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Will we see DDR5 memory (device) and memory controller (IP) in the near future? According with Cadence who has released the first test chip in the industry integrating DDR5 memory controller IP, fabricated in TSMC’s 7nm process and achieving a 4400 megatransfers per second (MT/sec) data rate, the answer is clearly YES !
Let’s come… Read More
It was 1988 when I got into SPICE (Simulation Program with Integrated Circuit Emphasis)while I was characterizing a 1.5 μm Standard cell library developed by students at my Alma-Mata Furtwangen University in Germany. My professor Dr. Nielinger was not only my advisor he also wrote the first SPICE bible in German language.… Read More
At TSMC 2018 Silcon Valley Technology Symposium, Dr Kevin Zhang, TSMC VP of Business Development covered technology updates for IoT platform. The three growth drivers in this segment namely TSMC low power, RF enhancement and embedded memory technology (MRAM/RRAM) reinforced both progress and growth in global semiconductor… Read More
During TSMC 2018 Technology Symposium, Dr. B.J. Woo, TSMC VP of Business Development presented market trends in the area of mobile applications and HPC computing as well as shared TSMC progress in making breakthrough efforts in the technology offerings to serve these two market segments.
Both 5G and AI are taking the center stage… Read More
Here are the Top 10 highlights from the recent TSMC 2018 Technology Symposium, held in Santa Clara CA. A couple of years ago, TSMC acknowledged the unique requirements of 4 different market segments, which has since guided their process development strategy — Mobile, High-Performance Computing (HPC), Automotive, and… Read More
I got a tip sheet today for the upcoming 2018 Symposia on VLSI Technology & Circuits to be held June 19th through 21st in Honolulu, Hawaii. There is some interesting information on Samsung’s 10nm, 8nm and 7nm processes in the tip sheet:… Read More
I wrote recently about a yield problem which mobile vendors have been finding for devices built in advanced technologies. This was a performance issue (the devices worked fine at lower clock speeds), pointing to a discrepancy in some devices between predicted and observed timing. These were experienced design teams, using state… Read More
One of the more frequent questions I get, “What is next after FinFETs?” is finally getting answered. Thankfully I am surrounded by experts in the process technology field including Scotten Jones of IC Knowledge. I am also surrounded by design enablement experts so I really am the man in the middle which brings us to a discussion between… Read More
On their first quarter earnings call Intel announced that volume production of 10nm has been moved from the second half of 2018 to 2019 due to yield issues. Specifically, they are shipping 10nm in low volume now, but yield improvement has been slower than anticipated. They report that they understand the yield issues but that improvements… Read More
Have you ever wondered how process variation, thermal self-heating and Vdd levels affect the timing and yield of your SoC design? If you’re clock specification calls for 3GHz, while your silicon is only yielding at 2.4GHz, then you have a big problem on your hands. Such are the concerns of many modern day chip designers. To… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay