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Arm and Arteris Partner on Automotive

Arm and Arteris Partner on Automotive
by Bernard Murphy on 09-28-2022 at 6:00 am

Arteris Arm partnership

Whenever a new partnership is announced, the natural question is, “why?” What will this partnership make possible that wasn’t already possible with those two companies working independently? I talked yesterday with Frank Schirrmeister of Arteris on the partnership. (Yes, Frank is now at Arteris). And I just got off an Arm press… Read More


Arm 2022 Neoverse Update, Roadmap

Arm 2022 Neoverse Update, Roadmap
by Bernard Murphy on 09-27-2022 at 6:00 am

Neoverse update min

Arm recently provided their annual update on the Neoverse product line, targeting infrastructure from cloud to communication to the edge. Chris Bergey (SVP and GM for infrastructure) led the update, starting with a shock-and-awe pitch on Neoverse deployment. He played up that Arm-based servers are now in every major public … Read More


Die-to-Die Interconnects using Bunch of Wires (BoW)

Die-to-Die Interconnects using Bunch of Wires (BoW)
by Daniel Payne on 09-21-2022 at 10:00 am

BoW min

Chiplets are a popular and trending topic in the semiconductor trade press, and I read about  SoC disaggregation at shows like ISSCC, Hot Chips, DAC and others. Once an SoC is disaggregated, the next challenge is deciding on the die-to-die interconnect approach. The Open Compute Project (OCP) started 10 years ago as a way to share… Read More


Verification IP Hastens the Design of CXL 3.0

Verification IP Hastens the Design of CXL 3.0
by Dave Bursky on 09-21-2022 at 6:00 am

cxl standards 1

Although version 2.0 of the Computer Express Link (CXL) standard is just making it into new designs, the next generation, version 3.0, has been approved and is now ready for designers to implement the new silicon and firmware needed to meet the new standard’s performance specifications. CXL, an open industry-standard interconnect,… Read More


WEBINAR: O-RAN Fronthaul Transport Security using MACsec

WEBINAR: O-RAN Fronthaul Transport Security using MACsec
by Daniel Nenni on 09-19-2022 at 10:00 am

Commcore OMAC Webinar

5G provides a range of improvements compared to existing 4G LTE mobile networks in regards to capacity, speed, latency and security. One of the main improvements is in the 5G RAN; it is based on a virtualized architecture where functions can be centralized close to the 5G core for economy or distributed as close to the edge as possible… Read More


Podcast EP107: The Impact of Arteris IP and Its Partnerships on the Automotive Industry and Beyond

Podcast EP107: The Impact of Arteris IP and Its Partnerships on the Automotive Industry and Beyond
by Daniel Nenni on 09-16-2022 at 10:00 am

Dan is joined by Michal Siwinski, Chief Marketing Officer for Arteris IP. Arteris provides network-on-chip interconnect semiconductor IP and deployment technology to accelerate SoC development and integration for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers.… Read More


Ultra-efficient heterogeneous SoCs for Level 5 self-driving

Ultra-efficient heterogeneous SoCs for Level 5 self-driving
by Don Dingee on 09-14-2022 at 6:00 am

Ultra-efficient heterogeneous SoCs target the AI processing pipeline for Level 5 self-driving

The latest advanced driver-assistance systems (ADAS) like Mercedes’ Drive Pilot and Tesla’s FSD perform SAE Level 3 self-driving, with the driver ready to take back control if the vehicle calls for it. Reaching Level 5 – full, unconditional autonomy – means facing a new class of challenges unsolvable with existing technology… Read More


Truechip: Customer Shipment of CXL3 VIP and CXL Switch Model

Truechip: Customer Shipment of CXL3 VIP and CXL Switch Model
by Kalar Rajendiran on 09-12-2022 at 10:00 am

CXL Block Diagram

The tremendous amount of data generated by AI/ML driven applications and other hyperscale computing applications have forced the age old server architecture to change. The new architecture is driven by the resource disaggregation paradigm, wherein memory and storage are decoupled from the host CPU and managed independently… Read More


WEBINAR: Unlock your Chips’ Full Data Transfer Potential with Interlaken

WEBINAR: Unlock your Chips’ Full Data Transfer Potential with Interlaken
by Daniel Nenni on 09-12-2022 at 6:00 am

Interlaken Blog Post Graphic

Way back in the early 2000s when XAUI was falling short on link flexibility a search for an alternative chip-to-chip data transfer interface with SPI like features lead Cisco Systems and Cortina System to put forward the proposal for the Interlaken standard. The new standard married the best of XAUI’s serialized data and SPI’s … Read More


CEO Interview: Jan Peter Berns from Hyperstone

CEO Interview: Jan Peter Berns from Hyperstone
by Daniel Nenni on 09-09-2022 at 6:00 am

DSCF07001

Since 2012, Dr. Jan Peter Berns is the CEO of Hyperstone, a producer of Flash Memory Controllers for Industrially Embedded Storage Solutions. Before that, he held a Senior Manager Position at Toshiba Electronics for several years. Jan Peter brings more than 20 years of management and executive experience in the semiconductor… Read More