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TSMC Banner SemiWiki
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Self-Aligned Via Process Development for Beyond the 3nm Node

Self-Aligned Via Process Development for Beyond the 3nm Node
by Tom Dillinger on 01-05-2022 at 6:00 am

TEM DoD

The further scaling of interconnect and via lithography for advanced nodes is challenged by the requirement to provide a process window that supports post-patterning critical dimension variations and mask overlay tolerances.  At the recent international Electron Devices Meeting (IEDM) in San Francisco, TSMC presented … Read More


Technology Design Co-Optimization for STT-MRAM

Technology Design Co-Optimization for STT-MRAM
by Tom Dillinger on 01-04-2022 at 6:00 am

sense amplifier

Previous SemiWiki articles have described the evolution of embedded non-volatile memory (eNVM) IP from (charge-based) eFlash technology to alternative (resistive) bitcell devices.  (link, link)

The applications for eNVM are vast, and growing.  For example, microcontrollers (MCUs) integrate non-volatile memory for … Read More


Advanced 2.5D/3D Packaging Roadmap

Advanced 2.5D/3D Packaging Roadmap
by Tom Dillinger on 01-03-2022 at 6:00 am

SoIC futures

Frequent SemiWiki readers are no doubt familiar with the advances in packaging technology introduced over the past decade.  At the recent International Electron Devices Meeting (IEDM) in San Francisco, TSMC gave an insightful presentation sharing their vision for packaging roadmap goals and challenges, to address the growing… Read More


US Supply Chain Data Request Elicits a Range of Responses, from Tight-Lipped to Uptight

US Supply Chain Data Request Elicits a Range of Responses, from Tight-Lipped to Uptight
by Craig Addison on 11-14-2021 at 6:00 am

China TSMC Supply chain woes 2021

TSMC drew the ire of Chinese state media last week after it complied with the US Department of Commerce request to submit supply chain data by the November 8 deadline.

The Chinese reports, which called it an act of “surrender” to US hegemony, were careful in laying blame on Taipei for caving in to Washington, rather than pointing fingers… Read More


Taiwan Semiconductor Outlook May 1988

Taiwan Semiconductor Outlook May 1988
by Daniel Nenni on 11-12-2021 at 6:00 am

James E. Dykes

This is an interesting piece of TSMC history. From 1987 to 1988 James E. Dykes served as the first President and Chief Executive Officer of Taiwan Semiconductor Manufacturing Company Ltd.

Taiwan Semiconductor Outlook
by James E. Dykes
President & Chief Executive Officer
Taiwan Semiconductor Manufacturing Company

Given… Read More


Update on TSMC’s 3D Fabric Technology

Update on TSMC’s 3D Fabric Technology
by Tom Dillinger on 11-03-2021 at 8:00 am

3D eTV testchip

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum.  An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).

Overview of 3D Fabric

The TSMC… Read More


On-Chip Sensors Discussed at TSMC OIP

On-Chip Sensors Discussed at TSMC OIP
by Tom Simon on 11-02-2021 at 10:00 am

phase noise correlation

TSMC recently held their Open Innovation Platform (OIP) Ecosystem Forum event where many of their key partners presented on their latest projects and developments. This year one of their top IP provider partners, Analog Bits, gave two presentations. Analog building blocks have always been necessary as enabling technology … Read More


Design Technology Co-Optimization for TSMC’s N3HPC Process

Design Technology Co-Optimization for TSMC’s N3HPC Process
by Tom Dillinger on 11-02-2021 at 8:00 am

N3HPC performance comparison

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum.  An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).

One of the topics that L.C. … Read More


Highlights of the TSMC Open Innovation Platform Ecosystem Forum

Highlights of the TSMC Open Innovation Platform Ecosystem Forum
by Tom Dillinger on 11-01-2021 at 8:00 am

N3 comparison

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem forum.  The talks included a technology and design enablement update from TSMC, as well as specific presentations from OIP partners on the results of recent collaborations with TSMC.  This article summarizes the highlights of the TSMC keynote from… Read More


TSMC Arizona Fab Cost Revisited

TSMC Arizona Fab Cost Revisited
by Scotten Jones on 10-13-2021 at 8:00 am

TSMC North America Fabs

Back in May of 2020 I published some comparisons of the cost to run a TSMC fab in Arizona versus their fabs in Taiwan. I found the fab operating cost based on the country-to-country difference to only be 3.4% higher in the US and then I found an additional 3.8% because of the smaller fab scale. Since that time, I have continued to encounter… Read More