Networking at 52nd DAC in SFO

Networking at 52nd DAC in SFO
by Daniel Payne on 04-19-2015 at 7:00 pm

Yes, the 52nd DAC(Design Automation Conference) is a technical conference plus exhibition with wonderful keynote speakers and agenda, however there is a certain serendipity that occurs by just meeting people, face to face at the many networking opportunities. The best way to kick off your DAC experience is by attending the Sunday… Read More


Will your next SoC fail because of power noise integrity in IP blocks?

Will your next SoC fail because of power noise integrity in IP blocks?
by Daniel Payne on 04-14-2015 at 5:00 pm

By the time that your SoC comes back from the fab and you plugin it into a socket on a board for testing, it’s a little late in the cycle to start thinking about reliability concerns like: dynamic voltage drop, noise coupling, EM (Electro-Migration), self-heating, thermal analysis and ESD (Electro-Static Discharge). They… Read More


What is Inside of the Samsung Galaxy S6?

What is Inside of the Samsung Galaxy S6?
by Daniel Payne on 04-06-2015 at 1:00 pm

I’ve always been curious about what is inside an electronic device, and it was seeing the very first TI handheld calculator that got me started into a career as an Electrical Engineer. Next to Apple, the most popular brand in smart phone devices these days has got to be Samsung and they have just launched the Galaxy S6 device.… Read More


Verifying the RTL Coming out of a High-Level Synthesis Tool

Verifying the RTL Coming out of a High-Level Synthesis Tool
by Daniel Payne on 03-30-2015 at 9:30 pm

With High-Level Synthesis (HLS) the first benefit that comes to my mind is reduced design time, because coding with C or SystemC is more efficient than low-level RTL code. What I’ve just learned is that there’s another benefit, a reduction in the amount of functional simulation required. One HLS customer was able … Read More


Verification IP for PCIe and AXI4

Verification IP for PCIe and AXI4
by Daniel Payne on 03-26-2015 at 2:00 pm

Engineers love acronyms and my latest blog post has three acronyms in the title alone, so hopefully you are doing or considering SoC designs with the AMBA AXI4(Advanced eXtensible Interface 4) interface specification along with PCI Express (Peripheral Component Interconnect Express). One big motivation for using semiconductor… Read More


Webinar: Choosing IP for your next IoT Design

Webinar: Choosing IP for your next IoT Design
by Daniel Payne on 03-17-2015 at 8:00 pm

My favorite IoT device is a cycle-computer from CatEyeand it has GPS for tracking my bike routes, and an LCD display that shows me speed, cadence, heart rate and time. After each ride I connect my CatEye device to a USB connector, upload my data to Strava.com, and then see how I’m doing versus other cyclists and my own personal… Read More


FinFET Design Enablement

FinFET Design Enablement
by Daniel Payne on 03-10-2015 at 1:00 pm

We read about FinFET technology in the semiconductor press daily now, thanks to Intel introducing their TriGate transistors starting in 2011 and creating a race with foundries and IDMs to switch from planar CMOS nodes. To get some perspective about the progress of FinFET IP and EDA tools I spoke with two experts from Synopsys, Swami… Read More


Apple Watch Announcement

Apple Watch Announcement
by Daniel Payne on 03-09-2015 at 1:00 pm

Rock music, invitation only tickets, hollywood lighting, journalists from around the world, live streaming on the web, yes, another typical Apple-orchestrated product launch on Monday, March 9th at the Yerba Buena Center in California.

Up first was a video about Apple’s store opening in West Lake China with superb cinematography.… Read More


Blogging for Consultants

Blogging for Consultants
by Daniel Payne on 03-05-2015 at 9:00 pm

Paul McLellan wrote about how he stumbled into blogging and it inspired me to share my story as well. I grew up in Minnesota and attended the U of Minnesota earning a bachelor’s degree in Electrical Engineering so that I could design computer chips. After interviewing in 1978 with HP, IBM, Intel and Motorola I decided to join… Read More


Faster ECOs Using Formal Analysis

Faster ECOs Using Formal Analysis
by Daniel Payne on 02-28-2015 at 7:00 am

Your latest SoC has just begun the tape-out process and then marketing comes back with a small update to the specification to make your design more competitive, or maybe your regression tests just found a minor bug in a single IP block that needs to be fixed. Should you go back in your design flow, change the RTL source code and then completely… Read More