Dr. Michael Förtsch, CEO of Q.ANT, is a physicist and innovator driving advancements in photonic computing and sensing technologies. With a PhD from the Max Planck Institute for the Science of Light, he leads Q.ANT’s development of Thin-Film Lithium Niobate (TFLN) technology, delivering groundbreaking energy efficiency … Read More




Verifying Leakage Across Power Domains
IC designs need to operate reliably under varying conditions and avoid inefficiencies like leakage across power domains. But how do you verify that connections between IP blocks has been done properly? This is where reliability verification, Electrical Rule Checking (ERC) tools and dynamic simulations all come into play particularly… Read More
How Cadence is Building the Physical Infrastructure of the AI Era
At the 2025 NVIDIA GTC Conference, CEO Jensen Huang delivered a sweeping keynote that painted the future of computing in bold strokes: a world powered by AI factories, built on accelerated computing, and driven by agentic, embodied AI capable of interacting with the physical world. He introduced the concept of Physical AI—intelligence… Read More
Podcast EP284: Current Capabilities and Future Focus at Intel Foundry Services with Kevin O’Buckley
Dan is joined by Kevin O’Buckley, senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet… Read More
Andes RISC-V CON in Silicon Valley Overview
RISC-V conferences have been at full capacity and I expect this one will be well attended as well. Andes is the biggest name in RSIC-V. The most notable thing about RISC-V conferences is the content. Not only is the content deep, it is international from the top companies in the industry. It is hard to find a design win these days without… Read More
Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys
HPC Bandwidth Explosion and 1.6T Ecosystem Interop Need
The exponential growth in data bandwidth requirements driven by HPC systems, AI, and ML applications has set the stage for an ever-increasing need for 1.6Tbps Ethernet. As data centers strive to manage vast data transfers with maximum efficiency, the urgency for interoperability… Read More
Predictive Load Handling: Solving a Quiet Bottleneck in Modern DSPs
When people talk about bottlenecks in digital signal processors (DSPs), they usually focus on compute throughput: how many MACs per second, how wide the vector unit is, how fast the clock runs. But ask any embedded AI engineer working on always-on voice, radar, or low-power vision—and they’ll tell you the truth: memory stalls … Read More
Executive Interview with Leo Linehan, President, Electronic Materials, Materion Corporation
Leo Linehan leads Materion’s Electronic Materials business segment, an important supplier to the global semiconductor market and an industry leader in the production of advanced chemicals, microelectronic packaging, precious and non-precious metals, and deposition, reclamation and refining services.
Prior to joining… Read More
A Perspective on AI Opportunities in Software Engineering
Whatever software engineering teams are considering around leveraging AI in their development cycles should be of interest to us in hardware engineering. Not in every respect perhaps but there should be significant commonalities. I found a recent paper on the Future of AI-Driven Software Engineering from the University of … Read More
CEO Interview with Ronald Glibbery of Peraso
Mr. Glibbery leads all functional areas of Peraso Inc. and has served as chief executive officer since December 2021. He co-founded Peraso Technologies Inc. in 2009 and previously served as its chief executive officer. Prior to co-founding Peraso Technologies, Mr. Glibbery was President of Intellon, a pioneer and leader in … Read More
TSMC Brings Packaging Center Stage with Silicon