Webinar: All in One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die
Abstract
Dive into the future of Bluetooth audio with Ceva and Dolphin Semiconductor’s breakthrough 12nm Smart Edge AIoT SoC solution.
This webinar shows how advanced wireless connectivity, integrated AI processing, and premium audio technologies and power management come together to deliver superior performance, lower power, and faster time to market.
Learn how a combined Ceva and Dolphin Semiconductor’s solution turnkey platform enables low power and high performance next generation features: Bluetooth High Data Throughput, Channel Sounding, spatial audio, voice commands, sensor fusion, and more.
Ideal for cutting edge earbuds, headsets, smartwatches, and smart glasses.
Don’t miss this opportunity to enhance your next audio product with industry leading innovation.
What you will learn in this session:
- Map and understand audio peripheral product challenges, particularly for TWS/OTC
- Evaluate the pros and cons of existing design level solutions
- Ceva’s and Dolphin Semiconductor’s solution for overcoming TWS/OTC device challenges
Target Audience
Chip architects & SoC designers, audio and DSP engineers, embedded software engineers, and product managers for hearables & wearables
Speakers
Franz Dugand
Sr. Director, Product Marketing, Ceva
Etienne Faucher
Product line Portfolio Manager – Audio, Dolphin Semiconductor
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