The Albuquerque Journal had an article about a local company sending silicon carbide wafers into suborbital space to improve their quality. ACME Advanced Materials plans to buy low quality $250 wafers, send them into space using their process, and sell the higher quality wafers for about $750. They are working to add gallium nitride… Read More
Disaggregating AI Compute to Break the Tokens BarrierAmong several topics dominating news streams these days,…Read More
Customized Foundation IP Enables the Next Generation of Automotive ComputeAs vehicles become increasingly software-defined, automotive semiconductor suppliers…Read More
Rambus Delivers Complete DDR5 Client Chipset for High-Speed CUDIMM and CSODIMM Memory ModulesThe rapid emergence of AI-enabled personal computers is…Read More
From Evidence to Authority: Bounded Gate Authority for Governed Semiconductor RealizationAdvanced semiconductor systems are no longer limited by…Read More
Synopsys and Samsung Foundry Extend AI-Driven Design Collaboration for Advanced 2nm and Multi-Die SystemsAt SAFE Forum 2026, Synopsys announced significant advancements…Read More
NoC resilience protects end-to-end
Protecting memory with ECC but leaving the rest of an SoC uncovered is like having a guard dog chained up in the back corner of your yard. If the problem happens to be in that particular spot, it’ll be dealt with, otherwise there will be a lot of barking but little actual protection.
Similarly, adding a safety-capable processor like… Read More
Proving the Power of Virtual Fabrication
There are many facets of our lives that are being driven to a more virtual method of doing things. This is largely due to issues such as scaling due to whatever reason – technical, business, economic. Let’s look at some general cases: In yesteryears people used to travel all the way for face-to-face meetings; today virtual meetings… Read More
CASPA, ARM and the Internet of Things
Today I was at the Chinese-American Semiconductor Professionals’ Association conference and dinner. Simon Segars, CEO of ARM, gave the dinner keynote. Somewhat surreally, it was in the same room in the same conference center two weeks ago that he gave they keynote at ARM TechCon. In another coincidence, Mike Muller of … Read More
TSMC ♥ Cadence!
One of the questions I routinely ask amongst the fabless semiconductor ecosystem is, “How are the EDA vendors doing?” There are always complaints because, let’s face it, we all like to complain. On occasion however I do hear about a vendor who goes above and beyond the call of duty and it really brightens my day.
Of late,… Read More
What’s next in test compression?
If you’ll be at ITC TestWeek in Seattle (Oct 20-23), here’s one event you don’t want to miss: a technology reception hosted by Mentor, with Janusz Rajski and Nilanjan Mukherjee as the featured speakers. It is free to ITC attendees and you can register here. [If for some crazy reason you haven’t registered for ITC yet, do that… Read More
Full-Chip Electromigration Analysis
I’ll never forget debugging my first DRAM chip at Intel, peering into a microscope and watching the aluminum interconnect actually bubble and dissolve as the voltage was increased, revealing the destructive effects of Electromigration (EM) failure. That was back in 1980 using 6 um, single level metal technology, so imagine… Read More
Maker Movement Embraced by Major Semiconductor Companies
How the Arduino Changed Embedded System Development Forever
In 2005 with the development of the Arduino, everything changed for people building things that required a microcontroller. The Arduino brought with it a low price standard, and open, hardware platform and an easy to use open source development environment. It was … Read More
StarVision to Debug and Analyze Designs at All Levels
In today’s SoC world where multiple analog and digital blocks along with IPs at different levels of abstractions are placed together on a single chip, debugging at all levels becomes quite difficult and clumsy. While one is working at the top level and needs to investigate a particular connection at an intermediate hierarchical… Read More
Xilinx Vivado: Faster and Better
When you think of Xilinx the word FPGA is the first that comes to mind. But Xilinx has really moved beyond the sort of simple glue-logic arrays that their first success was built on. A modern array contains processors as well as programmable fabric, hence the Xilinx tag-line “all programmable”. But another area that… Read More
Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools