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Xcelium Safety Certification Rounds Out Cadence Safety Solution

Xcelium Safety Certification Rounds Out Cadence Safety Solution
by Bernard Murphy on 07-27-2023 at 6:00 am

MIDAS System min

While fully autonomous driving may now be a distant dream, ADAS continues to be a very active industry driver as much for its safety advantages as for other features. Today in the hierarchy of SAE levels, SAE 2+ may represent the most active area of development rather than levels 3 through 5. This range of options still requires a human driver in the loop yet is bubbling with ideas and products: adaptive merging when entering or exiting a highway, further enhanced automatic emergency braking, driver monitoring systems (for when you aren’t paying sufficient attention), automated parking, intelligent rear- and side-view mirrors. All clever stuff which must also meet appropriate ISO 26262 safety standards, ASIL-A through ASIL-D according to the criticality of the application.

Increasing prominence of ASIL-D

ASIL-D is the most exacting standard, requiring for example better than 99% single point fault metric coverage, compared with say ASIL-B which will let you slide by with merely better than 90% coverage. For example, antilock brakes, self-steering and airbag deployment require ASIL-D coverage, whereas controls for brake lights and rear-view cameras may only require ASIL-B.

As systems become more complex and more highly integrated, an increasing number of SoCs now require some level of ASIL-D certification. This is triggered when a failure in such a system could be life-threatening or fatal, combined with a high risk of exposure since the system is used in the normal course of driving. Failures in aspects of a collision avoidance system would be an example. However, raising a whole SoC to ASIL-D is effectively impossible without abandoning pre-packaged IP and reuse methods. Instead, a “hybrid ASIL-D” approach has emerged. A “safety island” IP is certified to ASIL-D and charged with regularly testing and supervising other functions in the SoC, which are allowed to meet lower ASIL standards. The safety island provides ability to force selective IP reboots or isolation if needed while signaling driver alerts through a central control system.

This approach provides more flexibility in using a wider range of IP but adds more complexity to the certification strategy (the safety island IP must meet ASIL-D but the GPU IP perhaps only needs to meet ASIL-B for example). This mixture demands a clear safety plan from architecture onwards and a fault campaign to match that strategy in all its complexity. The Cadence MIDAS Safety Platform provides that management and control across digital and analog safety verification and safety mitigation implementation.

Xcelium Safety in the MIDAS platform

The Xcelium safety app builds on Xcelium native serial and concurrent fault simulation to provide a common mechanism both for debug and for high-throughput fault analysis. This is further accelerated through a combination of formal methods to filter out untestable or unobservable faults, and with machine learning methods to accelerate throughput on successive runs. The complete Xcelium safety system has been certified by TÜV-SÜD to be used in safety-related development for any ASIL level.

This Xcelium capability integrates with the MIDAS platform, an impressive answer to total SoC certification support from my perspective, managing FMEDA starting from early architectural analysis. This is tracked through fault campaign management across digital, analog, and AMS functions and insertion, optimization, and verification of safety mitigation techniques.

Support includes automotive Functional Safety Documentation Kits satisfying documentation requirements that the automotive component supplier must provide for their tools and flow to achieve ASIL certification. The kits also reduce effort required to evaluate tool use cases within each of the supplier’s automotive design projects and help automotive component suppliers avoid the costly efforts of tool-qualification activities.

Front-to-Back ISO 26262 compliance management for all ASIL levels or a mix of levels. Pretty impressive. You can learn more about Cadence Safety solutions HERE.


Wally Rhines Predicts the Future of AI at #60DAC

Wally Rhines Predicts the Future of AI at #60DAC
by Mike Gianfagna on 07-26-2023 at 10:00 am

Wally Rhines Predicts the Future of AI at DAC

Dr. Walden Rhines has appeared many times on SemiWiki. His discussions touch on a variety of topics, most recently on the health of EDA and IP. His knowledge of our industry is substantial, and he always seems to have a new take on the trends and technologies that are unfolding around us. So, when Wally took the stage for a keynote address at the recent Design Automation Conference in San Francisco it was standing room only. Wally took everyone on a scenic tour of how technology has impacted chip design over the years, ending with a very real view of how all this will change the future of the planet. Read on to understand how Wally Rhines predicts the future of AI at DAC.

The Early Days

Wally began with a look back at the emerging technologies in the 1980’s and the emerging technology leaders of the day.  He pointed out that Lip Bu Tan’s first major VC deal was with Creative Labs. Lip Bu clearly saw the future. There were other forward-looking folks in that time frame. Wally reminded us of what some of these folks looked like, back in the day.

