Agentrys hotchips 2

UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips

UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips
by Daniel Nenni on 09-15-2026 at 8:00 am

UWB Without the Integration Headache Ceva and LG Bring Precision to More Chips

Ceva and LG Electronics have joined forces to remove one of the biggest obstacles to ultra-wideband adoption: integrating a complete radio, baseband and software stack into a production system-on-chip. Their joint platform combines Ceva-Waves UWB baseband intellectual property and software with an RF front end developed… Read More


PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity

PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
by Admin on 09-15-2026 at 6:00 am

PCIe 7 Switch IP with Time Division Multiplexing

By Tim Messegee, Senior Director of Solutions Marketing at Rambus

PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs… Read More


CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps

CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps
by Daniel Nenni on 09-14-2026 at 10:00 am

CAST TCPIP 100G PressFigure

CAST has introduced TCPIP-100G, a synthesizable intellectual-property core that implements a complete TCP/IP stack in hardware for ASICs and FPGAs. The core is designed to transmit and receive at up to 100 Gbps without depending on a host processor. That distinction is important: this is not simply a checksum engine or a network-interface… Read More


Semiconductor Engineering Has a State-Continuity Problem

Semiconductor Engineering Has a State-Continuity Problem
by Moh Kolb on 09-14-2026 at 8:00 am

Semi eng state conti Problem sept11 semiwiki

Product realization depends not only on reaching the next engineering state, but on preserving the relationships between states from intent through qualification, release, and lifecycle learning.

Semiconductor development is usually described as a sequence of activities: architecture, design, fabrication, packaging,… Read More


Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit

Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit
by Daniel Nenni on 09-14-2026 at 6:00 am

Samtec Connects the AI Era

Samtec is using two major 2026 industry events to make a clear engineering argument: faster accelerators alone will not determine the performance of next-generation artificial-intelligence infrastructure. The copper and optical links connecting chips, packages, boards, racks and data centers must scale in bandwidth, … Read More


Nvidia Sees AGI While OpenAI Sees Danger

Nvidia Sees AGI While OpenAI Sees Danger
by Daniel Nenni on 09-13-2026 at 10:00 am

Nvidia Sees AGI While OpenAI Sees Danger

Jensen Huang’s declaration that “AGI has arrived” is less a scientific verdict than a compressed statement about infrastructure, economics and momentum. His evidence is OpenAI’s GPT-6 Astra, reportedly trained on more than 100,000 Nvidia Grace Blackwell NVL72 systems, followed by a promise that another 400,000 GPUs are coming… Read More


Samsung Might Be the Most Unusual Company on Earth

Samsung Might Be the Most Unusual Company on Earth
by Daniel Nenni on 09-13-2026 at 8:00 am

Samsung Might Be The Most Unusual Company 2026

Samsung might be the most unusual company on earth because it is difficult to decide what kind of company it actually is. To most consumers, Samsung means smartphones, televisions, refrigerators. Yet the name also appears on apartment towers, cargo ships, hospital equipment, insurance policies, construction projects, and… Read More


SemiWiki CEO Interview with Dr. Nissan Maskil of Qarakal Quantum

SemiWiki CEO Interview with Dr. Nissan Maskil of Qarakal Quantum
by Daniel Nenni on 09-13-2026 at 6:00 am

Nissan Maskil, Qarakal Qauntum Headshot

Nissan Maskil, PhD, is the CEO and co-founder of Qarakal Quantum, established in 2024. Nissan brings 40 years of national technology program experience to Qarakal Quantum, where they’re working to enable researchers and enterprises to run larger and more meaningful quantum computing workloads sooner.

Nissan is a deep-tech… Read More


Podcast EP365: How Agentrys is Revolutionizing Chip Design with Mark Ren

Podcast EP365: How Agentrys is Revolutionizing Chip Design with Mark Ren
by Daniel Nenni on 09-11-2026 at 10:00 am

Daniel is joined by Mark Ren, founder and CEO of Agentrys. Mark has 26 years of EDA and AI R&D experience spanning IBM Research and NVIDIA Research, driving design automation innovations that power modern chip design. He received the IBM Corporate Award for contributions to the design closure for high-performance microprocessors.… Read More


TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips

TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips
by Daniel Nenni on 09-11-2026 at 6:00 am

TSMC OIP 2026

It’s that time of year again. Time certainly flies when AI is chasing you! This year marks the 18th TSMC OIP Ecosystem Forum, and it promises to be bigger and better than ever. My SemiWiki partners, Mike Gianfagna and Kalar Rajendiran, will join me in covering the event live, so stay tuned for all the news that’s fit to print.

Mike and… Read More