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If you are designing high-performance computing and networking SoCs for hyperscale data centers, then you require IP that enables large amounts of data to travel at very fast rates. Whether the IP is for true long reach or very short-reach die-to-die connectivity in multi-chip modules (MCMs), you must consider several essential features such as throughput, …
Typical applications for SPICE simulators include analog, small and middle size digital and memory blocks, whereas FastSPICE simulators targets larger blocks or full chip simulations including memory circuits, SoCs. SPICE is very accurate but cannot handle large designs and simulation time can be extensive. While FastSPICE can reduce simulation times dramatically, it cannot meet the …
In many aspects of our lives, increasingly intelligent subsystems will do the thinking for us. 5G networks will self-tune to maximize their data throughput. Automation, with the help of AI, robotics, and the internet of things, is playing an increasing role in manufacturing. Vehicles are becoming ever more intelligent and autonomous. This webinar considers how …
Time: September 13, 2021 8 AM EDT / 1 PM BST / 5:30 PM IST Venue: Onlineo About this Webinar In today’s near threshold designs, trends like tighter integration and increasing layout density on advanced nodes, frequency escalation (5G) and complex packaging scenarios are making the need for accurate and efficient electromagnetic modeling critical. From …
Wednesday, October 20, 2021 | 10:00 -11:00 a.m. PT SoCs for Automotive applications such as ADAS, Infotainment, and connected vehicles are shifting to a more domain-based architecture. As a result, the car’s electronics for such applications are requiring a major redesign for a more efficient connectivity with the utmost reliability, security, and safety. This shift …
Traditional coverage-based verification methods are no longer sufficient to verify complex SoCs integrating many processor cores and IP subsystems. To conquer the verification challenge of complex SoCs, companies are shifting their development paradigm to a software first approach. By considering the target software up front, as a critical part of the SoC development process, designs …
Wednesday, March 9, 2022 | 10-10:45 a.m. PST Complex bus protocols, increased on-chip functionalities, coupled with limited shared I/O resources, result in complex wiring connections in SoCs with numerous muxing schemes. Simulation and structural analysis approaches require huge effort and may lead to bug escapes making them inefficient for SoC connectivity verification. Connectivity verification using …
When : April 26th 2022 Where : Computer History Museum 1401 N. Shoreline Blvd Mountain View, CA 94043, USA D&R IP-SoC Silicon Valley 2022 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC providers, the seed of innovation in Electronic Industry, are invited to highlight …
Description Automatic generation of System Verilog Assertions for block level register specification, chip-level RTL design aggregating leaf level design, and RTL wrapper connectivity checks at SoC level. Time Apr 28, 2022 10:00 AM in Pacific Time (US and Canada) REGISTER HERE
Description Learn how to automatically assemble and connect IPs from many different sources at your SoC level using SoC Enterprise™. This includes automatic generation of components such as aggregators, bridges, channels, bus fabrics, muxes, etc. wherever needed. REGISTER HERE
The semiconductor world has to face a worldwide accelerated evolution, never seen before, both in terms of technology evolution (3D Packaging, advanced nodes) as well as new applications (IoT, Artificial Intelligence, Automotive, Security, etc) triggering an increasing demand of Semiconductor resources. D&R IP SoC Event Series is fully dedicated to IP (Silicon Intellectual property) and …
Simulator performance is critical owing to the exponentially increasing complexity of SoC designs and shrinking market time. Cadence® Xcelium™ is a leader in simulation performance, and we focus relentlessly on improving the core performance of the simulator. We keep developing new performance optimizations that are delivered with each new release of Xcelium. It is easy to achieve …
Description Multi-die designs allow systems engineering to pack more functionality with different timing and power constraints into a single package. Older generation multi-die split the dies into high-speed and low speed. Newer, high-performance multi-die System-on-Chip (SoC) requires interaction between memories across the die-to-die interfaces. Connections between dies must be power efficient, have low latency, provide …
