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See Defacto Technologies at DAC 2026

See Defacto Technologies at DAC 2026
by Daniel Nenni on 07-20-2026 at 2:00 pm

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I have had the pleasure of working with Defacto Technologies for the past 10 years on SemiWiki and I am always impressed with their professionalism and ability to quickly address the challenges of complex SoC design.

From my perspective, Defacto’s technology is designed to improve productivity and design quality by enabling … Read More


Keysight Design Engineering Software at DAC 2026: Going Deep on Chiplets, RF and AI-Driven Design

Keysight Design Engineering Software at DAC 2026: Going Deep on Chiplets, RF and AI-Driven Design
by Daniel Nenni on 07-20-2026 at 10:00 am

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Keysight Technologies returns to 2026 DAC, The Chips to Systems Conference this year as a Silver Sponsor and an “I LOVE DAC” sponsor, bringing its Design Engineering Software portfolio to Booth #927 at DAC 2026, which runs July 26-29 in Long Beach, Calif. The Keysight team will be on-site Monday through Wednesday … Read More


Tuple Technologies Develops AI-powered Infrastructure at 2026 DAC

Tuple Technologies Develops AI-powered Infrastructure at 2026 DAC
by Daniel Nenni on 07-20-2026 at 6:00 am

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Tuple Technologies develops AI-powered infrastructure and operations platforms specifically designed for semiconductor companies. The company’s solutions help engineering organizations simplify CAD infrastructure management, optimize cloud resources, improve security and compliance, and reduce operational… Read More


CEO Interview with Dr. Il Park of Primemas

CEO Interview with Dr. Il Park of Primemas
by Daniel Nenni on 07-19-2026 at 6:00 pm

Dr. Il Park

Dr. Il Park is the Founder and CEO of Primemas Inc. Prior to founding Primemas, he was Vice President at SK hynix where he led memory solutions, design innovation, and CAE. Prior to that he was the head of the SOC architecture development and engineering team at Samsung Electronics. Earlier in his career, Il was at IBM T.J. Watson Research… Read More


CEO Interview with Mohit Gupta of TYLsemi

CEO Interview with Mohit Gupta of TYLsemi
by Daniel Nenni on 07-19-2026 at 4:00 pm

Mohit

Mohit Gupta founded TYLsemi to build chiplet-based intelligent power and connectivity solutions for AI infrastructure—an area where custom silicon has long been underserved. TYLsemi exists to provide the foundational chiplet platform that enables tailored custom silicon solutions for the evolving needs of AI infrastructure.… Read More


Podcast EP356: An Oveview of the Unique Skills and Broad Impact of Alphacore with Andrew Levy

Podcast EP356: An Oveview of the Unique Skills and Broad Impact of Alphacore with Andrew Levy
by Daniel Nenni on 07-17-2026 at 2:00 pm

Daniel is joined by Andrew Levy, Vice President of Business Development, IP & ASIC at Alphacore. Andrew leads strategic growth initiatives, customer engagement, technology commercialization, and business development activities for the company’s semiconductor IP, ASIC design services, and advanced microelectronics… Read More


CEO Interview with Madhulima Tewari of VerifAIX

CEO Interview with Madhulima Tewari of VerifAIX
by Daniel Nenni on 07-17-2026 at 10:00 am

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Madhulima Tewari is the CEO and founder of VerifAIX. After two decades building EDA tools, taping out chips, and working on distributed systems, cloud infrastructure, and enterprise AI applications, she teamed up with chip design and methodology leaders and university researchers to build an agentic AI system aimed at helping… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging

TSMC CoWoS versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-17-2026 at 8:00 am

TSMC CoWoS verus Intel EMIB

There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:

Jeff Su: I guess very simply put, EMIB-T, in his view, isRead More


TSMC’s Raises the Bar on CAPEX!

TSMC’s Raises the Bar on CAPEX!
by Daniel Nenni on 07-17-2026 at 6:00 am

TSMC CAPEX 2026 SemiWiki

On the latest investor call the big story was the increase in CAPEX for 2026 and the expected CAPEX for 2027. TSMC raised the CAPEX ceiling for 2026 from US$56 billion to US$64 billion. My guess would be US$64 billion will be spent if not more. We have been discussing this in the SemiWiki Forum and my guess for the 2027 TSMC CAPEX is an incredible… Read More


Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC

Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC
by Daniel Nenni on 07-16-2026 at 2:00 pm

Agentrys DAC Plan

Agentrys is pioneering Agentic Design Automation (ADA), a new paradigm for semiconductor engineering. Electronic Design Automation (EDA) has transformed the industry by automating engineering algorithms. Today, frontier AI can automate many engineering tasks by understanding specifications, generating RTL and … Read More