Device Packaging Conference 2027

ADVANCED PACKAGING FOR SCALABLE AI: CONNECTING COMPUTE, MEMORY, POWER AND PHOTONICS

Sheraton Grand at Wild Horse Pass
Phoenix, Arizona
March 1-4, 2027

The 23rd Annual IMAPS Device Packaging Conference (DPC 2027) will be held in Phoenix, Arizona, on March 1-4, 2027. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals. The 2027 conference will feature technical tracks on many high-importance topics related to the scaling of artificial intelligence and the major role advanced packaging plays in this field. Track topics will cover Heterogeneous and 3D integration, large form factor and high-performance packages, RF data communications and Co-packaged optics, thermal and reliability management for AI compute systems and many more topics relevant to today and tomorrow’s AI scaling efforts. The conference will further feature 4 keynote presentations, an embedded Global Business Council Plenary Session, an interactive poster session, an evening panel discussion, and more.

REGISTER HERE