from the National Institute of Technology, Hamirpur (India).

Lang Lin Speaker Headshot

Dr. Lang Lin

Dr. Lang Lin is a principal product manager of Ansys Inc. based in San Jose, California. He is dedicated into developing 3D-IC multiphysics simulation and security verification methodologies to worldwide semiconductor customers. Before joining Ansys, he worked for Intel Corp. as a design engineer. He has published 50+ technical papers and patents, served as reviewer, program committee or tutorial speaker of several IEEE conferences such as HOST, ICCAD, DAC and ASPDAC.

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Details

Date:
July 20, 2023
Time:
8:00 AM - 9:00 AM
Event Tags:
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Website:
https://www.ansys.com/webinars/3d-ic-foundry-frameworks

Organizer

Ansys
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Venue

Online