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SEMICON West 2022 and the Imec Roadmap

SEMICON West 2022 and the Imec Roadmap
by Scotten Jones on 08-03-2022 at 10:00 am

ITFUSA2022 LucVandenhove Page 093

SEMICON West 2022 was held from July 12th to 14th at the Moscone Center in San Francisco.

On Monday the 11th before the show, Imec held a technology forum at the Marriott Marquee right around the corner from the Moscone center. In recent years the Imec forums have shifted away from the process technology I cover to more of a system and… Read More


IEDM 2022 is shaping up

IEDM 2022 is shaping up
by Scotten Jones on 07-17-2022 at 10:00 am

68th iedm color

IEDM is one of the premiere conferences for the latest information on leading edge semiconductor technology. The 68th annual International Electron Devices Meeting will be held December 3rd through 7th at the San Francisco Hilton.

The paper submission deadline is July 14, 2022, and the late-news deadline is August 22, 2022. … Read More


Imec Buried Power Rail and Backside Power Delivery at VLSI

Imec Buried Power Rail and Backside Power Delivery at VLSI
by Scotten Jones on 06-28-2022 at 6:00 am

Imec BPR Page 06

At the VLSI Technology Symposium Imec presented on Buried Power Rails (BPR) and Backside Power Delivery (BSPD) in a paper entitled: “Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails”. I recently had a chance to interview one of the authors, Naoto Horiguchi about the work. I have interviewed … Read More


ASML EUV Update at SPIE

ASML EUV Update at SPIE
by Scotten Jones on 06-24-2022 at 6:00 am

12051 4 SPIE2022 Smeets 0.33 NA EUV systems for High Volume Manufacturing Page 07

At the 2022 SPIE Advanced Lithography Conference, ASML presented an update on EUV. I recently had a chance to go over the presentations with Mike Lercel of ASML. The following is a summary of our discussions.

0.33 NA

The 0.33 NA EUV systems are the production workhorse systems for leading edge lithography today. 0.33 NA systems are… Read More


Intel 4 Deep Dive

Intel 4 Deep Dive
by Scotten Jones on 06-13-2022 at 6:00 am

Figure 1

As I previously wrote about here, Intel is presenting their Intel 4 process at the VLSI Technology conference. Last Wednesday Bernhard Sell (Ben) from Intel gave the press a briefing on the process and provided us with early access to the paper (embargoed until Sunday 6/12).

“Intel 4 CMOS Technology Featuring Advanced FinFET TransistorsRead More


Intel to present Intel 4 process at the VLSI Technology Symposium

Intel to present Intel 4 process at the VLSI Technology Symposium
by Scotten Jones on 05-20-2022 at 8:00 am

VLSI Symposium 2022 SemiWiki 1

The VLSI Symposium on Technology & Circuits will be held in Hawaii from June 12th to June 17th. You can register for the conference here.

The tip sheet for the conference has been released and one thing that caught my eye is some data from the Intel 4 paper that Intel will be presenting at the conference.

Intel’s old roadmap had 14nm,… Read More


The Lost Opportunity for 450mm

The Lost Opportunity for 450mm
by Scotten Jones on 04-15-2022 at 6:00 am

450mm Wafer SemiWiki


I spent several days this week at the SEMI International Strategy Symposium (ISS). One of the talks was “Can the Semiconductor Industry Reach $1T by 2030” given by Bob Johnson of Gartner. His conclusion was, that $1 trillion dollars is an aggressive forecast for 2030 but certainly we should reach $1 trillion dollars in the next 10… Read More


Intel and the EUV Shortage

Intel and the EUV Shortage
by Scotten Jones on 04-13-2022 at 10:00 am

Slide1

In my “The EUV Divide and Intel Foundry Services” article available here, I discussed the looming EUV shortage. Two days ago, Intel announced their first EUV tool installed at their new Fab 34 in Ireland is a tool they moved from Oregon. This is another indication of the scarcity of EUV tools.

I have been tracking EUV system production… Read More


Can Intel Catch TSMC in 2025?

Can Intel Catch TSMC in 2025?
by Scotten Jones on 04-11-2022 at 6:00 am

Slide6

At the ISS conference held from April 4th through 6th I presented on who I thought would have the leading logic technology in 2025. The following is a write up of that presentation.

ISS was a virtual conference in 2021 and I presented on who currently had logic leadership and declared TSMC the clear leader. Following that conference,… Read More


The EUV Divide and Intel Foundry Services

The EUV Divide and Intel Foundry Services
by Scotten Jones on 03-23-2022 at 10:00 am

Intel IDM 2.0 Process Roadmap
The EUV Divide

I was recently updating an analysis I did last year that looked at EUV system supply and demand, while doing this I started thinking about Intel and their Fab portfolio.

If you look at Intel’s history as a microprocessor manufacturer, they are typically ramping up their newest process node (n), in volume production… Read More