Wally took us back a bit more than the 1980’s to uncover some interesting predictions. In the Summer of 1956, members of the Dartmouth Research Project on Artificial Intelligence made some interesting comments:

  • “Within ten years a digital computer will be the world’s chess champion” (A.Newell)
  • “In from three to eight years we will have a machine with the general intelligence of an average human being” (Marvin Minsky)
  • “Within ten years a digital computer will discover and prove an important new mathematical theorem” (H.A.Simon)

Current Day Trends

Bold and optimistic to say the least. But why hasn’t AI taken off until recently? The answer sets the stage for the future. According to Dr. Rhines:

  • Lack of big data to analyze
    • No Internet or IoT to collect sizable data sets
  • Limited computing power
    • Limitation of traditional computer chip architectures
  • Need for more advanced algorithms
  • Lack of ‘killer’ applications to make money

Many of these limitations are going away, opening the door for new chapters of innovation. The last point is key – this will be elaborated on by Wally in a bit. But first, Wally took a look at what IS making money these days. It’s kind of a mixed bag.

OpenAI, last year’s ChatGPT investment of ~$540 million has losses of $700,000 every day. The $75B automotive industry bet on autonomous vehicles has no meaningful return, YET. However, Nvidia made a big bet on AI and has become the first chipmaker to join the $1 trillion club.  Dramatic, but inconsistent results so far.

Before looking to the future, Wally spent some time examining the impact AI is having on chip design. Recall the limited computing power issue – better chip design can have a big impact on that. Wally did a great job summarizing many EDA innovations into three buckets. This is a great way to watch innovation and judge impact. One picture can explain the views presented, and that picture is included below.

This is a great model. Take a look at the latest announcements from your favorite EDA supplier. You will likely be able to put them in one of the columns, above.

Looking to the Future

Wally concluded his talk with a view of what the future holds for AI, specifically how it will be monetized. The data used to power the sophisticated and complex models of AI is becoming the “currency” for the future of the technology, and possibly the future of the planet.

Wally pointed out that the world creates 2.5 quintillion bytes of data every day, yet only a fraction of it is utilized. In case you’re wondering how many bytes that is, here is the full expression of one quintillion:

1,000,000,000,000,000,000

Data indeed is the new oil in the next generation economy and controlled, secure sharing of this data will be the engine for profit. But protecting all this data and sharing it in a controlled, secure way presents many challenges. Data that is driving many emerging AI systems today can be unreliable and have baked-in biases. Theft is widespread, and the ability to hack things like autonomous driving systems present existential threats.

Wally explained that the world needs a way to share and protect sensitive information at the same time. To make matters worse, once quantum computers reach 10,000 qubits most Internet security will break. This may happen in the next few years.

So, the question becomes how can the power of all the available data be unlocked to revolutionize everything from financial services to healthcare to manufacturing in a predictable, secure way? For this seemingly impossible problem. Wally offered a way forward.

It turns out there is a technology called fully homomorphic encryption (FHE) that can enable secure data sharing. This unique technology keeps data encrypted at all times. Computation of all kinds can be performed in the encrypted data, so machine learning models can be built from encrypted data.

This approach essentially hides all sensitive information in plain sight. Since the data is always encrypted, it needs no protection – stealing it gives you no useful information. So, what prevents the widespread use of such innovation?

Wally explained that FHE is very hard to implement from a computational standpoint. Using current technology, an unencrypted operation that takes one second will take about 11 days using encryption. Hardware requirements for FHE will require nearly one million times faster performance than current Intel and Nvidia servers.

We are now at the home stretch of Wally’s keynote, and here is where his long-term vision shines. It turns out there is a company that is working on this problem and aims to make FHE available to all. The company’s name is Cornami, and Wally is its CEO. You can learn more about Cornami here.  And that’s how Wally Rhines predicts the future of AI at DAC.


Signal Integrity 101: Fundamentals for Professional Engineers

Signal Integrity 101: Fundamentals for Professional Engineers
by Daniel Nenni on 07-26-2023 at 8:00 am

Samtec Singal Integrity 101

I have been watching Youtube since it began and have been amazed by it’s evolution. Literally everything is on Youtube now from sailing to home and auto repair, sewing and embroidery (wife), semiconductors, and now there is Youtube TV.

Signal Integrity has been a hot topic on SemiWiki since Samtec arrived in 2020. Samtec is my go to for all things signal integrity, absolutely. During that time we have published more than 20 highly successful signal integrity blogs, podcasts, and webinars. Samtec also has the Samtec gEEk spEEk Webinar Series which we have written about.

This 36 minute Youtube video is the beginning of a series on signal integrity with our good friends from Samtec Scott McMorrow and Matt Burns:

I have also been spending quite a bit of time with ChatGPT which quickly generated a nice backgrounder for semiconductor signal integrity for those of you who are just getting started:

Semiconductor signal integrity refers to the quality and reliability of electrical signals as they propagate through a semiconductor device or integrated circuit (IC). It is a critical aspect of designing and analyzing electronic systems to ensure proper functionality and performance.

