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CoPoS is a Bigger Canvas for Chiplets and HBM

CoPoS is a Bigger Canvas for Chiplets and HBM
by Admin on 08-03-2025 at 10:00 am

Chip on Panel on Substrate, often shortened to CoPoS, extends the familiar idea of chip on carrier packaging by moving the redistribution and interposer style structures from circular wafers to large rectangular panels. The finished panel assembly is then mounted on an organic or glass package substrate. This shift from round

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Is a Semiconductor Equipment Pause Coming?

Is a Semiconductor Equipment Pause Coming?
by Robert Maire on 08-03-2025 at 10:00 am

John Maire SemiWiki

– Lam put up good numbers but H2 outlook was flat with unknown 2026
– China remains high & exposed at 35% of biz while US is a measly 6%
– Unclear if this is peak, pause, digestion, technology or normal cycle
– Coupled with ASML soft outlook & stock run ups means profit taking

Nice quarter but expected
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CEO Interview with Dr. Avi Madisetti of Mixed-Signal Devices

CEO Interview with Dr. Avi Madisetti of Mixed-Signal Devices
by Daniel Nenni on 08-03-2025 at 6:00 am

Avi Madisetti Headshot

Avi Madisetti is the CEO and Founder of Mixed-Signal Devices, a fabless semiconductor company delivering multi-gigahertz timing solutions. A veteran of Broadcom and Rockwell Semiconductor, Avi helped pioneer DSP-based Ethernet and SerDes architectures that have shipped in the billions. He later co-founded Mobius Semiconductor,… Read More


AI’s Transformative Role in Semiconductor Design and Sustainability

AI’s Transformative Role in Semiconductor Design and Sustainability
by Admin on 08-02-2025 at 6:00 pm

On July 18, 2025, Serge Nicoleau from STMicroelectronics delivered a compelling presentation at DACtv, as seen in the YouTube video exploring how artificial intelligence (AI) is revolutionizing semiconductor design, edge computing, and sustainability. Addressing a diverse audience, Serge highlighted AI’s pervasive … Read More


Google Cloud: Optimizing EDA for the Semiconductor Future

Google Cloud: Optimizing EDA for the Semiconductor Future
by Admin on 08-02-2025 at 5:00 pm

On July 9, 2025, a DACtv session featured a Google product manager discussing the strategic importance of electronic design automation (EDA) and how Google Cloud is optimizing it for the semiconductor industry, as presented in the YouTube video. The talk highlighted Google Cloud’s role in addressing the escalating complexity… Read More


Synopsys FlexEDA: Revolutionizing Chip Design with Cloud and Pay-Per-Use

Synopsys FlexEDA: Revolutionizing Chip Design with Cloud and Pay-Per-Use
by Admin on 08-02-2025 at 4:00 pm

On July 9, 2025, Vikram Bhatia, head of product management for Synopsys’ cloud platform, and Sashi Obilisetty, his R&D engineering counterpart, presented a DACtv session on Synopsys FlexEDA, as seen in the YouTube video. Drawing from three and a half years of data, the session showcased how this cloud-based, pay-per-use… Read More


Perforce and Siemens: A Strategic Partnership for Digital Threads in EDA

Perforce and Siemens: A Strategic Partnership for Digital Threads in EDA
by Admin on 08-02-2025 at 3:00 pm

On July 9, 2025, Michael Munsey, VP of Semiconductor Industry at Siemens, and Vishal Moondhra, VP of Solutions at Perforce, presented a DACtv session announcing their strategic partnership, as seen in the YouTube video. This collaboration integrates Siemens’ digital twin and digital thread technologies with Perforce’s version… Read More


AI-Enhanced Chip Design: Pioneering the Future at DAC 2025

AI-Enhanced Chip Design: Pioneering the Future at DAC 2025
by Admin on 08-02-2025 at 2:00 pm

DAC 62 Systems on Chips

On July 9, 2025, a DACtv session illuminated the transformative role of artificial intelligence (AI) in chip design, as presented by Ankur Gupta of Siemens EDA in the YouTube video. The speaker explored how AI is revolutionizing electronic design automation (EDA), addressing the semiconductor industry’s challenges in managing… Read More


IBM Cloud: Enabling World-Class EDA Workflows

IBM Cloud: Enabling World-Class EDA Workflows
by Admin on 08-02-2025 at 1:00 pm

DAC 62 Systems on Chips

On July 9, 2025, Derren Dunn from IBM Research’s TJ Watson Research Center delivered a DACtv presentation, as seen in the YouTube video detailing IBM’s EDA-as-a-Solution platform. This innovative offering leverages IBM’s high-performance computing (HPC) cloud to deliver hybrid and cloud-only infrastructure for electronic… Read More


AI-Driven Chip Design: Navigating the Future

AI-Driven Chip Design: Navigating the Future
by Admin on 08-02-2025 at 1:00 pm

DAC 62 Systems on Chips

On July 9, 2025, a DACtv session by Dr. Peter Levin explored the transformative impact of artificial intelligence (AI) on chip design, as presented in the YouTube video. The speaker, an industry expert, delved into how AI is reshaping electronic design automation (EDA), addressing the escalating complexity of modern chips and… Read More