In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots, mechanical …
Continue reading "Webinar: Thermal Integrity Challenges and Solutions of Silicon Interposer Design"
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated …
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Build Trust in your Software Software is at the core of digital transformation, enabling you to create value for your customers in new, innovative ways. However, software introduces business risks that need to be managed proactively and at the same velocity as the software development itself. This places new demands on software security. Speed is …
Continue reading "Synopsys Software Integrity Group User Event 2023"
See the improvements to Ansys Icepak and Ansys Mechanical Thermal as part of the 2023 R2 update to Thermal Integrity for Electronics. Solver and meshing improvements are combined with integrations …
Continue reading "Ansys 2023 R2: Ansys Thermal Integrity What’s New"
Join us on March 7th to hear about the latest updates and newest features in Ansys Icepak and Ansys Mechanical Thermal. Some new capabilities include breakthroughs that will be of considerable use …
Continue reading "Ansys 2024 R1: Ansys Thermal Integrity What’s New"
