I will see you at the Substrate Vision Summit in Santa ClaraWIth packaging being one of the top sources…Read More
The Immensity of Software Development and the Challenges of Debugging Series (Part 4 of 4)The Impact of AI on Software and Hardware…Read More
Alchip is Paving the Way to Future 3D Design InnovationAt the recent TSMC OIP Ecosystem Forum in…Read More
Production of electronic devices is finally on the uptrend following a post-pandemic slump in late 2021. According to IDC, smartphone shipments versus a year ago turned negative in 3Q 2021 at -6%. The decline hit a low of -18% in 4Q 2022. Since then, smartphones have been recovering. IDC data is not yet available, but Canalys estimated… Read More
In today’s fast-paced world, innovation in semiconductor design is a constant demand. The need for quicker, more accurate, and innovative solutions has paved the way for exploring the potential of Generative AI (#GenerativeAI) in the realm of semiconductor design development. Can it be done? Hell yeah! In this article… Read More
Every year EDA vendor MunEDA hosts a user group meeting where engineers present how they used automation tools to improve their IC designs, and one presentation from Peter Huber of Infineon caught my attention, it was all about SRAM design optimization. Peter has authored papers at IEEE conferences and been issued patents related… Read More
Design re-use has enabled IC design teams to create billion-transistor designs where hundreds of IP blocks are pre-built from internal or external sources. Keeping track of where each of these IP blocks came from, what their version status is, managing IP, or even discerning their license status can be a full-time job if tracked… Read More
Dan is joined by Dr. Walden Rhines. Wally is a lot of things, CEO of Cornami, board member, advisor to many and friend to all. For this discussion he is the Executive Sponsor of the SEMI Electronic Design Market Data report.
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Electrical copper interconnects, once the backbone of data center networks, are facing growing challenges. Rapid expansion of AI and ML applications is driving a significant increase in cluster sizes within data centers, resulting in substantial demands for faster I/O capabilities. While the surge in I/O requirements is … Read More
Dan is joined by Anand Thiruvengadam, director of product and business management and head of the Solutions and Go-to-Market functions for the memory market segment at Synopsys.
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Overall revenues came in at Euro6.7B with EPS at Euro4.81, more… Read More
Pat Brockett is a veteran of the global semiconductor industry. He began his career in sales and marketing at Texas Instruments. After that, he was senior vice president of worldwide sales and marketing at National Semiconductor. Subsequently, he headed the analog division and is credited with turning it around.
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If you have anything to do with the semiconductor industry, you already know that one of the hottest areas for both manufacturing and EDA are systems designed with advanced packaging, basically putting more than one die (aka chiplets) in the same package.
When 3D packaging was first introduced, there were not really any effective… Read More
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