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Where will Apple Manufacture the next iPhone Brain?

Where will Apple Manufacture the next iPhone Brain?
by Daniel Nenni on 07-17-2013 at 5:00 pm

There still seems to be a lot of confusion here so let me set the record straight. In regards to the Apple Ax SoC, the Apple iPhone 5s will have Samsung 28nm Silicon. Samsung 28nm is still ramping but Samsung can make enough wafers and eat the yield issues no problem. The Apple iPhone 6 in 2014 will have TSMC 20nm as I reported previously.… Read More


The Future of Mobile Semiconductor Devices

The Future of Mobile Semiconductor Devices
by Daniel Nenni on 06-30-2013 at 5:00 pm


During my trip to Taiwan I hopped on over to Hong Kong for a speaking engagement. One of the things I do as an “Internationally Recognized Industry Expert” is help the financial world understand the semiconductor landscape as it pertains to SoCs and mobile devices. Usually I do this over the phone or in writing but I prefer to do it in… Read More


What is inside the iPhone5s? Samsung or TSMC?

What is inside the iPhone5s? Samsung or TSMC?
by Daniel Nenni on 06-26-2013 at 6:00 pm

As a semiconductor professional and an Apple customer I’m very interested to see what is inside the iPhone5s. Rumors are spreading, photos are leaking, creating a nice build up to the next release of the mobile device that changed the world.

Honestly, last year I was a bit disappointed with the iPhone5. Inside is the A6 SoC which uses… Read More


TSMC and Xilinx on the FinFAST Track!

TSMC and Xilinx on the FinFAST Track!
by Daniel Nenni on 06-23-2013 at 2:00 am

The power of the fabless semiconductor ecosystem never ceases to amaze me. On one hand you have the Intel backed press crowing about Intel stealing Altera from TSMC. On the other hand you have Xilinx and TSMC crowing about a new ‘one-team’ approach. If you are interested in the real story you’ve come to the right place.

“Altera’sRead More


Taiwan Semiconductor Tries To Pull A FinFAST One!

Taiwan Semiconductor Tries To Pull A FinFAST One!
by Daniel Nenni on 06-16-2013 at 7:00 pm


This completely misleading title is from a Seeking Alpha (SA) article, a stock investment version of the National Enquirer. As I mentioned inA Call to ARMs, fame and fortune seeking SA Authors make a penny per click so sensationalism sells. The article is not worth your time so I will save you the click and skip to the misguided conclusion:… Read More


Meeting with Sidense at TSMC Technology Symposium

Meeting with Sidense at TSMC Technology Symposium
by Eric Esteve on 06-10-2013 at 11:34 am

If you have attended DAC in Austin (June 2-5), you probably have missed the first TSMC Technology Symposium. It was held on June 6 in Shanghai. Considering my own experience of a 29 hours trip to come back home (in France), I doubt that it was any possible to leave Austin on June 5 to attend TSMC Technology Symposium in Shanghai on June… Read More


The Morphing of Intel’s Monopoly

The Morphing of Intel’s Monopoly
by Ed McKernan on 05-09-2013 at 12:01 am

It was a generation ago when Intel, less than three years old, created the three fundamental building blocks of the compute era: the DRAM, the EPROM and the Microprocessor, an incredible feat of innovation by any measure. Manufacturing yield, not power or performance determined success of failure and in the first two … Read More


IP Quality: Foundation of a Successful Ecosystem

IP Quality: Foundation of a Successful Ecosystem
by Eric Esteve on 05-08-2013 at 8:46 am

Talking about Design IP (I mean successful Design IP) lead you to quickly pronounce the two magic key words: Quality and Ecosystem. Those who remember the IP emergence in the mid 90’s know very well why Quality has to be a prerequisite when dealing with Design IP, as they probably have paid the price of mediocre IP quality at that time.… Read More


How To Design a TSMC 20nm Chip with Cadence Tools

How To Design a TSMC 20nm Chip with Cadence Tools
by Paul McLellan on 05-07-2013 at 8:10 pm

Every process node these days has a new “gotcha” that designers need to be aware of. In some ways this has always been the case but the changes used to be gradual. But now each process node has something discontinuously different. At 20nm the big change is double patterning. At 14/16nm it is FinFET.

Rahul Deokar and John… Read More