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AION Silicon: Architecting Smarter SoCs with RISC-V: Balancing Performance, Flexibility, and Risk

AION Silicon: Architecting Smarter SoCs with RISC-V: Balancing Performance, Flexibility, and Risk
by Daniel Nenni on 06-22-2026 at 10:00 am

AION Silicon Architecting Smarter SoCs with RISC V

As semiconductor complexity accelerates across AI, automotive, and edge computing markets, SoC architecture has become a critical determinant of commercial success. Modern silicon programs must simultaneously achieve aggressive performance-per-watt targets, support evolving workloads, and maintain manageable development… Read More


AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoption

AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoption
by raghu shankar on 06-22-2026 at 6:00 am

2026 Jun AI Native Virtual Chiplet ecosystem Shift Left Shift Up Shift Out

By Raghu Shankar | LinkedIn, June 2026

Systems-in-package (SIPs) with 2.5D and 3D heterogenous integration, consisting of multiple dies and chiplets deliver 10x more functionality than traditional monolithic chips. This capability enables innovative solutions for diverse needs in scientific computing, automotive, edge… Read More


CEO Interview with Mark Goranson of EMASS

CEO Interview with Mark Goranson of EMASS
by Daniel Nenni on 06-21-2026 at 4:00 pm

Mark Goranson (1)

Mark Goranson is the Chief Executive Officer EMASS, a wholly owned subsidiary of Nanoveu, for which they serve as the semiconductor technology division. With more than 45 years in the global semiconductor industry, he has held senior leadership roles at companies including Intel, Freescale Semiconductor, and ON Semiconductor.… Read More


CEO Interview with James Regan of Oriole

CEO Interview with James Regan of Oriole
by Daniel Nenni on 06-21-2026 at 2:00 pm

James Regan, Oriole CEO (2)

James Regan is a seasoned technology executive and physicist with over 30 years in optical communications. As Co-Founder and CEO of Oriole, he is pioneering the next radical breakthrough in advanced optical networking systems for AI. James has a proven track record of transforming university research into globally impactful… Read More


Podcast EP351: A Detailed Overview of the Emerging Standards for 400G with Kent Lusted

Podcast EP351: A Detailed Overview of the Emerging Standards for 400G with Kent Lusted
by Daniel Nenni on 06-19-2026 at 10:00 am

Daniel is joined by Kent Lusted, a Distinguished Architect at Synopsys and an integral part of the company’s Ethernet IP design team. He has been an active contributor and member of the IEEE 802.3 Ethernet PHY standards development leadership team for more than 15 years. Prior to Synopsys, Kent worked at Intel for 30+ years, focused… Read More


The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes

The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes
by Daniel Nenni on 06-19-2026 at 6:00 am

Intel and PDF Solutions Tackle Advanced Nodes

One of the most difficult things to do in life is ask for help. This is inherently a big problem in the semiconductor industry dating back to the IDM days where silos of secrecy were established. As a result Intel has struggled with yield since the 14nm FinFET process nodes.

On the outside PDF Solutions is a publicly traded semiconductor… Read More


Webinar: Faster Design Spec to Implementation using IP-XACT

Webinar: Faster Design Spec to Implementation using IP-XACT
by Daniel Payne on 06-18-2026 at 10:00 am

SoC Compiler

As SoC design flows grow increasingly complex, IP-XACT has become a cornerstone standard throughout the entire development lifecycle: from architecture specification to design assembly and verification. Its growing adoption is reflected in the standard’s continuous evolution, from the 2009 release through 2014… Read More


Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too Late

Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too Late
by Mike Gianfagna on 06-18-2026 at 8:00 am

Webinar Caspia Shows You How to Fix Security Flaws Before It’s Too Late

I recently posted an overview of an upcoming webinar from Caspia Technologies. That post provides background on the excellent speakers who will present and an overview of the topics they will cover.  I recently had the opportunity to attend a dry run of the entire event. The details presented are quite impactful, so I thought I’d… Read More


Feed Forward Intelligence: Enabling Testability in the Chiplets Era

Feed Forward Intelligence: Enabling Testability in the Chiplets Era
by Kalar Rajendiran on 06-18-2026 at 6:00 am

Data Feed Forward Architecture

The semiconductor industry is entering a new era in which advanced packaging and chiplets-based architectures are becoming the primary drivers of system-level innovation. As traditional process-node scaling becomes increasingly complex and expensive, manufacturers are turning to heterogeneous integration, combining… Read More


Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions

Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions
by Daniel Nenni on 06-17-2026 at 2:00 pm

Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions

Synopsys has announced the availability of the first wave of its Multiphysics Fusion Solutions, extending its vision of a unified engineering environment that connects EDA, semiconductor physics, system simulation, and artificial intelligence-driven optimization. The announcement addresses one of the most significant… Read More