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FinFET Standard Cells at DAC

FinFET Standard Cells at DAC
by Daniel Payne on 06-25-2012 at 11:45 am

Rajiv Bhateja, Dhrumil Gandhi and Neal Carney met with me at DAC on Wednesday to give an update on what’s new in 2012 for Tela Innovations, a provider of lithography optimized IP and tools. This team has a rich history in EDA and IP from companies like: ARM, Artisan, Mentor Graphics and Silicon Compilers.… Read More


Finding RTL Bugs Live Using Formal Techniques

Finding RTL Bugs Live Using Formal Techniques
by Daniel Payne on 06-24-2012 at 8:10 pm

Most of what you see at DAC is canned PowerPoint presentations, however on Tuesday afternoon I spotted a company called Oski Technology that was doing something almost unheard of – they had an engineer debugging a digital design from Nvidia using formal tools live. I later found out the engineer found 4 bugs in just three days… Read More


3D Thermal and Mechanical Stress for IC Packaging

3D Thermal and Mechanical Stress for IC Packaging
by Daniel Payne on 06-19-2012 at 8:02 pm

3D has been a growing buzz word in IC design and packaging for several years now, so it’s refreshing to actually find an EDA vendor that has developed tools to help analyze something like 3D thermal and mechanical stress at DAC. … Read More


From SPICE Netlist back to Schematics at DAC

From SPICE Netlist back to Schematics at DAC
by Daniel Payne on 06-11-2012 at 5:22 pm

I first heard about SPICE Vision Pro when working at Mentor Graphics where we needed a way to visualize SPICE netlists and debug SPICE simulation results node by node on a design where we didn’t have the original schematics. Last Monday I met the engineers from Concept Engineering in their booth at DAC to get an update, Gerhard… Read More


Fast Monte Carlo and Analog Fast SPICE

Fast Monte Carlo and Analog Fast SPICE
by Daniel Payne on 06-08-2012 at 10:25 am

Britto Vincent of ProPlus Design Solutions met with me at DAC on Monday morning to talk about Design For Yield (DFY) and Analog Fast SPICE.
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In 2011 ProPlus announced DFY tools where the technology came from IBM, it provides fast Monte Carlo results up to 3 sigma, then added NanoSpice for faster simulation results. Similar… Read More