TSMC's 2024 Sustainability Report: Pioneering a Greener Semiconductor FutureTSMC, the world's most trusted semiconductor foundry, released…Read More
Intel's Commitment to Corporate Responsibility: Driving Innovation and SustainabilityIntroduction by Lip-BU Tan: I’m an engineer at…Read More
Cadence's Strategic Leap: Acquiring Hexagon's Design & Engineering BusinessIn a bold move that underscores the accelerating…Read More
TSMC 2025 Update: Riding the AI Wave Amid Global ExpansionWelcome to the second half of a very…Read More
Alchip’s 3DIC Test Chip: A Leap Forward for AI and HPC InnovationToday Alchip Technologies, a Taipei-based leader in high-performance…Read More
Our smart phones, tablets, laptops and desktops are the most common consumer products with advanced 2.5D and 3D IC packaging techniques. I love seeing the product tear down articles to learn how advanced packaging techniques are being used, so at the User2User conference in Santa Clara I attended a presentation from Tarek Ramadan,… Read More
In a simple answer – everyone. A keynote presentation “Sensing the Unknowns and Managing Power” by Mahesh Tirupattur, the Executive Vice President at Analog Bits at the recent Siemens User2User conference, discussed the need and application of sensors in computing and power applications. Why sense? As Mahesh explains, sensing… Read More
Next up in this series on modulated signals is an example of multi-dimensional EM design challenges: RF power amplifiers (PAs). Digital pre-distortion (DPD) is a favorite technique for linearizing PA performance. Static effects are easy to model and correct, but PAs are notorious for interrelated dynamic effects spoiling … Read More
The never ending appetite for higher bandwidths, faster data interfaces and lower latencies are bringing about changes in how data is processed at data centers. The expansion of cloud to the network edge has introduced broad use of artificial intelligence (AI) techniques for extracting meaning from data. Cloud supercomputing… Read More
At this year’s SPIE Advanced Lithography conference, changes to EUV masks were particularly highlighted, as a better understanding of their behavior is becoming clear. It’s now confirmed that a seemingly symmetric EUV mask absorber pattern does not produce a symmetric image at the wafer, as a conventional DUV … Read More
The live events I have attended thus far this year have been very good. As much as I liked the virtual events, attending in the comfort of my home or sailboat, it is great to be live and networking inside the semiconductor ecosystem, absolutely.
Ansys has been a great supporter of the Design Automation Conference but this year they … Read More
One doesn’t expect to get emotional at the kickoff keynote for an industry event, but Radiodays Europe 22 flipped the script with live music and a bulletin from Ukrainian broadcasters beamed in from a bunker in Ukraine. The bunker broadcast followed speeches from Swedish and Finnish broadcasting executives including … Read More
Dan is joined by Steve Roddy, chief marketing officer of Quadric, a leading processor technology intellectual property (IP) licensor. Roddy brings more than 30 years of marketing and product management expertise across the machine learning (ML), neural network processor (NPU), microprocessor, digital signal processor
The VLSI Symposium on Technology & Circuits will be held in Hawaii from June 12th to June 17th. You can register for the conference here.
The tip sheet for the conference has been released and one thing that caught my eye is some data from the Intel 4 paper that Intel will be presenting at the conference.
Intel’s old roadmap had 14nm,… Read More
Vaysh Kewada is cofounder and CEO at Salience Labs, a company developing an ultra high-speed multi-chip processor that packages a photonics chip together with standard electronics to enable exascale AI. Salience is funded by Oxford Sciences Enterprise, Cambridge Innovation Capital, Arm-backed Deeptech Labs, former Dialog… Read More
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Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet