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I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.
James is acknowledged as a leading light in advanced node ASICs, based… Read More
CoWoS-S and CoWoS-R are two versions of TSMC’s Chip-on-Wafer-on-Substrate advanced packaging platform. Both technologies are designed to combine high-performance processors, chiplets and high-bandwidth memory, or HBM, within a single package. This shortens the electrical connections between computing and memory components,… Read More
TSMC’s CoPoS, generally described as Chip-on-Panel-on-Substrate, and Intel’s EMIB, or Embedded Multi-die Interconnect Bridge, address the same strategic problem: integrating increasingly large, heterogeneous chiplet systems. However, they attack different physical constraints. CoPoS is an emerging panel-level … Read More
The “Silicon Shield” describes the idea that Taiwan’s central role in advanced semiconductor manufacturing raises the economic and strategic cost of military action against the island. The shield is not a literal defense system. It is a form of structural deterrence created by technological concentration: governments and… Read More
There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:
Jeff Su: I guess very simply put, EMIB-T, in his view, is… Read More
On the latest investor call the big story was the increase in CAPEX for 2026 and the expected CAPEX for 2027. TSMC raised the CAPEX ceiling for 2026 from US$56 billion to US$64 billion. My guess would be US$64 billion will be spent if not more. We have been discussing this in the SemiWiki Forum and my guess for the 2027 TSMC CAPEX is an incredible… Read More
Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable… Read More
TSMC’s A16 technology, presented as Paper T1.5 at the June 2026 IEEE/JSAP VLSI Symposium, marks the company’s first angstrom-class CMOS platform combining enhanced nanosheet gate-all-around transistors with backside power delivery. The key integration feature is Super Power Rail, or SPR, which TSMC describes as a backside… Read More
The future of work will not be shaped by technology alone. It will be shaped by whether young people are given the confidence, skills, and guidance to participate in that future. This is why the TSMC Charity Foundation’s “Technical and Vocational Talent Empowerment Program” matters. By connecting schools, industry partners,… Read More
Huawei’s assertion that it could match TSMC in producing the world’s most advanced chips by 2031 reflects both technological ambition and geopolitical necessity. As one of China’s leading technology companies, Huawei has faced significant restrictions on access to advanced semiconductor technology due to U.S. export controls.… Read More
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