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Semiconductor Expert Forum

Podcast EP301: Celebrating 20 Years on Innovation with yieldHUB’s John O’Donnell

Podcast EP301: Celebrating 20 Years on Innovation with yieldHUB’s John O’Donnell
by Daniel Nenni on 08-01-2025 at 10:00 am
Categories: EDA, yieldHUB

Dan is joined by John O’Donnell, Founder and CEO of yieldHUB, a pioneering leader in advanced data analytics for the semiconductor industry. Since establishing the company in 2005 he has transformed it from a two-person startup into a trusted multinational partner that empowers some of the world’s leading semiconductor companies… Read More

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Architecting Your Next SoC: Join the Live Discussion on Tradeoffs, IP, and Ecosystem Realities

Architecting Your Next SoC: Join the Live Discussion on Tradeoffs, IP, and Ecosystem Realities
by Daniel Nenni on 08-01-2025 at 8:00 am
Categories: Aion Silicon, Events, Semiconductor Services

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Designing a system-on-chip (SoC) has never been more complex—or more critical. With accelerating demands across AI, automotive, and high-performance compute applications, today’s SoC architects face a series of high-stakes tradeoffs from the very beginning. Decisions made during the earliest phases of design—regarding… Read More

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CEO Interview with Andrew Skafel of Edgewater Wireless

CEO Interview with Andrew Skafel of Edgewater Wireless
by Daniel Nenni on 08-01-2025 at 6:00 am
Categories: CEO Interviews, Semiconductor Services, Silicon Catalyst

Skafel pic

As the demand for high-capacity, low-latency wireless networks explodes across residential, enterprise, and industrial environments, a Canadian innovator is quietly reshaping the way Wi-Fi works—from the silicon up. Edgewater Wireless (TSXV:YFI/OTC:KPIFF), headquartered in Ottawa, is pioneering a transformative… Read More

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CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs

CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs
by Mike Gianfagna on 07-31-2025 at 10:00 am
Categories: CAST, Events, IP

CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs

Much of advanced technology is data-driven. From the cloud and AI accelerators to automotive processing and edge computing, data storage and transmission efficiency are of critical importance. It turns out that lossless data compression is a key ingredient to deliver these requirements.

While there are both software and hardware… Read More

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cHBM for AI: Capabilities, Challenges, and Opportunities

cHBM for AI: Capabilities, Challenges, and Opportunities
by Kalar Rajendiran on 07-31-2025 at 6:00 am
Categories: 3D IC, AI, EDA, IP, Synopsys
1 Comment

cHBM Panelists at Synopsys Executive Forum

AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More

Podcast EP300: Next Generation Metalization Innovations with Lam’s Kaihan Ashtiani

Podcast EP300: Next Generation Metalization Innovations with Lam’s Kaihan Ashtiani
by Daniel Nenni on 07-30-2025 at 10:00 am
Categories: Foundries

Dan is joined by Kaihan Ashtiani, Corporate Vice President and General Manager of atomic layer deposition and chemical vapor deposition metals in Lam’s Deposition Business Unit. Kaihan has more than 30 years of experience in technical and management roles, working on a variety of semiconductor tools and processes.

Dan explores… Read More

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Prompt Engineering for Security. Innovation in Verification

Prompt Engineering for Security. Innovation in Verification
by Bernard Murphy on 07-30-2025 at 6:00 am
Categories: AI, Cadence, EDA, Security

Innovation New

We have a shortage of reference designs to test detection of security vulnerabilities. An LLM-based method demonstrates how to fix that problem with structured prompt engineering. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford,… Read More

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Calibre Vision AI at #62DAC

Calibre Vision AI at #62DAC
by Daniel Payne on 07-29-2025 at 10:00 am
Categories: EDA, Siemens EDA

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Calibre is a well-known EDA tool from Siemens that is used for physical verification, but I didn’t really know how AI technology was being used, so I attended a Tuesday session at #62DAC to get up to speed. Priyank Jain, Calibre Product Management presented slides and finished up with a Q&A session.

In the semiconductor world… Read More

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Musk’s new job as Samsung Fab Manager – Can he disrupt chip making? Intel outside

Musk’s new job as Samsung Fab Manager – Can he disrupt chip making? Intel outside
by Robert Maire on 07-29-2025 at 6:00 am
Categories: Automotive, Foundries, Samsung Foundry, Semiconductor Advisors, Semiconductor Services
8 Comments

Elon Musk Samsung Tesla

– Musk chip lifeline to Samsung comes with interesting strings attached
– Musk chose Samsung over Intel-What does that say about Intel?
– Musk will hold sway over Samsung much as Apple/NVDA over TSMC
– Will Musk do a “DOGE” on chip tool makers? How much influence?

Tesla/Samsung $16.5B deal
… Read More
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Enabling the Ecosystem for True Heterogeneous 3D IC Designs

Enabling the Ecosystem for True Heterogeneous 3D IC Designs
by Kalar Rajendiran on 07-28-2025 at 10:00 am
Categories: 3D IC, Chiplet, EDA, Siemens EDA

The Shift to System Technology Co Optimization

The demand for higher performance, greater configurability, and more cost-effective solutions is pushing the industry toward heterogeneous integration and 3D integrated circuits (3D ICs). These solutions are no longer reserved for niche applications—they are rapidly becoming essential to mainstream semiconductor design.… Read More