This will be my 30[SUP]th[/SUP] Design Automation Conference. I know this because my first DAC was the same year I got married and forgetting how many years you have been married can cost you half your stuff. I have known Cliff Hou for half of that time and he has proven to be one of the most humble and honorable men I have worked with, definitely.… Read More
Jitter: The Overlooked PDN Quality MetricBruce Caryl is a Product Specialist with Siemens EDA…Read More
CEO Interview with Vamshi Kothur, of Tuple TechnologiesIt was my pleasure to meet with Vamshi…Read More
Webinar – Power is the New Performance: Scaling Power & Performance for Next Generation SoCsWhat if you could reduce power and extend…Read More
Reachability in Analog and AMS. Innovation in VerificationCan a combination of learning-based surrogate models plus…Read More
Speeding Up AMS Verification by Modeling with Real Numbers
My first introduction to modeling an AMS behavior using a language was back in the 1980’s at Silicon Compilers using the Lsim simulator. Around the same time the VHDL and Verilog languages emerged to handle the modeling of both digital and some analog behaviors. The big reason to model analog behavior with a language is for… Read More
Power Control Moving into Hardware
Sonics have been building networks-on-chips (NoCs) for a long time and have amassed a rich patent portfolio. So being granted a new one isn’t usually deemed press-release-worthy. However, their latest patent on power management is pretty significant. It is patent 8,601,288 titled “Intelligent Power Controller”.
Historically… Read More
Happy Birthday Xilinx
I have never done this before, wished a company happy birthday. So here goes, Happy Birthday Xilinx! How does it feel to be 30? Looking good eh? Signing up for AARP? My family and I just sang and had cake and ice cream. They did look at me like I was nuts when I set a place at the table for a Xilinx FPGA. In all seriousness, over the years Xilinx… Read More
ISO 26262 driving away from mobile SoCs
Connected cars may be starting to resemble overgrown phones in many ways, but there are critical differences now leading processor teams in a different direction away from the ubiquitous mobile SoC architecture – in turn causing designers to reevaluate interconnect strategies.
The modern car has evolved into a microcontroller… Read More
Quoting Automatically the eSilicon Way
Every ASIC company has a major challenge: they have to work out what it is going to cost to build the customer’s product and commit to deliver it at that price. Too high and you lose the business. Too low and you will wish you’d lost the business. Historically this has been done largely manually. This is an expensive process.… Read More
Will Google Design Server SoCs?
Google is search, of course, but it is also OS (Android), systems (Glass) and increasingly, maybe, hardware. Rumors are swirling that through careful acquisitions and focused internal development, Google is set to make its own server SoCs.
Google’s Larry Page has stated that they are in the hardware business. They’ve been making… Read More
I switched to Aldec Active-HDL
I have written this before, but I was a ModelSim snob. That has changed after trying Active-HDL from Aldec. I have no plans on going back to ModelSim. You ask why? Well astute reader, great question. Unfortunately these blogs are text limited and there is no way to write about all the bells and whistles of Active-HDL. So before I continue,… Read More
Intel 14nm Delayed Again?
From the sources in which I confirmed the last Intel 14nm delay, I just confirmed another. Intel 14nm is STILL having yield problems. Remember Intel bragging about 14nm being a full node and deriding TSMC because 16nm is “just” 20nm with FinFETs added? Judging by the graph, clearly FinFETs are not the problem here. … Read More
Smart Strategies for Efficient Testing of 3D-ICs
3D-IC has a stack of dies connected and packaged together, and therefore needs new testing strategies other than testing a single die. It’s given that a single defective die can render the whole of 3D-IC unusable, so each die in the stack must be completely and perfectly tested before its entry into that stack. Looking at it from a … Read More
Facing the Quantum Nature of EUV Lithography