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DesignCon 2023 Panel Photonics future: the vision, the challenge, and the path to infinity & beyond!

DesignCon 2023 Panel Photonics future: the vision, the challenge, and the path to infinity & beyond!
by Raha Vafaei on 02-28-2023 at 6:00 am

Image 1 1

The explosion in volume and consumption of data, fueled by industry trends in virtualization, networking, and computing among others, continues to push photonic solutions forward into leading positions. On Feb 2nd, I attended a panel by Ansys at DesignCon that brought together industry experts from Intel, GlobalFoundries,… Read More


Exponential Innovation: HFSS

Exponential Innovation: HFSS
by Matt Commens on 02-21-2023 at 10:00 am

evolution of hfss simulation capacity

The old adage: “If it ain’t broke, don’t fix it,” is as offensive to innovators as it is to grammarians. Just because something works well, doesn’t mean it cannot work better. As times change and technology advances, you either move forward or get left behind.

If you haven’t upgraded to the latest Ansys HFSS electromagnetic simulation… Read More


IDEAS Online Technical Conference Features Intel, Qualcomm, Nvidia, IBM, Samsung, and More Discussing Chip Design Experiences

IDEAS Online Technical Conference Features Intel, Qualcomm, Nvidia, IBM, Samsung, and More Discussing Chip Design Experiences
by Daniel Nenni on 11-29-2022 at 10:00 am

IDEAS 2022 Just Topics Icon

Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics.

See the full online conference agenda and list of speakers at www.ansys.com/IDEAS. The free registration will… Read More


Whatever Happened to the Big 5G Airport Controversy? Plus A Look To The Future

Whatever Happened to the Big 5G Airport Controversy? Plus A Look To The Future
by Josh Salant on 09-28-2022 at 10:00 am

Figure1 2

In December 2021, just weeks before Verizon and AT&T were set to enable their new radio access networks in the 5G mid-band spectrum (also known as C-Band), the Federal Aviation Administration (FAA) released a Special Airworthiness Information Bulletin (SAIB) and a statement notifying operators of potential 5G interference… Read More


Ansys’ Emergence as a Tier 1 EDA Player— and What That Means for 3D-IC

Ansys’ Emergence as a Tier 1 EDA Player— and What That Means for 3D-IC
by Daniel Nenni on 09-20-2022 at 10:00 am

Ansys chip package board

Over its 40+ year history, electronic design automation (EDA) has seen many companies rise, fall, and merge. In the beginning, in the 1980s, the industry was dominated by what came to be known as the big three — Daisy Systems, Mentor Graphics, and Valid Logic (the infamous “DMV”). The Big 3 has morphed over the years, eventually settling… Read More


WEBINAR: Design and Verify State-of-the-Art RFICs using Synopsys / Ansys Custom Design Flow

WEBINAR: Design and Verify State-of-the-Art RFICs using Synopsys / Ansys Custom Design Flow
by Synopsys on 08-11-2022 at 8:00 am

Synopsys Ansys RF Flow Webinar

The design and characterization of RF circuits is a complex process that requires an RF designer to overcome a variety of challenges. Not only do they face the complexities posed by advanced semiconductor processes and the need to meet the demanding requirements of modern wireless standards, designers must also account for electromagnetic… Read More


What Quantum Means for Electronic Design Automation

What Quantum Means for Electronic Design Automation
by Kelly Damalou and Kostas Nikellis on 07-06-2022 at 10:00 am

Ansys quantum blog Image1

In 1982, Richard Feynman, a theoretical physicist and Nobel Prize winner, proposed the initial quantum computer; Feynman’s quantum computer would have the capacity to facilitate traditional algorithms and quantum circuits with the goal of simulating quantum behavior as it would have occurred in nature. The systems Feynman… Read More


The Lines Are Blurring Between System and Silicon. You’re Not Ready.

The Lines Are Blurring Between System and Silicon. You’re Not Ready.
by Daniel Nenni on 07-01-2022 at 8:00 am

3D Memory HBM Ansys

3D-ICs bring together multiple silicon dies into a single package that’s significantly larger and complex than traditional systems on a chip (SoCs). There’s no doubt these innovative designs are revolutionizing the semiconductor industry.

3D-ICs offer a variety of performance advantages over traditional SoCs. Because … Read More


Multiphysics, Multivariate Analysis: An Imperative for Today’s 3D-IC Designs

Multiphysics, Multivariate Analysis: An Imperative for Today’s 3D-IC Designs
by Daniel Nenni on 06-26-2022 at 6:00 am

Ansys Heat Map

Semiconductor manufacturers are under constantly increasing and intense pressure to accelerate innovative new chip designs to market faster than ever in smaller package sizes while assuring signal integrity and reducing power consumption. Three-dimensional integrated circuits (3D-ICs) promise to answer all these demands… Read More


A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today

A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today
by John Lee on 06-14-2022 at 6:00 am

RedHawk SC uses Ansys SeaScape Big Data Platform Designed for EDA Applications

For the past few decades, System-on-Chip (SoC) has been the gold standard for optimizing the performance and cost of electronic systems. Pulling together practically all of a smartphone’s digital and analog capabilities into a monolithic chip, the mobile application processor serves as a near-perfect example of an SoC. But… Read More