In modern semiconductor devices, such as microprocessors, memory chips, and communication ICs, signals travel through complex paths and encounter various challenges that can degrade their integrity. Some common factors that can affect signal integrity include:

  1. Transmission Line Effects: When signals transition from one point to another, they behave like electromagnetic waves traveling along transmission lines. Factors such as impedance matching, reflections, crosstalk, and signal distortion can arise due to impedance discontinuities, line length, and the proximity of other signal traces.
  2. Noise and Interference: Various sources of noise, such as power supply noise, electromagnetic interference (EMI), and radio frequency interference (RFI), can corrupt signals and degrade their quality. Crosstalk, where signals from adjacent lines interfere with each other, is another common source of noise.
  3. Signal Reflections: When a signal encounters an impedance mismatch or a sudden change in the transmission line, a portion of the signal energy can reflect back towards the source. These reflections can cause signal distortions, ringing, and even data errors if not properly managed.
  4. Power Integrity: Proper power distribution within an IC is crucial for maintaining signal integrity. Voltage drops, noise, and fluctuations in the power supply can affect the timing and performance of signals.
  5. Electromigration: Over time, the movement of atoms within the conducting materials of a semiconductor device can cause physical degradation. This phenomenon, known as electromigration, can lead to signal interruptions, increased resistance, and eventual device failure.

To ensure good signal integrity, semiconductor designers employ various techniques during the design process, including careful layout and routing, controlled impedance matching, shielding, decoupling capacitors, and signal integrity analysis using simulation tools. These techniques aim to minimize signal degradation, reduce noise, and maintain signal quality throughout the IC.

Signal integrity analysis involves evaluating key parameters such as rise time, propagation delay, voltage levels, eye diagrams, jitter, and noise margins. Simulation tools, such as SPICE (Simulation Program with Integrated Circuit Emphasis), allow designers to model and analyze the behavior of signals within a semiconductor device before fabrication.

Overall, semiconductor signal integrity is crucial for achieving reliable and high-performance electronic systems. By addressing the various factors that can degrade signal quality, designers can ensure that signals propagate correctly and meet the required specifications for proper operation.

About Samtec (ChatGPT)

Samtec is a global manufacturer of electronic connectors and interconnect systems. The company was founded in 1976 and is headquartered in New Albany, Indiana, United States. Samtec specializes in the design, development, and production of a wide range of interconnect solutions used in various industries, including telecommunications, automotive, industrial, medical, and consumer electronics.

Samtec offers a diverse portfolio of connectors, cables, and assemblies that enable the transmission of signals and power in electronic devices and systems. Their products include board-to-board connectors, high-speed connectors, microelectronics and micro optical solutions, ruggedized connectors, cables and cable assemblies, and flexible stacking systems, among others.

The company has a strong focus on innovation and technology, constantly developing new solutions to meet the evolving needs of the industry. Samtec’s products are known for their high quality, reliability, and performance, and they are used in a wide range of applications, from computer servers and telecommunications equipment to medical devices and automotive systems.

In addition to their manufacturing capabilities, Samtec also provides engineering support and custom design services to help customers develop tailored interconnect solutions for their specific requirements. They have a global presence with sales and support offices in various countries, as well as manufacturing facilities in the United States, Costa Rica, China, Malaysia, and Singapore.

Overall, Samtec is a leading provider of electronic connectors and interconnect systems, serving a diverse range of industries with their innovative solutions and commitment to customer satisfaction.

Also Read:

PCI-SIG DevCon and Where Samtec Fits

Samtec Lights Up MemCon

Samtec Dominates DesignCon (Again)


Breker’s Maheen Hamid Believes Shared Vision Unifying Factor for Business Success

Breker’s Maheen Hamid Believes Shared Vision Unifying Factor for Business Success
by Bob Smith on 07-26-2023 at 6:00 am

Maheen Hamid

Maheen Hamid, a member of the ESD Alliance (a SEMI Technology Community) Governing Council and a member of SEMI’s North America Advisory Board, is an astute business executive. Together with her husband Adnan Hamid, they founded Breker Verification Systems, a company developing test synthesis solutions. She serves today as COO and CFO.

We recently talked about her journey into the tech industry, how she’s able to leverage her MBA and her thoughts on leadership. We finished our conversation discussing the industry trends she is seeing and how Breker is reacting to those trends.

Smith: What’s on your mind these days?

Hamid: Any executive is always concerned with growing the business while optimizing investment opportunities. The tactics are dynamic with changing trends, but the strategic ambition is static.

A long-term high-profile customer who has been familiar with the evolution of Breker recently said that he couldn’t imagine taping out a chip without using Breker solutions. If I had to pick any one thing that keeps me up at night, that is: How do I get all my customers to say exactly this?

Introducing innovative approaches for novel capabilities is challenging in a mature market entrenched with legacy methodologies. We observe a growing convergence with unmet needs with test synthesis solutions across various verticals and design processes. Due to the initiative supported by Accellera since 2015, Portable Stimulus has become a desired solution space, especially with developing needs in generative AI applications, RISC-V, and leading-edge applications requiring increased compute power. Some of those applications are in healthcare such as genomic sequencing and cancer treatment, aerospace and various simulations in research labs.

