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Blogging for Dummies

Blogging for Dummies
by Paul McLellan on 03-05-2015 at 7:00 am

I am often asked how I became a blogger (or a journalist if you want to make it sound more professional). I think people assume that I planned it in some way but I never did. Life is what happens while you are making other plans. To see how unlikely it is, you need to know a bit of my background.

I have a PhD in computer science so I’m actually… Read More


Three Colorful Bytes from the NXP History

Three Colorful Bytes from the NXP History
by Majeed Ahmad on 03-04-2015 at 7:00 pm

The proposed merger of NXP and Freescale, which creates a bigger semiconductor outfit, also brings forth some fascinating history bytes from the technology heritage that these two spin-offs carry from their respective corporate parents. In 2006, Philips Electronics sold its chip business division Philips Semiconductors… Read More


Synflow and Cx

Synflow and Cx
by Paul McLellan on 03-04-2015 at 9:00 am

When hardware designers hear about a new language their heart sinks. We already have Verilog, SystemVerilog and VHDL. And if you go up a level, we have C, C++ and SystemC. Isn’t that enough? However, if you tell a software engineer about a new language they are interested, there are hundreds of programming language and hundreds… Read More


CDN is Live in Silicon Valley!

CDN is Live in Silicon Valley!
by Daniel Nenni on 03-03-2015 at 10:00 pm

As big of a fan as I am of Social Media there is still nothing like getting up close and personal when collaborating with the fabless semiconductor ecosystem. After 30+ years in Silicon Valley if there is one thing I have learned it’s that “showing up” is the #1 key to success, absolutely.

Speaking of showing up, each year there are three… Read More


Where a New IP Company Could Invest

Where a New IP Company Could Invest
by barun on 03-03-2015 at 7:00 pm

Which IP which will give substantial return in next 3 – 5 years and where a company will invest as well as how it will differentiate itself from others, particularly the big ones, are key discussion topics for any start-up entering into semiconductor IP business.

In the last few decades we have seen a tremendous growth of interface… Read More


Exensio: Big Data in the Fab

Exensio: Big Data in the Fab
by Paul McLellan on 03-03-2015 at 7:00 am

For 20 years PDF Solutions have been working with fabs on yield enhancement. Today, they announced their Exensio Platform for big data manufacturing environments. They haven’t really been keeping it a secret and have been talking about it at events since late last year, but it has basically been in stealth mode for the last… Read More


All things being unequal for NXP and Freescale

All things being unequal for NXP and Freescale
by Don Dingee on 03-02-2015 at 4:00 pm

When I read the news that NXP was buying Freescale, it felt like a part of me – and a big part of the history of high tech industry in Arizona – died. There was a time not that long ago where Motorola was the biggest employer in this state, way before Freescale and ON Semi separated from the mothership. Somehow, even with moving headquarters… Read More


Simple Analog ASIC Solves Thermal Analysis Problems

Simple Analog ASIC Solves Thermal Analysis Problems
by admin on 03-02-2015 at 1:00 pm

In a world where Application Specific Integrated Circuits (ASICs) and Application Specific Standard Products (ASSPs) are dominating every conceivable application, greater attention is being applied to their long term reliability. These chips are being built on smaller lithographies, running at higher speeds, dissipating… Read More


DAC: March Update

DAC: March Update
by Paul McLellan on 03-02-2015 at 7:00 am

DAC is coming up. It is already March. If you are in the EDA industry then it is basically three months away, which sounds a lot until you actually have to get everything pulled together so that your booth is ready to go on Monday June 7[SUP]th[/SUP]. Exhibit hours have been extended and now run from 10am to 7pm (only until 6pm on Wednesday).… Read More


3D-IC: Embedded Passives

3D-IC: Embedded Passives
by Arabinda Das on 03-02-2015 at 1:00 am

IEDM 2014 was held in the second week of December 2014 in San Francisco. The excitement is over now and the dust has settled. Last week, at my leisure, I was glancing through the conference proceedings and short course material from IEDM 2014, when a slide from the 3DIC short course caught my attention. The slide presented below gives… Read More