Nvidia and TSMC have achieved a major milestone with the unveiling of the first Blackwell chip wafer produced in the United States. Announced at TSMC’s Phoenix, Arizona facility, this marks the first time Nvidia’s next-generation AI architecture has been fabricated domestically. The wafer represents a critical step in reshoring advanced semiconductor production and reducing reliance on overseas manufacturing.
The Blackwell architecture powers Nvidia’s most powerful AI and data center GPUs, likely built on TSMC’s 3nm or 4nm process technology. Producing it in the U.S. demonstrates that cutting-edge chipmaking can now occur at TSMC’s Arizona fab, a facility developed with significant investment under the CHIPS and Science Act. Nvidia CEO Jensen Huang called the milestone a key move in strengthening America’s semiconductor supply chain.
This collaboration underscores a broader push to localize production amid geopolitical and economic pressures. While only the wafer stage is currently U.S.-based—with packaging and assembly still offshore—it signals growing capacity for high-end manufacturing in the U.S. Despite higher costs and gradual ramp-up, the Arizona-made Blackwell wafer represents a new era of collaboration between Nvidia and TSMC, and a significant leap forward for domestic chipmaking leadership in the global AI economy.
Nvidia unveils first Blackwell chip wafer made with TSMC in US
Nvidia uveiled on Friday the first U.S.-made Blackwell wafer, produced at TSMC's semiconductor manufacturing facility in Phoenix, as demand for AI chips accelerates.
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