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Future Horizons Industry Update Webinar IFS 2025

Future Horizons Industry Update Webinar IFS 2025
by Daniel Nenni on 09-16-2025 at 2:00 pm

Four Horsemen of the Semiconductor Apocolypse 2025

The Future Horizons Industry Update Webinar, presented today by Malcolm Penn, provides a comprehensive analysis of the semiconductor industry’s current state and future trajectory. Founded in 1989, Future Horizons leverages over 300 man-years of experience, emphasizing impartial insights from facts (e.g., IMF … Read More


Something New in Analog Test Automation

Something New in Analog Test Automation
by Daniel Payne on 09-16-2025 at 10:00 am

IJTAG min

Digital design engineers have used DFT automation technologies like scan and ATPG for decades now, however, analog blocks embedded within SoCs have historically required that a test engineer write tests that require specialized expertise and that can take man-months to debug. Siemens has a long history in the DFT field, SPICE… Read More


MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency

MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
by Daniel Nenni on 09-16-2025 at 6:00 am

2nm

MediaTek’s first chipset using 2nm technology expected in late 2026

MediaTek, a global leader in fabless semiconductor design, has announced a groundbreaking achievement in its partnership with TSMC. The company has successfully developed a flagship system-on-chip (SoC) utilizing TSMC’s cutting-edge 2nm process technology,… Read More


Advancing Semiconductor Design: Intel’s Foveros 2.5D Packaging Technology

Advancing Semiconductor Design: Intel’s Foveros 2.5D Packaging Technology
by Admin on 09-15-2025 at 10:00 am

Intel Foundry Packaging Evolution 2025

In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More


EUV Lithography Without Pellicles: Accounting for Low Yields

EUV Lithography Without Pellicles: Accounting for Low Yields
by Fred Chen on 09-15-2025 at 6:00 am

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While stochastic defects link yield with the practical resolution of EUV lithography resulting from its quantum nature [1], very low yields of EUV processes are more readily linked to the use of EUV masks without pellicles. Pellicles are thin film membrane covers on masks (regardless of wavelength: EUV and DUV and i-line) used… Read More


Podcast EP307: An Overview of SkyWater Technology and its Goals with Ross Miller

Podcast EP307: An Overview of SkyWater Technology and its Goals with Ross Miller
by Daniel Nenni on 09-12-2025 at 10:00 am

Dan is joined by Ross Miller, senior vice president at SkyWater Technology. Ross leads the industrial and aerospace businesses while steering the company’s branding, and corporate communications efforts. He is a seasoned semiconductor and technology executive with over 20 years of experience across startup, enterprise,… Read More


Synopsys Announces Expanding AI Capabilities and EDA AI Leadership

Synopsys Announces Expanding AI Capabilities and EDA AI Leadership
by Daniel Nenni on 09-12-2025 at 6:00 am

Synopsys.ai Copilot Customer Impact

In the fast-paced semiconductor industry Synopsys has redefined EDA with its Synopsys.ai Copilot, a generative AI tool. Since its launch in November 2023, and yes I was at the launch and very skeptical, Copilot has evolved to address the industry’s growing design complexity and projected 15-30% workforce gap by 2030. Let’s… Read More


Webinar Preview – Addressing Functional ECOs for Mixed-Signal ASICs

Webinar Preview – Addressing Functional ECOs for Mixed-Signal ASICs
by Mike Gianfagna on 09-11-2025 at 10:00 am

Webinar Preview – Addressing Functional ECOs for Mixed Signal ASICs

An engineering change order, or ECO in the context of ASIC design is a way to modify or patch a design after layout without needing to re-implement the design from its starting point. There are many reasons to use an ECO strategy. Some examples include correcting errors that are found in post-synthesis verification, optimizing … Read More


The Rise, Fall, and Rebirth of In-Circuit Emulation (Part 1 of 2)

The Rise, Fall, and Rebirth of In-Circuit Emulation (Part 1 of 2)
by Lauro Rizzatti on 09-11-2025 at 6:00 am

The Rise, Fall, and Rebirth of In Circuit Emulation Part 1 Figure 1

Introduction: The Historical Roots of Hardware-Assisted Verification

The relentless pace of semiconductor innovation continues to follow an unstoppable trend: the exponential growth of transistor density within a given silicon area. This abundance of available semiconductor fabric has fueled the creativity of design… Read More


Tessent MemoryBIST Expands to Include NVRAM

Tessent MemoryBIST Expands to Include NVRAM
by Mike Gianfagna on 09-10-2025 at 10:00 am

Tessent MemoryBIST Expands to Include NVRAM

The concept of built-in self-test for electronics has been around for a while. An article in Electronic Design from 1996 declared that, “built-in self-test (BIST) is nothing new.” The memory subsystem is a particularly large and complex part of any semiconductor design, and it’s one that can be particularly vexing to test. Design… Read More