Breker is helping push the boundaries of verification technologies for complex chips. In line with our customer-centric, forward-looking positioning, I am focused on bringing agility to how we respond to the diverse demands of our users.

Smith: How do you perceive leadership?

Hamid: Leadership is 90% inspiring individuals to reach their potential and 10% in setting the examples. As the leader, you have to model the behavior you wish for the subordinates to emulate. I strongly believe in this, whether I am the owner of the business or a mid-level manager at a larger organization. There is nothing more solid than establishing the work ethos that propels your company to keep moving forward with excellence.

I have been at the helm of cutting-edge technology companies in Silicon Valley, working with the best of minds. I have also led technology and operations teams in developing countries, where the crop of employees has more variability in their academic backgrounds and qualifications. The unifying factor for success remains in establishing a shared vision, nurturing a sense of ownership over the impact individuals can create as a team, and providing the guard rails so they can focus on doing the tasks they can excel at.

Every business should be mission driven in its own ways. If a business isn’t serving a real need or making things better for some segment, it isn’t creating real value that moves humankind forward. At Breker, this defines our leadership style as well as our entire company culture.

Smith: What was your career journey getting into the business world to leading Breker?

Hamid: Both my parents are entrepreneurs in a country that has an entrepreneurial spirit as it only became independent in 1971 after a bloody war. While my father built his business industries with the vision to build Bangladesh in ways he could, my mother is a social entrepreneur. I have worked with them since I was a teenager and sat through business meetings with international partners from before I was 10. Our dinner table conversation revolved around stories my father told of navigating his various business dealings with supporters and detractors alike. A very simple man in how he lives, his business altruism has always been generous to his community. Hence, the need to have a philosophical reason behind a career that goes beyond maximizing returns is ingrained in me.

My intuition for business and leadership skills is partly innate, partly absorbed, and partly honed through formal education and my own experiences in investment banking in an emerging market and in social enterprise building.

My husband and Breker co-founder Adnan Hamid was bitten by my family’s entrepreneurial bug after we married. We both completed our MBAs at the same time and thought it the best time to try and commercialize the product idea he had been exploring. What sold me on it was his one statement, “This can positively change how people do things.” He was willing to take the risk and I was willing to support the journey. We had complementary strengths with his technical depth and my operational experience. I naturally evolved into leading initiatives in non-engineering functions.

Smith: How has your MBA helped inform your leadership style?

Hamid: In its most basic form, the MBA provides a solid, conceptual framework for how the various moving pieces in a business fit together. With a concentration in finance and entrepreneurship, the program at University of Texas Austin is very good at promoting thought leadership, critical analysis and team-building skills.

I was “fresh off the boat” when I entered the program, having been in the United States only for a year by then. I was the youngest in my class, a brown female who still wore traditional ethnic clothes, and found myself in a competitive program dominated by white men. What could have been an intimidating experience was quite enlightening, and I learned to focus on the human element –– Basic human emotions and interests are invariant of culture, upbringing, economic prowess. To this day, it is my strongest skill to be able to map human interests as I engage in diverse forums across industries and workspaces.

Smith: What advice would you give someone wanting to grow into a management role or to budding entrepreneurs?

Hamid: The operative word in the question is “wanting to grow” into a management role. I put stock in people who have innate leadership skills. These manifest in many ways through demonstrable focus on quality work, ambition and creative ideas with follow through, eloquent and articulate presentation of ideas, people skills, and more. Even though I start a team by giving them access to comparable opportunities as well as equal access to my time, it becomes obvious quickly who is willing to go that extra mile to ensure a job well done. This is the group that receives the higher-level tasks and, ergo, the best opportunities to learn and grow.

The entrepreneurial journey is as limitless as it is constricting. Every decision will have important trade-offs and learning that early helps to create an organization that remains rooted in optimization of given opportunities.

Smith: What trends are you seeing?

Hamid: Changing economics directly impact market dynamics. Traditional chip companies are facing stiff competition from large customers building their own chip divisions, and emerging competitors fueled by the advent of RISC-V, AI applications in the cloud, and more. Ask ChatGPT about its potential impact on chip sales and it lists factors such as increased demand for server/data center chips, advancements in AI-specific chips, integration of AI capabilities into consumer devices, impact on edge computing, and even more. This pressures the need to shift traditional design and verification methodologies toward productivity-driven approaches.

Companies like Breker are riding the benefits of this transition with easy-to-use tools to expand verification capabilities and productivity by orders of magnitude.in We are heavily involved in helping to drive this shift with SystemVIP solutions for complex SoCs to application-specific solutions such as cache coherency, power and security and new approaches to comprehensive RISC-V verification.

One thing that never stops being trendy is the realization that complex worlds require simple solutions. Our business philosophy has always been to craft solutions that fit into our customers’ unique environments as opposed to forcing them to fit into our predefined product idea. This requires tremendous investment in flexible technology, with extensive configurability at the customer’s fingertips. We are reaping the benefits of this customer-centric approach because nothing drives better development than direct customer feedback on usability and desired features. This, in turn, drives us to continually improve and expand our solutions in the most efficient manner.

