Whenever a new partnership is announced, the natural question is, “why?” What will this partnership make possible that wasn’t already possible with those two companies working independently? I talked yesterday with Frank Schirrmeister of Arteris on the partnership. (Yes, Frank is now at Arteris). And I just got off an Arm press… Read More
Semiconductor Intellectual Property
Arm 2022 Neoverse Update, Roadmap
Arm recently provided their annual update on the Neoverse product line, targeting infrastructure from cloud to communication to the edge. Chris Bergey (SVP and GM for infrastructure) led the update, starting with a shock-and-awe pitch on Neoverse deployment. He played up that Arm-based servers are now in every major public … Read More
Die-to-Die Interconnects using Bunch of Wires (BoW)
Chiplets are a popular and trending topic in the semiconductor trade press, and I read about SoC disaggregation at shows like ISSCC, Hot Chips, DAC and others. Once an SoC is disaggregated, the next challenge is deciding on the die-to-die interconnect approach. The Open Compute Project (OCP) started 10 years ago as a way to share… Read More
Verification IP Hastens the Design of CXL 3.0
Although version 2.0 of the Computer Express Link (CXL) standard is just making it into new designs, the next generation, version 3.0, has been approved and is now ready for designers to implement the new silicon and firmware needed to meet the new standard’s performance specifications. CXL, an open industry-standard interconnect,… Read More
WEBINAR: O-RAN Fronthaul Transport Security using MACsec
5G provides a range of improvements compared to existing 4G LTE mobile networks in regards to capacity, speed, latency and security. One of the main improvements is in the 5G RAN; it is based on a virtualized architecture where functions can be centralized close to the 5G core for economy or distributed as close to the edge as possible… Read More
Podcast EP107: The Impact of Arteris IP and Its Partnerships on the Automotive Industry and Beyond
Dan is joined by Michal Siwinski, Chief Marketing Officer for Arteris IP. Arteris provides network-on-chip interconnect semiconductor IP and deployment technology to accelerate SoC development and integration for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers.… Read More
Ultra-efficient heterogeneous SoCs for Level 5 self-driving
The latest advanced driver-assistance systems (ADAS) like Mercedes’ Drive Pilot and Tesla’s FSD perform SAE Level 3 self-driving, with the driver ready to take back control if the vehicle calls for it. Reaching Level 5 – full, unconditional autonomy – means facing a new class of challenges unsolvable with existing technology… Read More
Truechip: Customer Shipment of CXL3 VIP and CXL Switch Model
The tremendous amount of data generated by AI/ML driven applications and other hyperscale computing applications have forced the age old server architecture to change. The new architecture is driven by the resource disaggregation paradigm, wherein memory and storage are decoupled from the host CPU and managed independently… Read More
WEBINAR: Unlock your Chips’ Full Data Transfer Potential with Interlaken
Way back in the early 2000s when XAUI was falling short on link flexibility a search for an alternative chip-to-chip data transfer interface with SPI like features lead Cisco Systems and Cortina System to put forward the proposal for the Interlaken standard. The new standard married the best of XAUI’s serialized data and SPI’s … Read More
CEO Interview: Jan Peter Berns from Hyperstone
Since 2012, Dr. Jan Peter Berns is the CEO of Hyperstone, a producer of Flash Memory Controllers for Industrially Embedded Storage Solutions. Before that, he held a Senior Manager Position at Toshiba Electronics for several years. Jan Peter brings more than 20 years of management and executive experience in the semiconductor… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging