Ceva and LG Electronics have joined forces to remove one of the biggest obstacles to ultra-wideband adoption: integrating a complete radio, baseband and software stack into a production system-on-chip. Their joint platform combines Ceva-Waves UWB baseband intellectual property and software with an RF front end developed… Read More
Jalapeño Hot Chip, Cool Power Bill: OpenAI Turns Up the Heat on AI InferenceOpenAI’s Jalapeño is a custom accelerator designed specifically…Read More
2026 Ceva Edge Symposium: Building Intelligence Beyond the CloudThe 2026 Ceva Edge Symposium will bring together…Read More
HBM’s Second Act: When Memory Starts ThinkingSamsung’s Hot Chips 2026 presentation, “HBM Base Die:…Read More
NVIDIA Vera: Rebuilding the CPU for Agentic AISource: Jonathon Evans and Polychronis Xekalakis, “NVIDIA Vera…Read MorePCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
By Tim Messegee, Senior Director of Solutions Marketing at Rambus
PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs… Read More
CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps
CAST has introduced TCPIP-100G, a synthesizable intellectual-property core that implements a complete TCP/IP stack in hardware for ASICs and FPGAs. The core is designed to transmit and receive at up to 100 Gbps without depending on a host processor. That distinction is important: this is not simply a checksum engine or a network-interface… Read More
Semiconductor Engineering Has a State-Continuity Problem
Product realization depends not only on reaching the next engineering state, but on preserving the relationships between states from intent through qualification, release, and lifecycle learning.
Semiconductor development is usually described as a sequence of activities: architecture, design, fabrication, packaging,… Read More
Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit
Samtec is using two major 2026 industry events to make a clear engineering argument: faster accelerators alone will not determine the performance of next-generation artificial-intelligence infrastructure. The copper and optical links connecting chips, packages, boards, racks and data centers must scale in bandwidth, … Read More
Nvidia Sees AGI While OpenAI Sees Danger
Jensen Huang’s declaration that “AGI has arrived” is less a scientific verdict than a compressed statement about infrastructure, economics and momentum. His evidence is OpenAI’s GPT-6 Astra, reportedly trained on more than 100,000 Nvidia Grace Blackwell NVL72 systems, followed by a promise that another 400,000 GPUs are coming… Read More
Samsung Might Be the Most Unusual Company on Earth
Samsung might be the most unusual company on earth because it is difficult to decide what kind of company it actually is. To most consumers, Samsung means smartphones, televisions, refrigerators. Yet the name also appears on apartment towers, cargo ships, hospital equipment, insurance policies, construction projects, and… Read More
SemiWiki CEO Interview with Dr. Nissan Maskil of Qarakal Quantum
Nissan Maskil, PhD, is the CEO and co-founder of Qarakal Quantum, established in 2024. Nissan brings 40 years of national technology program experience to Qarakal Quantum, where they’re working to enable researchers and enterprises to run larger and more meaningful quantum computing workloads sooner.
Nissan is a deep-tech… Read More
Podcast EP365: How Agentrys is Revolutionizing Chip Design with Mark Ren
Daniel is joined by Mark Ren, founder and CEO of Agentrys. Mark has 26 years of EDA and AI R&D experience spanning IBM Research and NVIDIA Research, driving design automation innovations that power modern chip design. He received the IBM Corporate Award for contributions to the design closure for high-performance microprocessors.… Read More
TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips
It’s that time of year again. Time certainly flies when AI is chasing you! This year marks the 18th TSMC OIP Ecosystem Forum, and it promises to be bigger and better than ever. My SemiWiki partners, Mike Gianfagna and Kalar Rajendiran, will join me in covering the event live, so stay tuned for all the news that’s fit to print.
Mike and… Read More



ASML and TSMC’s 12-Inch Photomask Initiative: Technical Significance