Also Read:

Optimism Prevailed at CEO Outlook, though Downturn Could Bring Unpredictable Challenges

Nominations for Phil Kaufman Award, Phil Kaufman Hall of Fame Close June 30

SEMI ESD Alliance CEO Outlook Sponsored by Keysight Promises Industry Perspectives, Insights


Altair’s Jim Cantele Predicts the Future of Chip Design

Altair’s Jim Cantele Predicts the Future of Chip Design
by Mike Gianfagna on 07-25-2023 at 10:00 am

Altair’s Jim Cantele Predicts the Future of Chip Design

We all know chip design is changing in substantial ways and at a fast pace. The demands being placed on semiconductor systems are growing dramatically, and the innovation being delivered to address those demands is just as dramatic. Everyone seems to have an opinion on these trends, and a set of predications to make sense out of it all. A recent Executive Insight on this topic caught my eye. The company publishing the piece is at the epicenter of many relevant trends. And the author is someone I know has been on the front line of change for many years. This is a must-read piece. Before I provide a link, I’ll whet your appetite a bit about how Altair’s Jim Cantele predicts the future of chip design.

The Company

Altair is a broad-based technology company that sits at the crossroads of many of the relevant trends that are changing the world around us. The company delivers comprehensive, open-architecture solutions for data analytics & AI, computer-aided engineering, and high-performance computing.

Its key goals include enablement of design and optimization for high performance, innovative, and sustainable products and processes against the backdrop of a highly connected world.

If we focus on chip design, Altair semiconductor design solutions are built to optimize EDA environments and to improve the design-to-manufacturing process, eliminate design iterations, and reduce time-to-market. The company provides tools that address the challenges of ever-increasing performance requirements and product complexity from chips to PCBs, and embedded systems, all the way to product realization.

You can learn more about Altair’s pedigree in this area here.

The Author

Jim Cantele

Jim Cantele wrote the piece. He is the Global SVP of Sales and Technology at Altair. Once upon a time, I worked with Jim at a small DFM startup. We were breaking new ground there, and Jim has been doing that his whole career.

Jim has seen the demands of innovation up close at large enterprises such as Mentor Graphics and Cadence Design Systems. He also pushed the envelope at high-profile startups such as One Spin Solutions, Celestry, and Runtime Design Automation, which was acquired by Altair six years ago.

Jim has seen a lot and his opinions on the future of chip design are worth listening to.

The Predictions

The Executive Insight discusses five semiconductor design trends. Taken together, they tell a compelling story. You need to hear Jim’s views directly, but here is a summary of the trends discussed.

#1: Reaching for the Sky: When you run out of room in two dimensions, you move up. Architects have known that for years, and the concept is quite relevant for chip design. But things aren’t as simple as they seem with an approach like this.

#2: Bringing Design In-House: Many factors conspired to create the chip shortage we are all too familiar with today. One impact of this situation was bringing chip design in-house to control your own destiny.  This trend created many challenges, and companies still struggle to make the ideas of in-house design work today.

#3: Designing in the Cloud: Cloud computing is clearly here to stay. But using the vast resources available for efficient and cost-effective chip design isn’t as easy as it seems.

#4: Artificial Intelligence and Machine Learning: AI and ML are everywhere. This is clear. The compute and memory demands of these technologies puts a huge strain on chip design.  What have we learned from AI and ML that can be applied to solve these design problems?

#5: Technology Convergence: The blurring of lines between different computing approaches and different architectures presents both a huge opportunity and a substantial challenge for chip design. How will this all come together? And are the solutions already here?

To Learn More

I encourage you to read the Altair Executive Insight. It will help to make sense out of a rapidly changing world. You can check out the piece here to learn how Altair’s Jim Cantele predicts the future of chip design.


Convergence Between EDA and MCAD and Industrial Software

Convergence Between EDA and MCAD and Industrial Software
by Bernard Murphy on 07-25-2023 at 6:00 am

convergence eda mcad etc min

Cadence hosted a panel at DAC on how EDA, MCAD and industrial software have come together, a topic I always find interesting. Many years ago, I worked on a NAVAIR contract bid team, an eye-opener for a young engineer who thought that innovation started and ended with electronic design. I remember CATIA (3D modeling) being a component in the bid, along with PLM and other automation outside the EDA realm. This naturally made me wonder about the interaction between these domains. Back then, there wasn’t much interaction that I remember. This panel provided a useful update on what has changed.

The panel was moderated by Jay Vleeschhouwer (Managing Director at Griffin Securities) and included John Lee (GM/VP of the Electronics, Semiconductor and Optics Business Unit at Ansys), Tom Beckley (Sr. VP/GM of the Custom IC and PCB Group at Cadence), Brian Thompson (Division VP/GM of CREO and Desktop Engineering Calculations at PTC), Stephane Sireau (VP of High Tech Industry for Dassault Systèmes), and Tony Hemmelgarn (President and CEO of Siemens Digital Industries Software). These executives represent a comprehensive span of automation and lifecycle management across systems design. In some areas, each offers unique advantages, in others they compete, sometimes they cooperate. As usual in my panel write-ups, I’ll summarize my takeaways.

