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Synopsys and Samsung Foundry Extend AI-Driven Design Collaboration for Advanced 2nm and Multi-Die Systems

Synopsys and Samsung Foundry Extend AI-Driven Design Collaboration for Advanced 2nm and Multi-Die Systems
by Daniel Nenni on 06-08-2026 at 10:00 am

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At SAFE Forum 2026, Synopsys announced significant advancements in its collaboration with Samsung Foundry, expanding AI-powered design, verification, test, and IP solutions for Samsung’s most advanced process technologies. The announcement underscores the growing importance of electronic design automation (EDA), … Read More


Broadcom Told the Truth. The Market Hasn’t Heard the Rest of It Yet.

Broadcom Told the Truth. The Market Hasn’t Heard the Rest of It Yet.
by Jonah McLeod on 06-08-2026 at 8:00 am

Black Friday

Hock Tan and his CFO Kirsten Spears logged into the June 3 earnings call with numbers that should have satisfied anyone. AI semiconductor revenue hit $10.8 billion in Q2, up 143% year over year, above Broadcom’s own forecast. Full-year AI guidance went to $56 billion. The $100 billion fiscal 2027 target was reaffirmed. By any prior… Read More


Weebit Nano ReRAM Reaches Commercial Tape-Out Milestone

Weebit Nano ReRAM Reaches Commercial Tape-Out Milestone
by Daniel Nenni on 06-08-2026 at 6:00 am

Weebit Nano ReRAM Reaches Commercial Tape Out Milestone

Weebit Nano has achieved a critical milestone in the commercialization of Resistive Random Access Memory (ReRAM) technology with the successful tape-out of two customer products integrating its embedded non-volatile memory IP. One of the products has already returned first silicon and demonstrated functional operation,… Read More


CEO Interview with Chuck Gershman of Owl Autonomous Imaging

CEO Interview with Chuck Gershman of Owl Autonomous Imaging
by Daniel Nenni on 06-07-2026 at 4:00 pm

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Chuck Gershman is the CEO and co-founder of Owl Autonomous Imaging. He has spent more than 30 years in semiconductors, AI imaging, computer vision, and autonomous sensing technologies across executive management, engineering, marketing, business development, and operations.

Chuck is a Drexel University College of Engineering… Read More


CEO Interview with Mike Horton of HYFIX Spatial Intelligence

CEO Interview with Mike Horton of HYFIX Spatial Intelligence
by Daniel Nenni on 06-07-2026 at 2:00 pm

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Mike Horton is a co-founder of HYFIX Spatial Intelligence, which builds GNSS hardware for decentralized positioning and timing networks,  and GEODNET, the world’s largest decentralized GNSS reference network, and HYFIX Spatial Intelligence, which builds GNSS hardware for decentralized positioning and timing networks.… Read More


Podcast EP349: llmda.a’s Unique AI Fabric for Embedded Systems Development with Nagesh Gupta

Podcast EP349: llmda.a’s Unique AI Fabric for Embedded Systems Development with Nagesh Gupta
by Daniel Nenni on 06-05-2026 at 10:00 am

Daniel is joined by Nagesh Gupta, CEO of llmda.ai. Nagesh has built a career spanning multiple aspects of system design and development at companies including Hewlett-Packard, Cadence, Xilinx, and Lattice Semiconductor. He is also a serial entrepreneur. Nagesh founded Taray, Inc., which developed memory interface generators… Read More


CEO Interview with Daniel Schall of Black Semiconductor

CEO Interview with Daniel Schall of Black Semiconductor
by Daniel Nenni on 06-05-2026 at 6:00 am

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Dr. Daniel Schall is CEO and Co-Founder of Black Semiconductor. He holds a PhD in graphene optoelectronics from RWTH Aachen University. His work has shaped integrated photonics for over a decade, driving innovation in chip-to-chip communication. As co-founder of Black Semiconductor, his focus is on rethinking current solutions… Read More


Engineering Documentation is a Critical Source of Truth – Do You Know if it’s Accurate?

Engineering Documentation is a Critical Source of Truth – Do You Know if it’s Accurate?
by Mike Gianfagna on 06-04-2026 at 10:00 am

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Embedded systems programs rarely fail because of a lack of execution capability. They fail because critical engineering documentation drifts out of alignment over time and distance. Simply put, the team is correctly following the wrong instructions. This includes requirements, architecture, implementation, verification,… Read More


Alchip Accelerates on AI ASIC Demand

Alchip Accelerates on AI ASIC Demand
by Daniel Nenni on 06-04-2026 at 8:00 am

Alchip Accelerates on AI ASIC Demand

Alchip Technologies reported improved financial results for the first quarter, reflecting continued momentum in advanced artificial intelligence (AI), high-performance computing (HPC), and custom ASIC demand. The company cited stronger customer engagement in leading-edge semiconductor designs and accelerating tape-out… Read More


Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools

Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools
by Daniel Nenni on 06-04-2026 at 6:00 am

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As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More