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Welcome DDR5 and Thanks to Cadence IP and Test Chip

Welcome DDR5 and Thanks to Cadence IP and Test Chip
by Eric Esteve on 05-25-2018 at 7:00 am

Will we see DDR5 memory (device) and memory controller (IP) in the near future? According with Cadence who has released the first test chip in the industry integrating DDR5 memory controller IP, fabricated in TSMC’s 7nm process and achieving a 4400 megatransfers per second (MT/sec) data rate, the answer is clearly YES !

Let’s come… Read More


SPICE Model Generation by Machine Learning

SPICE Model Generation by Machine Learning
by Thomas Blaesi on 05-18-2018 at 12:00 pm

It was 1988 when I got into SPICE (Simulation Program with Integrated Circuit Emphasis)while I was characterizing a 1.5 μm Standard cell library developed by students at my Alma-Mata Furtwangen University in Germany. My professor Dr. Nielinger was not only my advisor he also wrote the first SPICE bible in German language.… Read More


TSMC Technologies for IoT and Automotive

TSMC Technologies for IoT and Automotive
by Alex Tan on 05-15-2018 at 12:00 pm

At TSMC 2018 Silcon Valley Technology Symposium, Dr Kevin Zhang, TSMC VP of Business Development covered technology updates for IoT platform. The three growth drivers in this segment namely TSMC low power, RF enhancement and embedded memory technology (MRAM/RRAM) reinforced both progress and growth in global semiconductorRead More


TSMC Technologies for Mobile and HPC

TSMC Technologies for Mobile and HPC
by Alex Tan on 05-10-2018 at 12:00 pm

During TSMC 2018 Technology Symposium, Dr. B.J. Woo, TSMC VP of Business Development presented market trends in the area of mobile applications and HPC computing as well as shared TSMC progress in making breakthrough efforts in the technology offerings to serve these two market segments.

Both 5G and AI are taking the center stage… Read More


Top 10 Highlights of the TSMC 2018 Technology Symposium

Top 10 Highlights of the TSMC 2018 Technology Symposium
by Tom Dillinger on 05-04-2018 at 12:00 pm

Here are the Top 10 highlights from the recent TSMC 2018 Technology Symposium, held in Santa Clara CA. A couple of years ago, TSMC acknowledged the unique requirements of 4 different market segments, which has since guided their process development strategy — Mobile, High-Performance Computing (HPC), Automotive, and… Read More


Samsung 10nm 8nm and 7nm at VLSIT

Samsung 10nm 8nm and 7nm at VLSIT
by Scotten Jones on 05-04-2018 at 7:00 am

I got a tip sheet today for the upcoming 2018 Symposia on VLSI Technology & Circuits to be held June 19th through 21st in Honolulu, Hawaii. There is some interesting information on Samsung’s 10nm, 8nm and 7nm processes in the tip sheet:… Read More


Peering Over the Timing Edge

Peering Over the Timing Edge
by Bernard Murphy on 05-03-2018 at 7:00 am

I wrote recently about a yield problem which mobile vendors have been finding for devices built in advanced technologies. This was a performance issue (the devices worked fine at lower clock speeds), pointing to a discrepancy in some devices between predicted and observed timing. These were experienced design teams, using state… Read More


imec and Cadence on 3nm

imec and Cadence on 3nm
by Daniel Nenni on 04-30-2018 at 7:00 am

One of the more frequent questions I get, “What is next after FinFETs?” is finally getting answered. Thankfully I am surrounded by experts in the process technology field including Scotten Jones of IC Knowledge. I am also surrounded by design enablement experts so I really am the man in the middle which brings us to a discussion between… Read More


Intel 10nm Yield Issues

Intel 10nm Yield Issues
by Scotten Jones on 04-29-2018 at 4:00 pm

On their first quarter earnings call Intel announced that volume production of 10nm has been moved from the second half of 2018 to 2019 due to yield issues. Specifically, they are shipping 10nm in low volume now, but yield improvement has been slower than anticipated. They report that they understand the yield issues but that improvements… Read More


Monitoring Process, Voltage and Temperature in SoCs, webinar recap

Monitoring Process, Voltage and Temperature in SoCs, webinar recap
by Daniel Payne on 04-26-2018 at 4:00 pm

Have you ever wondered how process variation, thermal self-heating and Vdd levels affect the timing and yield of your SoC design? If you’re clock specification calls for 3GHz, while your silicon is only yielding at 2.4GHz, then you have a big problem on your hands. Such are the concerns of many modern day chip designers. To… Read More