What motivates convergence?

Back in my NAVAIR days the boundaries between electrical CAD, mechanical CAD, and software were pretty sharp. Physics analytics and lifecycle management were system concerns: Screening, decoupling, cooling outside the chip, making sure that thermal, ESD, EM, and aging fell within pre-agreed limits. Now boundaries are more diffuse with more complex application-specific SoCs and sensing in faster and more challenging processes, smaller enclosures complicating thermal management, tighter coupling between mechanical and electrical, stronger constraints on aging and operation in hostile environments, plus, of course, security and safety.

Tighter coupling leads to more interdependence in the design of the whole system. Failing to meet a requirement can have broader consequences, triggering a respin in silicon, multi-die systems, enclosures, mechanical design, or in software. Active lifecycle management is becoming more important for remote devices, in predictive maintenance applications, or where safety critical automation in automotive and aerospace applications must be checked frequently and should fail gracefully if a problem is detected.

Digital twins

Everyone endorsed digital twins to characterize and refine the complete system model before committing to manufacturing, seeing this as a better way to co-optimize each of these domains with quick turnaround and at much lower cost than doing the real thing. What a twin will look like depends very much on the domain. A twin for an assembly line or a jet fighter will necessarily have significant emphasis on mechanical content, supported by electronic enhancements. A twin for a data center or a fixed wireless access network would be more electronics-forward, with some mechanical support (cooling, for example).

Curiously, automotive is still figuring out which side of this divide it wants to be on. According to Alberto Sangiovanni-Vincentelli, who gave an earlier keynote, Tesla takes the view that they are fundamentally an electrical engineering and software engineering company. They start in electronic system architecture and then weave in the rest of the system, mechanical, etc., iterating to deliver the highest performance they can. In contrast, a traditional automotive OEM starts where they have always started—volume manufacturing and mechanical engineering. But, when they assemble electronics into the chassis, they blow their power envelope —at least compared to Tesla. This question of system design with electronics-forward or mechanical-/manufacturing-forward may be important not only here but in all systems where electronic content is rising rapidly.

Partnerships and coopetition

Clearly each of the panelists’ organizations have their own core strengths yet tread on each other’s turf in one way or another: Multiphysics, CFD, PLM, digital twins, 3D modeling, etc. This isn’t so unusual, especially in mechanical and industrial software. Customers want best in class solutions, as always. Vendors respond preferentially through organic growth or acquisitions (ex., the Siemens acquisition of Mentor Graphics). Siemens has their own MCAD and PLM offerings; Dassault and PTC are also established in those domains but do not have EDA capability or certain multiphysics options in-house so must rely on partnerships. However, none of them can cover all the bases. Even Siemens EDA (Mentor) must be augmented in several areas.

Conversely Cadence, which was historically concerned primarily with semiconductor design, now offers tightly integrated capabilities analytics and design capabilities around package and board assembly to ensure comprehensive solutions for design, electromagnetics, power distribution, EM, thermal and cooling. The Cadence focus on computational software drives in-house capabilities like CFD and datacenter energy optimization and, in a different direction, molecular simulation. Ansys, on the other hand, is squarely focused on what they call pervasive insights through multiphysics analysis as a capability you can call from anywhere, not only in the electronics domain.

All agreed that partnerships are essential to meet customer expectations, and that those partnerships consume a lot of energy. They must draw clear boundaries on where they compete and where they cooperate. Interestingly, difficulties are mostly in field and distributor organizations where alignment demands much more up-front and ongoing effort. At the technical level, multiple methods were suggested to simplify handshaking between tools.

Ansys has released a Python-compatible open-source version of all their APIs to GitHub. Linking clouds is another popular approach, particularly because speakers felt it easier to standardize and maintain interfaces in a cloud environment (where I assume versions and features are more easily controlled) than in on-premises platforms. Collaboration still depends on either standardized or de-facto standard interfaces; no one saw value in “universal” standards across such a diverse range of design domains.

One last thought here. Simulation Process and Data Management (SPDM) came up a few times in this discussion with regard to tracing digital threads across all simulation domains: Requirements, digital twins, test, model-based system engineering (MBSE) and verification management. I can’t find anything on the subject in core EDA; however, I do see Ansys and others making noise on the value of SPDM in complex system design. It will be interesting to see if this topic starts to appear in EDA also!

Very enlightening discussion on a topic of growing importance.


Keysight EDA visit at #60DAC

Keysight EDA visit at #60DAC
by Daniel Payne on 07-24-2023 at 10:00 am

Keysight EDA 60DAC min

The opening day at DAC was Monday and I had an appointment with Simon Rance (Cliosoft) and Stephen Slater, Product Manager of Keysight EDA in their suite.  Back in February Daniel Nenni wrote about Keysight EDA acquiring Cliosoft, adding design data and IP management to their software offerings. I really wanted to hear how that acquisition was going at DAC.

