By Dina Medhat
Three key takeaways
- 3D ICs require fundamentally new ESD verification strategies. Traditional 2D approaches cannot address the complexity and unique connections in stacked-die architectures.
- Classifying external and internal IOs is essential for robust and cost-efficient ESD protection. Proper differentiation







Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?