In early September of 2016 I published an article “The 2016 Leading Edge Semiconductor Landscape” that proved to be very popular with many views, comments and reposting’s. Since I wrote that article a lot of new data has become available enabling some projections to be replaced by actual values and new analysis… Read More
IEDM 2016 – 7nm Shootout
In the first session of IEDM on Monday, December 5th there were two papers presented on 7nm processes. The first paper was from TSMC and the second paper was from the Global Alliance of GLOBALFOUNDRIES, IBM and Samsung.… Read More
The Status and Future of FDSOI
I recently took a look at the current status and future direction of FinFET based logic processes in my Leading Edge Logic Landscape blog. I thought it would be interesting to take a similar look at FDSOI and to compare and contrast the two processes. My Leading Edge Logic Landscape blog is available here.… Read More
TSMC 16nm, 10nm, 7nm, and 5nm Update!
Word on the street is that TSMC is on schedule with 16FFC, 10nm and 7nm, which is a very big deal for the fabless semiconductor ecosystem. As Scotten Jones has illustrated in the graphic below, for the first time in the history of the semiconductor industry a pure-play foundry (TSMC) will have the process lead over Intel. And this is… Read More
The 2016 Leading Edge Semiconductor Landscape
The leading edge semiconductor logic landscape has in recent years collapsed to just four companies. The following is a summary of what is currently known about each company’s plans and how they compare. ASML has analyzed many logic nodes and developed a formula that normalizes processes to a “standard node”.… Read More
Qualcomm is Back on Top of the SoC World!
In 2015 Qualcomm stunned the fabless semiconductor world with an unprecedented layoff. When I first heard about it the number was 5% but it kept growing and finally hit 15%. The big misstep here was, that after being the SoC leader starting in 2007 with the Snapdragon series of chips that powered the Smartphone revolution, QCOM did… Read More
Foundry Technology Packaging Solutions
A significant shift is underway in the fabless semiconductor business model. As the application markets have become more diverse (and more cost-sensitive), product requirements have necessitated a new focus on multi-die packaging technology. … Read More
STT-MRAM – Coming soon to an SoC near you
An increasing percentage of SoC die area is being allocated to memory arrays, as applications require more data/instruction storage and boot firmware. Indeed, foundries invest considerable R&D resources into optimizing their array technology IP offerings, often with more aggressive device features than used for other… Read More
Highlights of the 28nm FD-SOI San Jose Presentations
Most of the presentations from the FD-SOI Symposium in San Jose last month (April 2016) are now available on the SOI Consortium website (click here to see the full list — if they’re posted, you can download them freely from there). If you don’t have time to wade through them all, here are some of the highlights. … Read More
Why is NXP Moving to FD-SOI?
The latest generations of power efficient and full-featured applications processors in NXP’s very successful and broadly deployed i.MX platform are being manufactured on 28nm FD-SOI. The new i.MX 7 series leverages the 32-bit ARM v7-A core, targeting the general embedded, e-reader, medical, wearable and IoT markets, where… Read More
ASML and TSMC’s 12-Inch Photomask Initiative: Technical Significance