Keysight EDA at DAC

Simon said that the Cliosoft product names would be changing from SOS to Keysight Design Data Management, and from HUB to Keysight IP Management. The Cliosoft president, Srinath Anantharaman was also at DAC, and he’s now the General Manager of the Design Data and IP Management group. The expanded scope for the Cliosoft products is now from specification to signoff, including simulation, test and manufacturing, really a full Keysight flow.  Simon was adamant interoperability with partner EDA flows is a critical element of the Design Data and IP Management solutions, and will continue to be in the future.

The other big trend for Keysight EDA is the use of HPC and cloud computing to speed up simulations in parallel, reducing run times from 24 hours down to 1-2 hours, boosting productivity, allowing more time for exploration and design trade-offs. Engineers use Keysight Design Cloud for speeding up both circuit simulations and EM simulation. These parallel simulations can be executed through an on-premise cluster or a private, public or a hybrid cloud. So lots of choices to get faster simulation results.

Yes, the Design Data and IP management tools will continue to be supported alongside of other EDA vendor environments: Cadence, Siemens, Synopsys, Ansys, Altium, Zuken, MathWorks, Silvaco, Empyrean.

Keysight EDA Partners

Also announced at DAC this year was a Python API framework so that EDA tools can have inter-tool workflows for IC/Package/Board designs that have RF, uWave and high-speed digital requirements. With the new Python workflow, engineers can create custom workflows to automate sequential tasks, move data more easily between tools, turn data into an executable model, and even bring Test & Measurement into the design process.

Keysight EDA – Python workflow

The Cliosoft tools are all integrated into the PathWave Design 2024 software suite, and that was completed in record time since the acquisition.

Summary

All of the Cliosoft people that I saw at DAC were quite happy with being part of Keysight EDA, and the booth traffic was high. There was a good buzz in the booth, and the suites were filled with customer meetings, so the future looks promising. Learn more about their EDA tools, Data and IP Management, and the Design Cloud online.

Related Blogs

 


NILS Enhancement with Higher Transmission Phase-Shift Masks

NILS Enhancement with Higher Transmission Phase-Shift Masks
by Fred Chen on 07-24-2023 at 8:00 am

Figure 1. NILS is improved

In the assessment of wafer lithography processes, normalized image log-slope (NILS) gives the % change in width for a given % change in dose [1,2]. A nominal NILS value of 2 indicates 10% change in linewidth for 10% change in dose; the % change in linewidth is inversely proportional to the NILS. In a previous article [2], it was shown that NILS is better for a dark feature against a bright background than the other way around. Attenuated phase shift masks (attPSMs) help to improve the NILS to reach values of 2 or more, in cases where conventional binary masks can’t without an exorbitantly high dose.

Increasing the transmission of the attenuated phase shift mask [3] takes the improvement further. A higher transmission effectively makes the dark areas darker, which increases the image log-slope.

Figure 1. NILS is improved for higher transmission of the attenuated phase-shift mask. The images are taken along the long axis of a dense oblong (1.3:1) pattern with cross-dipole illumination. The graph on the right uses the log scale instead of linear scale for the y-axis, representing intensity. The more obvious dip indicates better NILS for the higher transmission (16% vs 6%).

Besides improving NILS, the mask error sensitivity and depth of focus are also improved [3]. Improving the NILS is particularly important for improving the resolution of 2D shapes such as in Figure 1 or in the header above this article. For the 12% attPSM of Ref. 3, a square feature width of 65% of pitch with cross-dipole illumination (for tightest 2D resolution: dipole illumination in X + dipole illumination in Y) just manages to hit a NILS of 2.0 in both x and y. This is another opportunity to improve 2D resolution for DUV, especially for core patterning for self-aligned double patterning (SADP) [4].

References

[1] C. A. Mack, “Using the Normalized Image Log-Slope,” The Lithography Expert, Microlithography World, Winter 2001: http://lithoguru.com/scientist/litho_tutor/TUTOR32%20(Winter%2002).pdf

[2] F. Chen, “Phase-Shifting Masks for NILS Improvement – A Handicap for EUV?”, https://www.linkedin.com/pulse/phase-shifting-masks-nils-improvement-handicap-euv-frederick-chen

[3] T. Faure et al., “Development of a new high transmission phase shift mask technology for 10 nm logic node,” Proc. SPIE 9984, 998402 (2016).

[4] H. Yaegashi et al., “Overview: continuous evolution on double-patterning process,” Proc. SPIE 8325, 83250B (2012).

