Three Key Takeaways from the 2022 TSMC Technical Symposium!The TSMC Technical Symposium is today so I…Read More
HLS in a Stanford Edge ML Accelerator DesignI wrote recently about Siemens EDA’s philosophy on…Read More
A Different Perspective: Ansys’ View on the Central Issues Driving EDA TodayFor the past few decades, System-on-Chip (SoC) has…Read More
Dan is joined by Mahesh Turaga, VP of Cloud Business Development at Cadence Design Systems. Mahesh brings extensive customer-facing experience to Cadence in business development, strategy, pre-sales, and consulting. He provides an overview of the cloud solutions provided by Cadence. The various business models, technical… Read More
At the 2022 SPIE Advanced Lithography Conference, ASML presented an update on EUV. I recently had a chance to go over the presentations with Mike Lercel of ASML. The following is a summary of our discussions.
The 0.33 NA EUV systems are the production workhorse systems for leading edge lithography today. 0.33 NA systems are… Read More
Our laptops and desktop computers have billions of transistors in their application processor chips, yet I often don’t consider the reliability effects of aging that the transistors experience in the chips. At the recent Synopsys User Group (aka SNUG), there was a technical presentation on this topic from Srinivas Bodapati,… Read More
It is common when a new type of analysis is introduced in almost any domain that it works well enough for a while. Until it begins to struggle with growing problem size, prompting refinements to the methodology to allow continued scaling. We see this routinely in analytics for SoC design, so it should not be a big surprise that safety… Read More
Dan is joined by CK Phua of NXP. CK joined Philips Semiconductors in 1993 and worked in various roles including quality, applications engineering, product engineering and technical marketing. After Philips, CK joined Freescale in 2012 and rejoined NXP through the Freescale merger. CK is now a Product Manager for Microcontrollers… Read More
TSMC recently held their annual Technology Symposium in Santa Clara, CA. The presentations provided a comprehensive overview of their status and upcoming roadmap, covering all facets of process technology and advanced packaging development. This article will summarize the highlights of the process technology updates… Read More
Qualcomm is a common name in mobile industry for chips. The company has generated $33 billion in revenue in 2021 and continues to march ahead with its innovations. However, Qualcomm doesn’t get the same visibility and mention as Nvidia and Intel in the world of AI chips. By our estimate, Qualcomm’s contribution to … Read More
I’ve written several articles on High-Level Synthesis (HLS), designing in C, C++ or SystemC, then synthesizing to RTL. There is unquestionable appeal to the concept. A higher level of abstraction enables a function to be described in less lines of code (LOC). Which immediately offers higher productivity and implies less bugs… Read More
The burgeoning use of conversational artificial intelligence (CAI) in consumer and business applications places a heavy computational burden on both front-end and back-end systems that provide the natural language processing (NLP). NLP systems rely on deep learning (a subset of machine learning) to automate speech recognition,… Read More
For many decades now, modern optical technology has been deployed in networking infrastructure, for long haul and medium haul links to support internet communications. The foundation of this technology is photonics, which is the science of generation, manipulation and detection of light for performing functions otherwise… Read More
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