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Mastering Atomic Precision – ALD’s Role in Semiconductor Advancements

Mastering Atomic Precision – ALD’s Role in Semiconductor Advancements
by Admin on 06-11-2024 at 8:00 am

Application Areas Photo (1)

Atomic layer deposition (ALD) is a thin-film deposition method that continues to enable continuous advances in semiconductor device fabrication. Essentially, it involves exposing substrates sequentially to at least two different vapor phase atmospheres in which self-limiting reactions take place on the surface: the first… Read More


WEBINAR: Redefining Security – The challenges of implementing Post-Quantum Cryptography (PQC)

WEBINAR: Redefining Security – The challenges of implementing Post-Quantum Cryptography (PQC)
by Daniel Nenni on 06-11-2024 at 8:00 am

Secure IC SemiWiki

In the late 1970s, cryptographic history saw the emergence of two seminal algorithms: McEliece and RSA. At that time, quantum threats were theoretical, and the selection criteria for cryptographic algorithms prioritized public key length and execution time, leading to RSA’s prominence while McEliece remained obscure… Read More


How IROC Makes the World a Safer Place with Unique Soft Error Analysis

How IROC Makes the World a Safer Place with Unique Soft Error Analysis
by Mike Gianfagna on 06-11-2024 at 6:00 am

How IROC Makes the World a Safer Place with Unique Soft Error Analysis

I recently had an eye-opening discussion regarding the phenomena of soft errors in semiconductor devices. I always knew this could be a problem in space, where there are all kinds of high energy particles. What I didn’t realize is there are two trends that are making this kind of problem relevant on the ground as well as in space. The… Read More


Driving Data Frontiers: High-Performance PCIe® and CXL® in Modern Infrastructures

Driving Data Frontiers: High-Performance PCIe® and CXL® in Modern Infrastructures
by Kalar Rajendiran on 06-10-2024 at 10:00 am

Alphawave Ecosystem Collaborative Partners

The increasing demands of data-intensive applications necessitate more efficient storage and memory utilization. The rapid evolution of AI workloads, particularly with Generative AI (GenAI), demands infrastructure that can adapt to diverse computational needs. AI models vary widely in resource requirements, necessitating… Read More


TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design

TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design
by Mike Gianfagna on 06-10-2024 at 6:00 am

TSMC Advanced Packaging Overcomes the Complexities of Multi Die Design

The TSMC Technology Symposium provides a worldwide stage for TSMC to showcase its advanced technology impact and the extensive ecosystem that is part of the company’s vast reach. These events occur around the world and the schedule is winding down. TSMC covers many topics at its Technology Symposium, including industry-leading… Read More


Blank Wafer Suppliers are not Totally Blank

Blank Wafer Suppliers are not Totally Blank
by Claus Aasholm on 06-09-2024 at 8:00 am

Sand to Semiconductors

AI requires more Silicon capacity
Deep in the supply chain, some wizards turn sand into perfect diamond-structured crystal disks of silicon, which are necessary for the entire semiconductor supply chain.

They are part of the semiconductor supply chain, making Silicon Sand almost a thousand times more valuable.

The glimmer … Read More


Podcast EP227: The Significance of the RISC-V Movement and the Upcoming Andes RISC-V event with Mark Himelstein

Podcast EP227: The Significance of the RISC-V Movement and the Upcoming Andes RISC-V event with Mark Himelstein
by Daniel Nenni on 06-07-2024 at 10:00 am

Dan is joined by Mark Himelstein, President of Heavenstone. Most recently, as Chief Technology Officer at RISC-V International, Mark contributed to shaping RISC-V technology through visionary leadership and industry expertise. He has a track record of executive roles at Graphite Systems, Quantum, and Infoblox.

Dan discusses… Read More


Accelerate SoC Design: Addressing Modern Prototyping Challenges with S2C’s Comprehensive Solutions (II)

Accelerate SoC Design: Addressing Modern Prototyping Challenges with S2C’s Comprehensive Solutions (II)
by Daniel Nenni on 06-07-2024 at 8:00 am

Prodigy

In the fast-paced world of Electronic Design Automation (EDA), the complexity of chip designs is continuously rising. With the burgeoning of systems such as 5G communication devices and Advanced Driver-Assistance Systems (ADAS) teeming with thousands of components, the demand for robust and efficient prototyping platforms… Read More


CEO Interview: Dieter Therssen of Sigasi

CEO Interview: Dieter Therssen of Sigasi
by Daniel Nenni on 06-07-2024 at 6:00 am

Dieter Therssen

Dieter Therssen obtained his master’s degree in Electronics Engineering from KU Leuven in 1987. He started his career as a hardware design engineer, using IMEC’s visionary tools and design methodologies in the early days of silicon integration.

Since then, Dieter developed his career across many digital technologies,… Read More


3DIC Verification Methodologies for Advanced Semiconductor ICs

3DIC Verification Methodologies for Advanced Semiconductor ICs
by Kalar Rajendiran on 06-06-2024 at 10:00 am

3DIC Flow Challenges

At the recent User2user conference, Amit Kumar, Principal Hardware Engineer, Microsoft, shared the company’s experience from building a 3DIC SoC and highlighted Siemens EDA tools that were used. The following is a synthesis of core aspects of that talk.

3DIC Challenges

Despite the numerous advantages of 3DIC technology, its… Read More