Breaking out of the ivory tower: 3D IC thermal analysis for allTodd Burkholder and Andras Vass-Varnai, Siemens EDA As…Read More
Free and Open Chip Design Tools: Opportunities, Challenges, and OutlookDesigning semiconductor chips has traditionally been costly and…Read More
On July 18, 2025, Jeff Wittich, Chief Product Officer at Ampure Computing, delivered a compelling DACtv presentation, as seen in the YouTube video, likening the current AI boom to the 1848 California Gold Rush. Speaking in San Francisco, just 100 miles from Sutter’s Mill, Wittich drew parallels between the historical rush that… Read More
On July 18, 2025, Mark Teranipur, chairman of the Electrical and Computer Engineering Department at the University of Florida and co-founder of Caspia Technologies, delivered a compelling talk at DACtv on leveraging large language models (LLMs) for System-on-Chip (SoC) security, as seen in the YouTube video. Addressing the… Read More
On July 18, 2025, ChipAgents AI, a Santa Barbara-based startup, showcased its innovative agentic AI platform for chip design and verification at a DACtv session. Led by CEO William Wong, a former CMU PhD and UC Santa Barbara professor, Chip Agent is redefining electronic design automation (EDA) by leveraging advanced AI agents… Read More
On July 18, 2025, a DACtv panel discussion titled “AI and VLSI: A Symbiotic Revolution” explored the transformative interplay between artificial intelligence (AI) and very-large-scale integration (VLSI) design. Moderated by Ramuni Nagasetty from NATCast. The panel featured Arijit Raychowdhury (Georgia Tech), Dr. Rob … Read More
On July 18, 2025, Steve Greenfield, an early-stage investor and author, delivered a compelling 45-minute talk at DACtv on the future of mobility. Quoting futurist William Gibson—“The future is already here. It’s just not evenly distributed”—Greenfield explored how emerging technologies and business models are reshaping… Read More
On July 18, 2025, a DACtv session titled “From Atoms to Tokens” explored the semiconductor supply chain’s transformation, as presented in the YouTube video. The speaker tackled the challenges and innovations from the atomic level of chip fabrication to the tokenized ecosystems of AI-driven data centers, emphasizing the critical… Read More
On July 18, 2025, Siemens EDA and Nvidia presented a compelling vision for the future of electronic design automation (EDA) at a DACtv event, emphasizing the transformative role of artificial intelligence (AI) in semiconductor and PCB design. Amit Gupta, Vice President and General Manager at Siemens EDA, and John Lynford, head… Read More
The Granta EduPack White Paper on Materials Selection, authored by Harriet Parnell, Kaitlin Tyler, and Mike Ashby, presents a practical and educational guide to selecting materials in engineering design. Developed by Ansys and based on Ashby’s well-known methodologies, the paper outlines a four-step process to help learners… Read More
In a keynote at the 62nd Design Automation Conference (#62DAC) on July 8, 2025, Jason Cong, Volgenau Chair for Engineering Excellence Professor, UCLA, reflected on over 30 years in the DAC community, highlighting the transformative role of AI and machine learning (ML) in semiconductor design. The speaker, whose first DAC paper… Read More
In a keynote by Michaela Blott, AMD Senior Fellow, at the 62nd Design Automation Conference (DAC) on July 8, 2025, explored the trends shaping the AI revolution, emphasizing inference efficiency and hardware customization. While acknowledging AMD’s efforts in scaling GPUs and achieving energy efficiency goals (30x… Read More
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Intel’s Pearl Harbor Moment