Date: April 19, 2022 at 8 a.m. PT Schedule: Welcome / Opening Remarks: Rob Mains, CHIPS Alliance Chisel/FIRRTL Ecosystem Updates: Jack Koenig, SiFive F4PGA Group Kickoff, Interchange Format: Karol Gugala, Antmicro Chiplet Protocol IP: David Kehlet, Intel NIST (Cryo Test Structures): Mehdi Saligane, UMICH NVMe FPGA IP for Edge Applications: Anand Kulkarni, Western Digital Update on Shuttle …
Technology has the potential to solve the world’s most difficult challenges. When you design semiconductors, you become the key to making that technology work. Chips provide the foundation and computing power for a wide range of emerging technologies – artificial intelligence (AI), the Internet of Things (IoT), 5G, healthcare devices, environmental solutions, and more. How …
SUNNYVALE, CA + VIRTUAL Join us in-person for our second biannual technology update featuring informative, technical talks on open source hardware collaborative development, hosted by Google and including speakers from Microsoft, Google, Intel, Antmicro, Efabless and others. CHIPS’ Thursday event follows the main RISC-V Summit days (Tuesday-Wednesday) to allow easy participation for open source hardware …
Date: Thursday, April 27, 2023 Time: 10:00am PT/1:00pm ET Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature dependent. In this webinar, we will look at an electrothermal …
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Chiplet-based SoC architectures have seen increased interest over the past three years, and recently were made a focus of the federal CHIPS and Science Act to reduce the cost of innovation for US-based semiconductor startups, DoD projects, and academic research. Chiplet-based architectures bring their own set of challenges however, especially in the context of IP …
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About 6GSymposium Fall 2023 Beyond The Hype The USA has signaled its intention to take a lead in 6G with provisions in, among others, the $280bn CHIPS and Science act. Canada is also investing heavily to play a major role. While some of the technology directions for 6G are becoming clearer, reaching those aspirations through …
Title: WEBINAR l System-Level Thermal Signoff from Chips Through to Racks Date: Wednesday, October 18, 2023 Time: 10:00 AM Eastern Daylight Time Duration: 45 minutes Summary Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive …
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3 November 2023 | San Diego, California We all know the CHIPS Act will have a profound impact on manufacturing in the U.S., but what about Chip Design & Packaging? The Designing Chips with CHIPS: West Coast Pre-Silicon Summit is a one-day semi summit that will bring together leading thinkers from chip design and packaging companies, along …
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The CHIPS Research and Development Office’s Chiplets Interfaces Technical Standards Workshop will be held as a hybrid in-person and virtual event from 8:30 a.m. to 5:30 p.m. Eastern Time December 12, 2023, and 8:30 am to 12:30 pm December 13, 2023. This event will bring together technical experts from industry, academia, standards setting organizations, and …
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Technical standards for digital twin capabilities in the semiconductor and microelectronics industry will be the subject of a December workshop sponsored by the CHIPS Research and Development Office. The workshop will be a hybrid in-person and virtual event from 8:30 a.m. to 5:30 p.m. Eastern Time December 14, 2023, and 8:30 am to 12:30 pm …
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Leveraging the CHIPS Act in the Silicon Heartland: Ohio Semiconductor Industry Initiatives SEMI has invited key stakeholders from Ohio to discuss state initiatives that can be leveraged in alignment with current and upcoming CHIPS Funding opportunities. Webinar participants will learn why Ohio is a premier location for semiconductor operations and what government initiatives are available …
The heterogeneous integration of chips/chiplets has added significant complexity to the IC package design process, further compressing schedules for many design teams. Design teams must work more efficiently to meet quality and performance goals while maintaining schedule milestones. One way to improve efficiency is to shift signal and power integrity (SI/PI) analysis to earlier in …
29th Asia and South Pacific Design Automation Conference The ASP-DAC 2024 Organizing Committee has prepared a total of 4 Keynote Speeches for this year, and it has been decided to integrate one of these Keynote Speeches with the Banquet. In order to provide a more enriching experience for a greater number of attendees, the Banquet will …
