Beyond the Accelerator: Why Silicon Challengers Must Transition to Full-System InfrastructureThe recent AI Infra Summit was exceptionally jam-packed,…Read More
The State of the U.S. Semiconductor Manufacturing Workforce 2026 Benchmark ReportAmerica’s semiconductor workforce is entering a decisive growth…Read More
Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-LChip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging…Read More
Analog Bits Targets the Power Challenge at the Heart of Next-Generation ChipsAnalog Bits is expanding its role in advanced…Read More
On October 15 and 16, 2026, in San Francisco, PDF Solutions will hold PDF Solutions CONNECT, the premier event for Semiconductor Analytics and AI. This event starts at the end of SEMICON WEST 2026 in a location in close proximity to the Moscone Center. It is a great opportunity for leading semiconductor and equipment companies attending… Read More
Vivek Raghuraman is co-founder and CEO of Mixx Technologies. At Intel, he led the first integrated silicon photonics transceiver to commercial release. At Broadcom, Raghuraman took two commercial generations of co-packaged optics through hyperscaler qualification in Meta’s environment. In 2023, together with Rebecca … Read More
Stefan Pastine PhD is an American chemist and entrepreneur. In 2011, he founded Connora Technologies, developer of Recyclamine, a recyclable epoxy thermoset technology that allows carbon fiber, fiberglass, and aramid fiber to be recovered from composite waste. Aditya Birla Chemicals acquired Connora in 2019 and applied … Read More
Nick Kuraye is the CEO of ScienceSoft, an AI transformation and software development company focused on regulated industries such as healthcare, insurance, and investment. The company has been in the market since 1989, delivering AI software solutions and supporting AI hardware implementation.
I spoke with Nick about how … Read More
Daniel is joined by Oliver Jones, CEO of Aion Silicon, a global semiconductor design and engineering company delivering custom silicon solutions for the AI age. He leads the company’s strategy and growth as it continuously helps technology companies bring advanced SoC designs to market from architecture through production,… Read More
About twenty years ago I worked with Cliff Hou, LC Lu, and the TSMC PDK team on reference flows with emerging EDA and IP companies. This was the precursor to the OIP. Having a person with LC Lu’s depth of R&D experience running the TSMC Design & Technology Platform is truly an honor, absolutely.
AI is creating two related… Read More
Dr. Sunghyun Park earned his B.S. from KAIST and his Ph.D. from MIT’s CSAIL (Computer Science and Artificial Intelligence Laboratory). He built his career across Intel, Samsung Research, and SpaceX as a semiconductor design engineer, before serving as Vice President at Morgan Stanley in New York — a rare combination of… Read More
👉 This is Part 2 of an editorial series on the evolving economics of AI inference. If you missed Part 1, where I broke down the shift toward full-system integration, the lessons from the AI Infra Summit, and the “no forks” open-source philosophy, you can read it HERE: Beyond the Accelerator: Why Silicon Challengers … Read More
Modern system-on-chip (SoC) and application-specific integrated circuit (ASIC) designs are extraordinarily complex. They may combine processors, accelerators, memory controllers, high-speed interfaces, security functions, and millions—or even billions—of logic gates. Verifying these systems entirely through … Read More
The central argument of Ankur Gupta’s AI Infra Summit keynote is simple but consequential: the next leap in AI infrastructure will not come from improving chips, servers, cooling systems, or data centers independently. It will come from optimizing the connections among them. Siemens frames this as a journey “from custom silicon… Read More
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