D&R IP SoC Silicon Valley 2022

Computer History Museum, Mountain View, CA

When : April 26th 2022 Where : Computer History Museum 1401 N. Shoreline Blvd Mountain View, CA 94043, USA D&R IP-SoC Silicon Valley 2022 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC providers, the seed of innovation in Electronic Industry, are invited to highlight …

Arm and Cadence: Achieving Best Silicon Power, Performance, and Area

Online

Join Cadence and Arm to learn how you can achieve the best power, performance, area (PPA) and time to tapeout for Arm® CPU implementation using the latest Cadence® Digital Full Flow. This event covers topics including high-performance design for the Arm Cortex®-A710 and other Arm processors, energy-efficient CPU implementation flows, high-reliability design using Arm library …

GSA – Silicon Leadership Summit

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

The 2022 Silicon Leadership Summit will be hosted as the first in-person live event since early 2020. The SLS is GSA’s technology and business conference, an unique platform that brings together executives across the expanded semiconductor ecosystem at the intersection of semiconductors, software, systems, solutions, and services for thought leadership, and collaborative dialogue, providing deep …

FSiC 2022 – Free Silicon Conference

Paris, France Paris, France

The 2022 Free Silicon Conference (FSiC) will take place in Paris (Sorbonne) on July 7,8,9 2022 (Thursday to Saturday). This event will build on top of the 2019 edition. The conference will connect experts and enthusiasts who want to build a complete Free and Open Source CAD ecosystem for designing analog and digital integrated circuits. The conference will …

Second IEEE International Workshop on SLM (Silicon Lifecycle Management)

Anaheim, CA Anaheim, CA, United States

HYBRID FORMAT SEPTEMBER 29-30, 2022 AIM OF THE WORKSHOP With increasing system complexity, security, stringent runtime requirements for functional safety, and cost constraints of a mass market, the reliable and secure operation of electronics in safety- critical, enterprise servers and cloud computing domains is still a major challenge. While traditionally design time and test time …

Webinar: Signal Integrity Issues for Silicon Interposers

Online

The development of applications like high-performance computing, Artificial Intelligence (AI) processors, and Central Processing Unit (CPU) and Graphical Processing Unit (GPU) chips involves advanced packaging technologies that radically alter traditional design methodologies and flows. Designers of high-speed components are called to co-simulate die, interposers, and package to sign off for their products' signal integrity (SI) …

Webinar: Thermal Integrity Challenges and Solutions of Silicon Interposer Design

Online

In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots, mechanical stresses induced by thermal issues, and methods for capturing these problems with simulation and virtual prototyping, with a focus on designs that utilize silicon interposers. …

ASP-DAC 2024

Songdo Convensia Songdo Convensia, Incheon, Korea, Republic of

29th Asia and South Pacific Design Automation Conference The ASP-DAC 2024 Organizing Committee has prepared a total of 4 Keynote Speeches for this year, and it has been decided to …