Daniel is joined by Jake Canon, senior business development engineer at Toshiba America Electronic Components. Jake is an enthusiastic contributor to the semiconductor industry and has been working closely with engineers to find new discrete power solutions for a wide variety of cutting-edge applications.
Dan explores the… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		
VSORA, a pioneering high-tech company, has engineered a novel architecture designed specifically to meet the stringent demands of AI inference—both in datacenters and at the edge. With near-theoretical performance in latency, throughput, and energy efficiency, VSORA’s architecture breaks away from legacy designs optimized… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		
The semiconductor industry is undergoing a transformative shift with the integration of AI into DRC workflows, as showcased in the Siemens EDA presentation at the 2025 TSMC OIP. Titled “AI-Driven DRC Productivity Optimization,” this initiative, led by Siemens EDA’s David Abercrombie alongside AMD’s… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		GPUs have been proposed before to accelerate logic simulation but haven’t quite met the need yet. This is a new attempt based on emulating emulator flows. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our series… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		One of the more in interesting companies I met at the AI Infra Summit was a company known to me for some time. The most interesting part was the chip they are in the process of taping out; It is a high-performance, ultra-low-power AI processor purpose-built for edge computing. It is claimed to deliver “the processing muscle … Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		There is always a lot of buzz about advanced AI workloads at trade shows. How to train them and how to run them. Advanced chip and multi-die designs are how AI is brought to life, so it was a perfect fit for discussion at a show. But there is another side of this discussion. Much of the work going on in AI workloads has to do with processing… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		
In a move poised to accelerate the integration of open-source processor architectures into resource-constrained devices, semiconductor IP provider CAST, Inc. unveiled its Catalyst™ Program at the RISC-V Summit in Santa Clara, California. This initiative addresses a persistent pain point for embedded system developers:… Read More 
	 
	
	
	
		
	
		
		
	
		
	
	
	
		Daniel is joined by Alex Burlak is Vice President of Test & Analytics at proteanTecs. With combined expertise in production testing and data analytics of ICs and system products, Alex joined proteanTecs in October, 2018. Before joining the company, Alex held a Senior Director of Interconnect and Silicon Photonics Product… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		Alex Demkov is co-founder and CEO of La Luce Cristallina. He is a distinguished figure in the field of materials physics, serving as a Professor at the University of Texas at Austin. With a prolific career marked by notable achievements, Alex boasts an impressive portfolio of 10 U.S. patents and many patent applications, showcasing… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		Today, Perforce IPLM stands at the intersection of data management, automation, and collaboration, shaping the way companies design the next generation of chips and systems. Looking ahead, its evolution will reflect the growing convergence of hardware, software, and AI-driven engineering.
WEBINAR – Future Forward:… Read More 
	 
	
	
	
	
		 
Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business