This article first appeared in LinkedIn Pulse: NILS Enhancement with Higher Transmission Phase-Shift Masks

Also Read:

Assessing EUV Wafer Output: 2019-2022

Application-Specific Lithography: 28 nm Pitch Two-Dimensional Routing

A Primer on EUV Lithography


Intel Enables the Multi-Die Revolution with Packaging Innovation

Intel Enables the Multi-Die Revolution with Packaging Innovation
by Mike Gianfagna on 07-24-2023 at 6:00 am

Intel Enables the Multi Die Revolution with Packaging Innovation

The trend is undeniable. Highly integrated monolithic chips can no longer handle the demands of next-generation systems. The reasons for this significant shift in design are many. Much has been written on the topic; you can get a good overview of the forces at play in multi-die design here. These changes represent the next chapter in the pursuit of exponential scaling originally defined by Moore’s Law. So, it is quite natural to look to Intel, the birthplace of Moore’s Law, for a peek at what lies ahead. Read on to see how Intel enables the multi-die revolution with packaging innovation.

The Packaging Challenge

The move to multi-die systems creates substantial design and manufacturing challenges. Billions of transistors are now spread across multiple dies integrated with complex package form factors containing millions of bump connections. The resultant heterogeneous integration demands a silicon, package and board co-design approach. 

Conventional approaches to these challenges often involve a silicon interposer to implement a “2.5D” integration. Drawbacks of this approach include the cost of the extra silicon and increased design complexity and reduced yield. The number and type of dies that can be integrated is also limited with this approach.

Finding a Better Way – EMIB

Intel has found a way around many of the current limitations of 2.5D packaging. Embedding a small silicon bridge chip into the package is the answer. EMIB, or embedded multi-die interconnect bridge, delivers a cost-effective way to connect multiple dies within a package. An overview of the approach is provided in the figure below.

EMIB Overview

A highly scalable capability is delivered with EMIB. There is now flexibility in total design size, number of chiplets bridge dimensions, and localized optimizations to support a wide variety of heterogeneous configurations. EMIB has been proven on several designs, as shown in the figure below.

Real Product Examples

Implementing EMIB – The Power of the Ecosystem

EMIB-based package design has its own set of challenges. The approach presents high pin count, net count and design density. An example design could contain 24 layers, 52,000 nets and 240,000 pins. All this must be managed across a heterogeneous design flow to achieve low latency and optimal energy efficiency.

Intel Foundry Services (IFS) have repeatedly stated their commitment to bring Intel technology to customers via the industry standard and powerful avenue of a foundry ecosystem. Staying true to that commitment, Intel approached this problem with standards and ecosystem collaboration. Data management, silicon/package/board co-design, consistent modeling/analysis and optimized cost and performance via design reuse are all supported with a comprehensive package assembly design kit (PADK). The PADK contains:

  • EMIB Design Guide
    • SI/PI Collateral
    • Thermal Tolerance
    • Mechanical Parameters
  • Package Library
    • Layout Template
    • Padstacks/Pins/Vias
    • Parts and Fiducials
  • Stack Up
    • Thickness
    • Tolerance
  • Design Rule Specs
    • Manufacturing Checks
    • Assembly Checks
    • Design Rule Checks
  • Performance
    • Electrical Rules
    • Constraints

Using this information, Intel built an EMIB-based reference flow with its key EDA partners. There is a design and an analysis reference flow in development. The figure below summarizes the status of each flow across the ecosystem.

Design Flow Status

What’s Next

There is much more to come from Intel in this area. Additional work includes:

  • Die-to-Die IP with UCIe
    • Reusability, compatibility, standardization
  • EDA-CAD agnostic standards
    • Chiplets, tech files, collateral, kits with end-to-end focus for ecosystem development
  • EDA framework
    • Silicon/package/system co-design
    • Interoperable EDA tools, flows and methods
    • Data exchange and workflows

The Intel view is that advanced packaging technology, content density, and package complexity requires new methods to drive design efficiency. The focus is to collaborate for ecosystem development using design standards and vendor agnostic tools, flows and methods.  And that’s how Intel enables the multi-die revolution with packaging innovation, and IFS delivers it to the external customers.

Also Read:

Intel Internal Foundry Model Webinar

VLSI Symposium – Intel PowerVia Technology

IEDM 2022 – Ann Kelleher of Intel – Plenary Talk


Podcast EP173: The Impact of Celestial AI’s Photonic Fabric on the Future of High-Performance Architectures

Podcast EP173: The Impact of Celestial AI’s Photonic Fabric on the Future of High-Performance Architectures
by Daniel Nenni on 07-21-2023 at 10:00 am

Dan is joined by Dave Lazovsky, CEO of Celestial AI. Dave has an in-depth knowledge of semiconductor, data/telecommunications, photonics and clean energy industries, as well as extensive international business experience. He currently has over 50 issued and 5 pending U.S. patents.

In this broad and forward-looking discussion, Dave explains the incredible demands being placed on next-generation compute architectures. He explores the capabilities of Celestial AI’s optical interconnect technology platform for memory and computation. He describes the game-changing impact the company’s Photonic Fabric can have on performance, energy efficiency and flexibility.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.