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SystemReady Certified: Ensuring Effortless Out-of-the-Box Arm Processor Deployments

SystemReady Certified: Ensuring Effortless Out-of-the-Box Arm Processor Deployments
by Lauro Rizzatti on 12-05-2024 at 10:00 am

SystemReady Certified Ensuring Out of the Box Effortless Arm Processors Deployments Figure 1

When contemplating the Lego-like hardware and software structure of a leading system-on-chip (SoC) design, a mathematically inclined mind might marvel at the tantalizing array of combinatorial possibilities among its hardware and software components. In contrast, the engineering team tasked with its validation may have… Read More


PDF Solutions Hosts Executive Conference December 12 on AI’s Power to Transform Semiconductor Design and Manufacturing

PDF Solutions Hosts Executive Conference December 12 on AI’s Power to Transform Semiconductor Design and Manufacturing
by Daniel Nenni on 12-05-2024 at 6:00 am

PDF Solutions LI Post on Conference

PDF Solutions, Inc. will host an AI Executive Conference Thursday, December 12, in San Francisco featuring keynotes, presentations, panels and demonstrations offering insights into the power of AI to transform semiconductor design and manufacturing. The conference immediately follows the 70th Annual IEEE International… Read More


Accelerating Electric Vehicle Development – Through Integrated Design Flow for Power Modules

Accelerating Electric Vehicle Development – Through Integrated Design Flow for Power Modules
by Kalar Rajendiran on 12-04-2024 at 10:00 am

Existing EV Power Module Flow

The development of electric vehicles (EVs) is key to transitioning to sustainable transportation. However, designing high-performance EVs presents significant challenges, particularly in power module design. Power modules, including inverters, bulky DC capacitors, power management ICs (PMICs), and battery packs, … Read More


A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design

A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design
by Mike Gianfagna on 12-04-2024 at 6:00 am

A Master Class with Ansys and Synopsys, The Latest Advances in Multi Die Design

2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More


SystemC Update 2024

SystemC Update 2024
by Daniel Payne on 12-03-2024 at 10:00 am

SystemC ecosystem min

SystemC version 1.0 came out in 2000 as a C++ class library for system-level modeling and simulation, and on SemiWiki.com there are some 497 references to the language. I wanted to provide an update in this blog so that engineering teams can become more efficient in using SystemC on their SoC projects, saving time and improving product… Read More


Innexis Product Suite: Driving Shift Left in IC Design and Systems Development

Innexis Product Suite: Driving Shift Left in IC Design and Systems Development
by Kalar Rajendiran on 12-03-2024 at 6:00 am

Full Spectrum Development Inexis Developer Pro

At the heart of the shift-left strategy is the goal of moving traditionally late-stage tasks—such as software development, validation, and optimization—earlier in the design process. This proactive approach allows teams to identify and resolve issues before they escalate, reducing costly rework and shortening the overall… Read More


How Breker is Helping to Solve the RISC-V Certification Problem

How Breker is Helping to Solve the RISC-V Certification Problem
by Mike Gianfagna on 12-02-2024 at 10:00 am

How Breker is Helping to Solve the RISC V Certification Problem

RISC-V cores are popping up everywhere. The growth of this open instruction set architecture (ISA) was quite evident at the recent RISC-V summit. You can check out some of the RISC-V buzz on SemiWiki here. While all this is quite exciting and encouraging, there are hurdles to face before true prime-time, ubiquitous application… Read More


CEO Interview: Ollie Jones of Sondrel

CEO Interview: Ollie Jones of Sondrel
by Daniel Nenni on 12-02-2024 at 6:00 am

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Sondrel has just appointed a new CEO, Ollie Jones, so we had a chat with him to find out his vision for the company.

Ollie is a highly driven, commercially astute senior leader with 20+ years Commercial and Business Development experience across Technology and Engineering sectors.

Ollie has worked extensively across Europe, North… Read More


Podcast EP263: The Current and Future Impact of the CHIPS and Science Act with Sanjay Kumar

Podcast EP263: The Current and Future Impact of the CHIPS and Science Act with Sanjay Kumar
by Daniel Nenni on 11-29-2024 at 10:00 am

Dan is joined by Sanjay Kumar. Most recently, Sanjay was senior director at the Department of Commerce on the team implementing the CHIPS and Science Act. Before that, he was in the industry for more than 20 years, up and down the semiconductor value chain working at systems companies such as Meta, fabless companies such as Infineon,… Read More


CEO Interview: Dr. Yunji Corcoran of SMC Diode Solutions

CEO Interview: Dr. Yunji Corcoran of SMC Diode Solutions
by Daniel Nenni on 11-29-2024 at 6:00 am

Dr. Yunji Corcoran (1)

Dr. Yunji Corcoran is the Chairwoman and CEO of SMC Diode Solutions. Dr. Corcoran has managed a successful career in the power semiconductor field for over 30 years, specializing in design, manufacturing, and global sales. She holds a bachelor’s degree in physics from Nanjing University and a PhD in semiconductor materials from… Read More