While systems design underpins the explosion in “smart everything”, it remains somewhat isolated from another explosion—the proliferation of tools for application lifecycle management (ALM). ALM tools are prevalent on the web, in the cloud and on our phones, to streamline product design and build, to track correspondence… Read More
2026 Outlook with Richard Hegberg of Caspia TechnologiesTell us a little bit about yourself and…Read More
Siemens EDA Illuminates the Complexity of PCB DesignAs heterogeneous multi-die design becomes more prevalent, the…Read More
Accelerating Advanced FPGA-Based SoC Prototyping With S2CHaving spent a significant amount of my career…Read More
Verification Futures with Bronco AI Agents for DV DebugVerification has become the dominant bottleneck in modern…Read More“Kandou it”
In another departure from my chip design verification “beat,” I took a look at Kandou and like what I learned.
Kandou from Lausanne, Switzerland, boasts “Kandou It” as its tagline and as it should be if Kandou’s USB-C multi-protocol retimer solution with USB4 support is inside next-gen laptops, notebooks, desktops, tablets and… Read More
Highlights of the TSMC Technology Symposium 2021 – Automotive
At the recent TSMC Technology Symposium, TSMC provided a detailed discussion of their development roadmaps. Previous articles have reviewed the highlights of silicon process and packaging technologies. The automotive platform received considerable emphasis at the Symposium – this article specifically focuses on the… Read More
Keynote from Google at CadenceLIVE Americas 2021
Last week, Cadence hosted its annual CadenceLIVE Americas 2021 conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.
One of the keynotes was from Partha Ranganathan, VP and Engineering Fellow from Google. His talk was titled,… Read More
Highlights of the TSMC Technology Symposium 2021 – Packaging
The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.
General
3DFabricTM
Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.
2.5D package technology – CoWoS
The 2.5D packaging options are divided into the CoWoS… Read More
Highlights of the TSMC Technology Symposium 2021 – Silicon Technology
Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap. This article will review the highlights of the silicon process developments and future release plans.
Subsequent articles will describe the packaging offerings and delve into technology … Read More
Podcast EP24: ASIC Design at the Leading Edge
Dan and Mike are joined by Graham Curren, founder and CEO of ASIC specialist Sondrel. Graham discusses the challenges of designing ASICs at the leading edge from a technology, design team and customer perspective. He explores where the real challenges are in building these types of chips and how Sondrel meets those challenges.… Read More
CEO Interview: Deepak Shankar of Mirabilis Design
The founder of Mirabilis Design, Mr. Shankar has over two decades of experience in management and marketing of system level design tools. Prior to establishing Mirabilis Design, he held the reins as Vice President, Business Development at MemCall, a fabless semiconductor company and SpinCircuit, a joint venture of industry… Read More
Data Orchestration Hardware Unlocks the Full Potential of AI
We all know that artificial intelligence (AI) and machine learning (ML) are fundamentally changing the world. From the smart devices that gather data to the hyperscale data centers that analyze it, the impact of AI/ML can be felt almost everywhere. It is also well-known that hardware accelerators have opened the door to real-time… Read More
WEBINAR: 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC
If you are involved in designing systems that process data, you’re going to want to attend this webinar. Practically speaking, this should include a large percentage of the SemiWiki readership. Since data is the new oil there are a lot of applications drawn to data and information processing. Before we explore this webinar, let’s… Read More



AI Bubble?